TW357449B - Electro-Static Discharge (ESD) protective circuit - Google Patents
Electro-Static Discharge (ESD) protective circuitInfo
- Publication number
- TW357449B TW357449B TW085101294A TW85101294A TW357449B TW 357449 B TW357449 B TW 357449B TW 085101294 A TW085101294 A TW 085101294A TW 85101294 A TW85101294 A TW 85101294A TW 357449 B TW357449 B TW 357449B
- Authority
- TW
- Taiwan
- Prior art keywords
- nod
- grounding
- level
- transistor
- resistor
- Prior art date
Links
Landscapes
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
A sort of MOS ESD protective circuit, for protection of a semiconductor from being damaged by ESD, being this ESD protective cirucit formed on a semiconductive substrate having silicon doped, including: a input wire, a output wire, a first nod, a second nod and a third nod, as well as the grounding wiring, both the first and the second impedance with a proximate end and a remote end, the first nod being connected to the proximate end of the input wire and the proximate end connected to the first resistor, the second nod being connected to the proximate end of the second resistor and the remote end of the first resistor, the third nod being connected to the remote end of the second resistor and the output wiring, including the first level a first MOSFET transistor and a grounding formed in the substrate, having the first MOS transistor a source/drain circuit being connected to between the first nod and the grounding, having the MOS transistor a control gate connected to the grounding, including the second level a serial MOSFET transistor in serial and the last transistor having a second level output, including the third level a third MOSFET device, having a control gate connected to the second level outupt and a source electrode and drain electrode connected to the wiring between the third nod and the grounding, thus for consumption of the power of a multi energy of the transistor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW085101294A TW357449B (en) | 1996-02-02 | 1996-02-02 | Electro-Static Discharge (ESD) protective circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW085101294A TW357449B (en) | 1996-02-02 | 1996-02-02 | Electro-Static Discharge (ESD) protective circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
TW357449B true TW357449B (en) | 1999-05-01 |
Family
ID=57940448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW085101294A TW357449B (en) | 1996-02-02 | 1996-02-02 | Electro-Static Discharge (ESD) protective circuit |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW357449B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7892965B2 (en) | 2000-10-18 | 2011-02-22 | Megica Corporation | Post passivation interconnection schemes on top of IC chip |
-
1996
- 1996-02-02 TW TW085101294A patent/TW357449B/en not_active IP Right Cessation
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7892965B2 (en) | 2000-10-18 | 2011-02-22 | Megica Corporation | Post passivation interconnection schemes on top of IC chip |
US7902067B2 (en) | 2000-10-18 | 2011-03-08 | Megica Corporation | Post passivation interconnection schemes on top of the IC chips |
US7915161B2 (en) | 2000-10-18 | 2011-03-29 | Megica Corporation | Post passivation interconnection schemes on top of IC chip |
US7919865B2 (en) | 2000-10-18 | 2011-04-05 | Megica Corporation | Post passivation interconnection schemes on top of IC chip |
US7923366B2 (en) | 2000-10-18 | 2011-04-12 | Megica Corporation | Post passivation interconnection schemes on top of IC chip |
US8004088B2 (en) | 2000-10-18 | 2011-08-23 | Megica Corporation | Post passivation interconnection schemes on top of IC chip |
US8188603B2 (en) | 2000-10-18 | 2012-05-29 | Megica Corporation | Post passivation interconnection schemes on top of IC chip |
US8435883B2 (en) | 2000-10-18 | 2013-05-07 | Megica Corporation | Post passivation interconnection schemes on top of IC chips |
US8461686B2 (en) | 2000-10-18 | 2013-06-11 | Megica Corporation | Post passivation interconnection schemes on top of IC chip |
US8492900B2 (en) | 2000-10-18 | 2013-07-23 | Megica Corporation | Post passivation interconnection schemes on top of IC chip |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |