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Application filed by Kinpo Elect IncfiledCriticalKinpo Elect Inc
Priority to TW086111953ApriorityCriticalpatent/TW362339B/en
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Publication of TW362339BpublicationCriticalpatent/TW362339B/en
A kind of improved manufacturing method for dual-faced connection circuit board which is to print the paper-made XPC copper tinfoil made by compressed bakelite-dipped base material but expose the welding positions and the weld area around the welding. Employing the anti-erosion ink to print on the weld are and erase the uncovered anti-erosion ink and carbon by etching so as to form the wiring. The copper tinfoil can be produced with extremely low cost but high electrical properties.
TW086111953A1997-08-201997-08-20Improved manufacturing method for dual-faced conductive circuit board and the product thereof
TW362339B
(en)