TW366515B - Method of cleaning wafers after planarization process - Google Patents

Method of cleaning wafers after planarization process

Info

Publication number
TW366515B
TW366515B TW084112198A TW84112198A TW366515B TW 366515 B TW366515 B TW 366515B TW 084112198 A TW084112198 A TW 084112198A TW 84112198 A TW84112198 A TW 84112198A TW 366515 B TW366515 B TW 366515B
Authority
TW
Taiwan
Prior art keywords
cleaning
wafers
planarization process
cleaning wafers
polishing
Prior art date
Application number
TW084112198A
Other languages
Chinese (zh)
Inventor
Jun-Yuan Wu
Yuan-Shan Jung
zhen-tang Lin
Mei-Sheng Fang
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to TW084112198A priority Critical patent/TW366515B/en
Application granted granted Critical
Publication of TW366515B publication Critical patent/TW366515B/en

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  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A method of cleaning wafers after planarization process for cleaning surface of wafers after CMP (chemical mechanical polishing) using chemical solutions (NH4H, HCl or H2O2) common in RCA cleaning steps for initial cleaning of wafers and with scrubbing, JET or megasonic for removal of the slurry, metal ions (sodium, potassium, etc.) and particles or powders generated in the polishing.
TW084112198A 1995-11-17 1995-11-17 Method of cleaning wafers after planarization process TW366515B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW084112198A TW366515B (en) 1995-11-17 1995-11-17 Method of cleaning wafers after planarization process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW084112198A TW366515B (en) 1995-11-17 1995-11-17 Method of cleaning wafers after planarization process

Publications (1)

Publication Number Publication Date
TW366515B true TW366515B (en) 1999-08-11

Family

ID=57941130

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084112198A TW366515B (en) 1995-11-17 1995-11-17 Method of cleaning wafers after planarization process

Country Status (1)

Country Link
TW (1) TW366515B (en)

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees