TW356478B - ABS resin formed structure with excellent impact resistance after coating - Google Patents
ABS resin formed structure with excellent impact resistance after coatingInfo
- Publication number
- TW356478B TW356478B TW087105648A TW87105648A TW356478B TW 356478 B TW356478 B TW 356478B TW 087105648 A TW087105648 A TW 087105648A TW 87105648 A TW87105648 A TW 87105648A TW 356478 B TW356478 B TW 356478B
- Authority
- TW
- Taiwan
- Prior art keywords
- weight
- rubber polymer
- particles
- component
- parts
- Prior art date
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
A kind of resin formed structure comprised of molten mixture of components (A) and (B) and having 19 ~ 25wt% rubberized dispersed particles converted by rubber polymer, the total weight of components (A) and (B) being 100 parts by weight, in which component (A) being 25~ 60 wt%, while component (B) being 75 ~ 40wt%; component (A) being made by the following procedures: polymerizing 100 parts by weight monomer mixture consisting of (1) 64~8 parts by weight aromatic vinyl monomer, (2) 36 ~ 12 parts by weight cyanated vinyl monomer, and 0 ~ 75 parts by weight phenylmaleic imide, and (4) 0 ~ 50 copolymerized monomers, to produce hardended polymer having weight average molecular weight of 90,000 ~ 160,000; component (B) being rubber polymer having "enveloped" rubber polymer particles and "un-evenloped" rubber polymer particles made by the following procedures: graft polymerizing rubber polymer comprised of (1) 0 ~ 100 wt% butadiene, (2) 0 ~ 40 wt% butyl acrylate, (3) 0 ~ 40wt% copolymerizable monoethyelen compound, and 0~5 wt% polymerizable polyethylene compound (the aforesaid wt% are based on the total weight (1) +(2)+(3)+(4)), with aromatic ethyelen monomer and cyanated ethylene monomer; and component (B) must meet the following conditions: (a) the weight of rubber polymer is 5 ~ 85 wt%, and the weight ratio of aromatic ethylene monomer and cyanated ethylene monomer is 64:36 ~ 80:20; (b) rubber polymer particles not having "enveloped" structure include: (b-1) small particles with size not more than 0.2<mu>m weigh 25 ~ 45wt% relative to the total weight of rubber polymer, and (b-2) medium-sized particles with size between 0.2<mu>m ~ 0.8<mu>m weight 35 ~ 55wt% relative to the total weight of rubber polymer; (c) rubber polymer particles having "enveloped" structure include: (c-1) particles with size above 0.8<mu>m weigh 5 ~ 35wt% relative to the total weight of rubber polymer, and (d) particle content ratio, if converted by rubber polymer, is (b-1)/(b-2) is in the range of 0.6 ~ 0.8, and[ (b-1) + (b-2)] / (c) is in the range of 2.5 ~ 20.0.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10935397A JPH10298371A (en) | 1997-04-25 | 1997-04-25 | Abs resin molded product excellent in impact strength after coating |
Publications (1)
Publication Number | Publication Date |
---|---|
TW356478B true TW356478B (en) | 1999-04-21 |
Family
ID=14508081
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW087105648A TW356478B (en) | 1997-04-25 | 1998-04-27 | ABS resin formed structure with excellent impact resistance after coating |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH10298371A (en) |
TW (1) | TW356478B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101101092B1 (en) * | 2008-08-22 | 2011-12-30 | 주식회사 엘지화학 | A mehtod for preparing graft copolymer for impact strength modifiers, an impact strength modifiers, and methacryl resin composition containing the same |
JP5998299B1 (en) * | 2016-03-10 | 2016-09-28 | ユーエムジー・エービーエス株式会社 | Thermoplastic resin composition and resin molded product |
-
1997
- 1997-04-25 JP JP10935397A patent/JPH10298371A/en active Pending
-
1998
- 1998-04-27 TW TW087105648A patent/TW356478B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH10298371A (en) | 1998-11-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |