TW359885B - Method for producing wafer marking while avoiding the formation of debris - Google Patents
Method for producing wafer marking while avoiding the formation of debrisInfo
- Publication number
- TW359885B TW359885B TW087100029A TW87100029A TW359885B TW 359885 B TW359885 B TW 359885B TW 087100029 A TW087100029 A TW 087100029A TW 87100029 A TW87100029 A TW 87100029A TW 359885 B TW359885 B TW 359885B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- marking
- laser beam
- debris
- tape
- Prior art date
Links
Landscapes
- Weting (AREA)
Abstract
In a typical semiconductor IC production process, a laser beam is used to inscribe a specific marking on the wafer for the identification of the batch information of the product. However, the debris generated by the direct bombardment of the high energy laser beam on the surface of the wafer is liable to form a source of contamination and affects the yield of the product. Therefor, in order to rectify the above defect, the present invention proposes an improved process for producing the semiconductor wafer marking, which comprises: defining a marking pattern on a glue tape by a laser beam, adhering the glue tape on the surface of the wafer, transferring the marking pattern on the tape to a wafer by a dry or wet process, and peeling off the tape thereby completing the production of the wafer marking. The invented method replaces the laser beam with an etching process thereby avoiding the formation of the debris on the wafer, reducing the source of contamination and increasing the yield of product.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW087100029A TW359885B (en) | 1998-01-02 | 1998-01-02 | Method for producing wafer marking while avoiding the formation of debris |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW087100029A TW359885B (en) | 1998-01-02 | 1998-01-02 | Method for producing wafer marking while avoiding the formation of debris |
Publications (1)
Publication Number | Publication Date |
---|---|
TW359885B true TW359885B (en) | 1999-06-01 |
Family
ID=57940636
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW087100029A TW359885B (en) | 1998-01-02 | 1998-01-02 | Method for producing wafer marking while avoiding the formation of debris |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW359885B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202010004567U1 (en) | 2010-04-06 | 2010-07-22 | Lightspeed International Co. | Multifunction Webcam |
US8557715B2 (en) | 2006-07-07 | 2013-10-15 | National Cheng Kung University | Marking CO2 laser-transparent materials by using absorption-material-assisted laser processing |
-
1998
- 1998-01-02 TW TW087100029A patent/TW359885B/en not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8557715B2 (en) | 2006-07-07 | 2013-10-15 | National Cheng Kung University | Marking CO2 laser-transparent materials by using absorption-material-assisted laser processing |
US8703410B2 (en) | 2006-07-07 | 2014-04-22 | National Cheng Kung University | Substrate having a mark formed on a surface thereof by a CO2 laser beam |
DE202010004567U1 (en) | 2010-04-06 | 2010-07-22 | Lightspeed International Co. | Multifunction Webcam |
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Legal Events
Date | Code | Title | Description |
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MK4A | Expiration of patent term of an invention patent |