TW360931B - Method for increasing the reliability of a chip underfill process - Google Patents
Method for increasing the reliability of a chip underfill processInfo
- Publication number
- TW360931B TW360931B TW086115174A TW86115174A TW360931B TW 360931 B TW360931 B TW 360931B TW 086115174 A TW086115174 A TW 086115174A TW 86115174 A TW86115174 A TW 86115174A TW 360931 B TW360931 B TW 360931B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- hole
- chip
- reliability
- increasing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Wire Bonding (AREA)
Abstract
A through hole is formed on a first surface of a substrate. A second surface of the substrate has a chip bonding region. The through hole is aligned and located at an arbitrary location in the chip bonding region. Through an appropriate thermal pressing process, the chip is bonded to a chip bonding region on the second surface of the substrate. Then, the substrate is turned upside-down so that the through hole on the substrate faces upwards. The through hole on the first surface of the substrate is filled with a liquid adhesive so that the liquid adhesive flows through the through hole from the first surface to the second surface of the substrate and fills up the gap between the chip and the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW086115174A TW360931B (en) | 1997-10-15 | 1997-10-15 | Method for increasing the reliability of a chip underfill process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW086115174A TW360931B (en) | 1997-10-15 | 1997-10-15 | Method for increasing the reliability of a chip underfill process |
Publications (1)
Publication Number | Publication Date |
---|---|
TW360931B true TW360931B (en) | 1999-06-11 |
Family
ID=57940720
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086115174A TW360931B (en) | 1997-10-15 | 1997-10-15 | Method for increasing the reliability of a chip underfill process |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW360931B (en) |
-
1997
- 1997-10-15 TW TW086115174A patent/TW360931B/en active
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