TW374043B - Method and apparatus for polishing chamfers of semiconductor wafers - Google Patents

Method and apparatus for polishing chamfers of semiconductor wafers

Info

Publication number
TW374043B
TW374043B TW086110543A TW86110543A TW374043B TW 374043 B TW374043 B TW 374043B TW 086110543 A TW086110543 A TW 086110543A TW 86110543 A TW86110543 A TW 86110543A TW 374043 B TW374043 B TW 374043B
Authority
TW
Taiwan
Prior art keywords
chamfer
polishing
semiconductor wafers
chamfers
hand
Prior art date
Application number
TW086110543A
Other languages
Chinese (zh)
Inventor
Akira Kawaguchi
Shigeru Kimura
Akihito Yanoo
Masao Takada
Shoji Tsuruta
Original Assignee
Mitsubishi Materials Corp
Mitsubishi Material Silicon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP19909596A external-priority patent/JP3605233B2/en
Priority claimed from JP20748396A external-priority patent/JP3618476B2/en
Priority claimed from JP20748196A external-priority patent/JP3649531B2/en
Application filed by Mitsubishi Materials Corp, Mitsubishi Material Silicon filed Critical Mitsubishi Materials Corp
Application granted granted Critical
Publication of TW374043B publication Critical patent/TW374043B/en

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

The invention relates to a method for polishing chamfers built up on the semiconductor wafer, in which the said semiconductor wafer is rotating radially, on one hand, the polishing fluid is delivered to the chamfer, on the other hand, an abrasive cloth, being pressed onto the chamfer in the elastic deformed shape, slides along the exterior side of the chamfer toward to the center of the wafer such that the hemp portion of the abrasive cloth will polish the chamfer and exterior side.
TW086110543A 1996-07-29 1997-07-24 Method and apparatus for polishing chamfers of semiconductor wafers TW374043B (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP19909596A JP3605233B2 (en) 1996-07-29 1996-07-29 Method and apparatus for polishing chamfered surface of semiconductor wafer
JP20748396A JP3618476B2 (en) 1996-08-06 1996-08-06 Semiconductor wafer chamfered surface polishing equipment
JP20748296 1996-08-06
JP20748196A JP3649531B2 (en) 1996-08-06 1996-08-06 Semiconductor wafer chamfered surface polishing equipment
JP20748096 1996-08-06

Publications (1)

Publication Number Publication Date
TW374043B true TW374043B (en) 1999-11-11

Family

ID=57941766

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086110543A TW374043B (en) 1996-07-29 1997-07-24 Method and apparatus for polishing chamfers of semiconductor wafers

Country Status (1)

Country Link
TW (1) TW374043B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI569921B (en) * 2012-05-07 2017-02-11 Shin-Etsu Handotai Co Ltd Circular grinding device for circular plate workpiece
TWI608902B (en) * 2012-12-27 2017-12-21 ３Ｍ新設資產公司 Circular support plate, nonwoven fabric polishing roll, roll assembly, and polishing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI569921B (en) * 2012-05-07 2017-02-11 Shin-Etsu Handotai Co Ltd Circular grinding device for circular plate workpiece
TWI608902B (en) * 2012-12-27 2017-12-21 ３Ｍ新設資產公司 Circular support plate, nonwoven fabric polishing roll, roll assembly, and polishing method

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