TW356478B - ABS resin formed structure with excellent impact resistance after coating - Google Patents

ABS resin formed structure with excellent impact resistance after coating

Info

Publication number
TW356478B
TW356478B TW087105648A TW87105648A TW356478B TW 356478 B TW356478 B TW 356478B TW 087105648 A TW087105648 A TW 087105648A TW 87105648 A TW87105648 A TW 87105648A TW 356478 B TW356478 B TW 356478B
Authority
TW
Taiwan
Prior art keywords
weight
rubber polymer
particles
component
parts
Prior art date
Application number
TW087105648A
Other languages
Chinese (zh)
Inventor
Chin-Liang Wang
Tong-Bi Shiue
Ming-Jou Kuo
Tian-Ming Kao
Koichi Ueno
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of TW356478B publication Critical patent/TW356478B/en

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

A kind of resin formed structure comprised of molten mixture of components (A) and (B) and having 19 ~ 25wt% rubberized dispersed particles converted by rubber polymer, the total weight of components (A) and (B) being 100 parts by weight, in which component (A) being 25~ 60 wt%, while component (B) being 75 ~ 40wt%; component (A) being made by the following procedures: polymerizing 100 parts by weight monomer mixture consisting of (1) 64~8 parts by weight aromatic vinyl monomer, (2) 36 ~ 12 parts by weight cyanated vinyl monomer, and 0 ~ 75 parts by weight phenylmaleic imide, and (4) 0 ~ 50 copolymerized monomers, to produce hardended polymer having weight average molecular weight of 90,000 ~ 160,000; component (B) being rubber polymer having "enveloped" rubber polymer particles and "un-evenloped" rubber polymer particles made by the following procedures: graft polymerizing rubber polymer comprised of (1) 0 ~ 100 wt% butadiene, (2) 0 ~ 40 wt% butyl acrylate, (3) 0 ~ 40wt% copolymerizable monoethyelen compound, and 0~5 wt% polymerizable polyethylene compound (the aforesaid wt% are based on the total weight (1) +(2)+(3)+(4)), with aromatic ethyelen monomer and cyanated ethylene monomer; and component (B) must meet the following conditions: (a) the weight of rubber polymer is 5 ~ 85 wt%, and the weight ratio of aromatic ethylene monomer and cyanated ethylene monomer is 64:36 ~ 80:20; (b) rubber polymer particles not having "enveloped" structure include: (b-1) small particles with size not more than 0.2<mu>m weigh 25 ~ 45wt% relative to the total weight of rubber polymer, and (b-2) medium-sized particles with size between 0.2<mu>m ~ 0.8<mu>m weight 35 ~ 55wt% relative to the total weight of rubber polymer; (c) rubber polymer particles having "enveloped" structure include: (c-1) particles with size above 0.8<mu>m weigh 5 ~ 35wt% relative to the total weight of rubber polymer, and (d) particle content ratio, if converted by rubber polymer, is (b-1)/(b-2) is in the range of 0.6 ~ 0.8, and[ (b-1) + (b-2)] / (c) is in the range of 2.5 ~ 20.0.
TW087105648A 1997-04-25 1998-04-27 ABS resin formed structure with excellent impact resistance after coating TW356478B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10935397A JPH10298371A (en) 1997-04-25 1997-04-25 Abs resin molded product excellent in impact strength after coating

Publications (1)

Publication Number Publication Date
TW356478B true TW356478B (en) 1999-04-21

Family

ID=14508081

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087105648A TW356478B (en) 1997-04-25 1998-04-27 ABS resin formed structure with excellent impact resistance after coating

Country Status (2)

Country Link
JP (1) JPH10298371A (en)
TW (1) TW356478B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101101092B1 (en) * 2008-08-22 2011-12-30 주식회사 엘지화학 A mehtod for preparing graft copolymer for impact strength modifiers, an impact strength modifiers, and methacryl resin composition containing the same
JP5998299B1 (en) * 2016-03-10 2016-09-28 ユーエムジー・エービーエス株式会社 Thermoplastic resin composition and resin molded product

Also Published As

Publication number Publication date
JPH10298371A (en) 1998-11-10

Similar Documents

Publication Publication Date Title
KR960014239A (en) Resin composition for laser marking
KR910018481A (en) Molding compositions of aromatic polycarbonate resins, ABS polymers and SAN copolymers with a matt surface appearance
ATE21412T1 (en) RESIN COMPOSITION.
EP0688798A4 (en)
KR910018467A (en) Thermoplastic Molding Material
EP1245598A3 (en) Rubber-reinforced thermoplastic resin and rubber-reinforced thermoplastic resin composition
KR860007639A (en) Rubber dispersion copolymer resin
EP1375590A3 (en) Laser-marking thermoplastic resin composition
CA2334998A1 (en) Thermoplastic molding compositions having improved plateability
CA2085917A1 (en) A process for preparing thermoplastic resin composition with excellent hcfc resistance
EP0354330A3 (en) Weather resistant impact modifiers for thermoplastic resins and blends containing the same
EP0549205A3 (en) Low-gloss thermoplastic resin compositions
EP0354034A3 (en) Resin composition
KR890700149A (en) Heat resistant impact resistant resin composition
EP0402528A3 (en) Impact resistant thermoplastic resin composition
TW356478B (en) ABS resin formed structure with excellent impact resistance after coating
MY120860A (en) Impact modifier for vinyl chloride resin.
CA2110285A1 (en) Glass fiber-reinforced thermoplastic resin composition
CA2033056A1 (en) Thermoplastic resin composition
EP0390081A3 (en) Thermoplastic resin composition
JPS6479257A (en) Thermoplastic resin composition
AU599209B2 (en) Polycarbonate resin composition
ES8302050A1 (en) Polymer composition.
JPS56147841A (en) Thermoplastic resin composition
EP0892015A4 (en) Vinyl chloride resin composition

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees