TW362339B - Improved manufacturing method for dual-faced conductive circuit board and the product thereof - Google Patents

Improved manufacturing method for dual-faced conductive circuit board and the product thereof

Info

Publication number
TW362339B
TW362339B TW086111953A TW86111953A TW362339B TW 362339 B TW362339 B TW 362339B TW 086111953 A TW086111953 A TW 086111953A TW 86111953 A TW86111953 A TW 86111953A TW 362339 B TW362339 B TW 362339B
Authority
TW
Taiwan
Prior art keywords
dual
circuit board
improved manufacturing
product
conductive circuit
Prior art date
Application number
TW086111953A
Other languages
Chinese (zh)
Inventor
pei-zhi Chen
Original Assignee
Kinpo Elect Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kinpo Elect Inc filed Critical Kinpo Elect Inc
Priority to TW086111953A priority Critical patent/TW362339B/en
Application granted granted Critical
Publication of TW362339B publication Critical patent/TW362339B/en

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  • Manufacturing Of Printed Wiring (AREA)

Abstract

A kind of improved manufacturing method for dual-faced connection circuit board which is to print the paper-made XPC copper tinfoil made by compressed bakelite-dipped base material but expose the welding positions and the weld area around the welding. Employing the anti-erosion ink to print on the weld are and erase the uncovered anti-erosion ink and carbon by etching so as to form the wiring. The copper tinfoil can be produced with extremely low cost but high electrical properties.
TW086111953A 1997-08-20 1997-08-20 Improved manufacturing method for dual-faced conductive circuit board and the product thereof TW362339B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW086111953A TW362339B (en) 1997-08-20 1997-08-20 Improved manufacturing method for dual-faced conductive circuit board and the product thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW086111953A TW362339B (en) 1997-08-20 1997-08-20 Improved manufacturing method for dual-faced conductive circuit board and the product thereof

Publications (1)

Publication Number Publication Date
TW362339B true TW362339B (en) 1999-06-21

Family

ID=57940822

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086111953A TW362339B (en) 1997-08-20 1997-08-20 Improved manufacturing method for dual-faced conductive circuit board and the product thereof

Country Status (1)

Country Link
TW (1) TW362339B (en)

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