TW355855B - Socket for inspection of semiconductor device - Google Patents

Socket for inspection of semiconductor device

Info

Publication number
TW355855B
TW355855B TW086118840A TW86118840A TW355855B TW 355855 B TW355855 B TW 355855B TW 086118840 A TW086118840 A TW 086118840A TW 86118840 A TW86118840 A TW 86118840A TW 355855 B TW355855 B TW 355855B
Authority
TW
Taiwan
Prior art keywords
circuit board
socket
semiconductor device
mounting seat
socket body
Prior art date
Application number
TW086118840A
Other languages
Chinese (zh)
Inventor
Kouichi Yamazaki
Hiroto Komatsu
Original Assignee
Shinetsu Polymer Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP18995596A external-priority patent/JP3233195B2/en
Application filed by Shinetsu Polymer Co filed Critical Shinetsu Polymer Co
Application granted granted Critical
Publication of TW355855B publication Critical patent/TW355855B/en

Links

Landscapes

  • Connecting Device With Holders (AREA)

Abstract

A socket for inspection of semiconductor devices having laterally extended leads by mounting the device in the mounting seat of the socket body, by means of which the productivity of the inspection process can be greatly improved; the socket comprises: (a) a socket body mountable on the circuit board by positioning having a mounting seat for the body of the semiconductor device in a freely demountable fashion; (b) a lead frame intervening between the socket body and the circuit board having resilient contacting shoes extended out of the surface facing the circuit board in the mounting seat of the socket body, the contacting shoes being brought into contact, when the semiconductor device is mounted on the mounting seat, with the leads of the semiconductor device; and (c) an anisotropically electroconductive elastic connector sheet interposed between the lead frame and the circuit board to be in contact with the electrode terminals of the circuit board on one surface and with the contacting points of the contacting shoes of the lead frame on the other surface.
TW086118840A 1996-07-02 1997-12-13 Socket for inspection of semiconductor device TW355855B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18995596A JP3233195B2 (en) 1996-07-02 1996-07-02 Semiconductor element inspection socket

Publications (1)

Publication Number Publication Date
TW355855B true TW355855B (en) 1999-04-11

Family

ID=57940308

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086118840A TW355855B (en) 1996-07-02 1997-12-13 Socket for inspection of semiconductor device

Country Status (1)

Country Link
TW (1) TW355855B (en)

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees