TW360931B - Method for increasing the reliability of a chip underfill process - Google Patents

Method for increasing the reliability of a chip underfill process

Info

Publication number
TW360931B
TW360931B TW086115174A TW86115174A TW360931B TW 360931 B TW360931 B TW 360931B TW 086115174 A TW086115174 A TW 086115174A TW 86115174 A TW86115174 A TW 86115174A TW 360931 B TW360931 B TW 360931B
Authority
TW
Taiwan
Prior art keywords
substrate
hole
chip
reliability
increasing
Prior art date
Application number
TW086115174A
Other languages
Chinese (zh)
Inventor
Chung-Ren Ma
wen-quan Lin
Jin-Chuan Bai
Original Assignee
Apack Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apack Technologies Inc filed Critical Apack Technologies Inc
Priority to TW086115174A priority Critical patent/TW360931B/en
Application granted granted Critical
Publication of TW360931B publication Critical patent/TW360931B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Wire Bonding (AREA)

Abstract

A through hole is formed on a first surface of a substrate. A second surface of the substrate has a chip bonding region. The through hole is aligned and located at an arbitrary location in the chip bonding region. Through an appropriate thermal pressing process, the chip is bonded to a chip bonding region on the second surface of the substrate. Then, the substrate is turned upside-down so that the through hole on the substrate faces upwards. The through hole on the first surface of the substrate is filled with a liquid adhesive so that the liquid adhesive flows through the through hole from the first surface to the second surface of the substrate and fills up the gap between the chip and the substrate.
TW086115174A 1997-10-15 1997-10-15 Method for increasing the reliability of a chip underfill process TW360931B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW086115174A TW360931B (en) 1997-10-15 1997-10-15 Method for increasing the reliability of a chip underfill process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW086115174A TW360931B (en) 1997-10-15 1997-10-15 Method for increasing the reliability of a chip underfill process

Publications (1)

Publication Number Publication Date
TW360931B true TW360931B (en) 1999-06-11

Family

ID=57940720

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086115174A TW360931B (en) 1997-10-15 1997-10-15 Method for increasing the reliability of a chip underfill process

Country Status (1)

Country Link
TW (1) TW360931B (en)

Similar Documents

Publication Publication Date Title
US6445074B1 (en) Electronic component mounted on a flat substrate and padded with a fluid filler
WO2002045152A3 (en) Flip chip mounting technique
TW375651B (en) Silicone pressure sensitive conductive adhesive for flip chip
MY131396A (en) Semiconductor device with bumps
EP0878840A4 (en) Connecting structure of semiconductor element, liquid crystal display device using the structure, and electronic equipment using the display device
TW349233B (en) Pre-bond cavity air bridge
KR970066683A (en) Liquid crystal device, manufacturing method and electronic device of liquid crystal device
TW360964B (en) Process for flip-chip mounting
JPH11145336A (en) Method and structure for mounting of electronic component with bump
US5169056A (en) Connecting of semiconductor chips to circuit substrates
KR20000068591A (en) Method for making a glued joint between an electronic component and a supporting substrate
TW360931B (en) Method for increasing the reliability of a chip underfill process
SE9900622L (en) Procedure for joining a lower substrate to an upper substrate by adhesive
TW327247B (en) Ball grid array having no through holes or via interconnections
EP0880170A3 (en) Mounting method of semiconductor device
AU5410300A (en) Device and method for making devices comprising at least a chip fixed on a support
EP1043767A4 (en) Semiconductor device, method of manufacture thereof, circuit board and electronic device
JPH09115954A (en) Flip chip packaging method
JP4421118B2 (en) Semiconductor device manufacturing method
JPH1022338A (en) Flip chip bonding
JPH0629334A (en) Mounting method for semiconductor device
JPH0371030A (en) Bonding method for pressure sensor chip
WO2005062998A8 (en) Metal interconnect system and method for direct die attachment
EP1291909A3 (en) Semiconductor device and method of making the same
JPH06104311A (en) Flip chip and its sealing method