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A kind of semiconductor laser structure and process, it can be used in any edge emitting semiconductor laser structure. The process comprises of the following steps, forming spine shape waveguide on a semiconductor laser poly-crystal chips, and then processing spin coating, covering insulation layer on spine shape waveguide. Following that, processing chemical mechanical polishing (CMP), polishing the insulation layer, let it to have an even surface, and exposing spinal top surface of the spinal waveguide. Then, on the insulation layer and the exposed spinal waveguide, forming P-type metal; and on a first type of conductive layer surface opposite to the substrate, forming N-type metal.
TW087103461A1998-03-101998-03-10Semiconductor laser structure and process
TW373360B
(en)