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Application filed by Vanguard Int Semiconduct CorpfiledCriticalVanguard Int Semiconduct Corp
Priority to TW086113444ApriorityCriticalpatent/TW360965B/en
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Publication of TW360965BpublicationCriticalpatent/TW360965B/en
Printing Elements For Providing Electric Connections Between Printed Circuits
(AREA)
Abstract
Voids in via holes in integrated circuits have been effectively removed by heating the vias to a relatively low temperature and then subjecting the entire structure (including the vias) to artificial gravitational forces. Said forces may be steadily applied, as in centrifuging, or they may be applied intermittently by using a jerking motion which is repeated several times. A number of different ways for implementing such jerking motion are described. These include magnetic repulsion, vertical pulling by a motor, and providing a pressure differential between the top and bottom sides of the integrated circuit holder.
TW086113444A1997-09-171997-09-17Metallization process using artificial gravity
TW360965B
(en)
Thermoelectric cooling vessel particularly for cooling rotors of centrifuges, heat dissipating element for extracting heat from thermoelectric device and method for forming the heat dissipating element
Device for mutual electrical contact between electrical and/or electromechanical assemblies as well as method for electrical contact between such assemblies and an apparatus built according to this method