TW357419B - Method of forming ball grid array contacts - Google Patents

Method of forming ball grid array contacts

Info

Publication number
TW357419B
TW357419B TW086117619A TW86117619A TW357419B TW 357419 B TW357419 B TW 357419B TW 086117619 A TW086117619 A TW 086117619A TW 86117619 A TW86117619 A TW 86117619A TW 357419 B TW357419 B TW 357419B
Authority
TW
Taiwan
Prior art keywords
forming
ball grid
welded plate
grid array
contact area
Prior art date
Application number
TW086117619A
Other languages
Chinese (zh)
Inventor
Joseph S Antao
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of TW357419B publication Critical patent/TW357419B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

A method of forming ball grid array contacts for semiconductor devices, including the following steps: forming a plate, having welded elements protruding from at least one side of the welded plate; placing the welded plate in a semiconductor package, forming ball grid for electric contact onto the contact area; making the welded plate at every contact area be aligned with a welding element; and heating the package and the welded plate, for guiding the welding element split on the welded plate and flow back, making the surface tension of the back flow welding material of each solder element for forming a solder ball over a contact area.
TW086117619A 1996-11-27 1997-11-25 Method of forming ball grid array contacts TW357419B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US3231096P 1996-11-27 1996-11-27

Publications (1)

Publication Number Publication Date
TW357419B true TW357419B (en) 1999-05-01

Family

ID=21864248

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086117619A TW357419B (en) 1996-11-27 1997-11-25 Method of forming ball grid array contacts

Country Status (2)

Country Link
JP (1) JPH10163373A (en)
TW (1) TW357419B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111843276A (en) * 2020-06-29 2020-10-30 上海邑和汽车科技有限公司 Paste-free brazing process and combined solder

Also Published As

Publication number Publication date
JPH10163373A (en) 1998-06-19

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees