Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg Co LtdfiledCriticalTaiwan Semiconductor Mfg Co Ltd
Priority to TW086111505ApriorityCriticalpatent/TW358984B/en
Application grantedgrantedCritical
Publication of TW358984BpublicationCriticalpatent/TW358984B/en
A method of removal of polymer from chips, by first forming a protective layer on a chip, having the protective layer a plurality of polymer impurities, with the following steps: dry etching, with agent including nitrogen fluoride; and removal by dry etching, for removal of the polymer impurities.
TW086111505A1997-08-121997-08-12Method of removal of polymer from chips
TW358984B
(en)
Method of manufacturing cooling devices made up of several metal shaped-section elements for mounting on semiconductor components, shaped-section elements for use in the manufacture of such cooling devices and cooling devices manufactured by the method