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Priority to TW085109841ApriorityCriticalpatent/TW359063B/en
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Shielding Devices Or Components To Electric Or Magnetic Fields
(AREA)
Abstract
A package method by means of grouting adhesive metal for isolation of magnetic interference, including the following steps: step (1): connection of the necessary elements (IC, glowing diode, a plurality of pins) onto the substrate by means of conductive raw material; step (2): stuffing glues in the metal mask step (3): housing the substrate with connected necessary elements into the metal mask; step (4): drying the glue in the metal mask.
TW085109841A1996-08-131996-08-13Package method by means of grouting adhesive metal for isolation of magnetic interference
TW359063B
(en)
Method for attaching lead parts and shield case to print substrate, and method for attaching chip parts, lead parts and shield case to print cubstrate.