TW353260B - Composite micro-bump structure and process for producing the same and the bonding application thereof - Google Patents

Composite micro-bump structure and process for producing the same and the bonding application thereof

Info

Publication number
TW353260B
TW353260B TW083106559A TW83106559A TW353260B TW 353260 B TW353260 B TW 353260B TW 083106559 A TW083106559 A TW 083106559A TW 83106559 A TW83106559 A TW 83106559A TW 353260 B TW353260 B TW 353260B
Authority
TW
Taiwan
Prior art keywords
producing
same
bump structure
composite micro
input
Prior art date
Application number
TW083106559A
Other languages
Chinese (zh)
Inventor
Shr-Ming Jang
Juo-Huei Jou
Yu-Chi Li
Di-Chiun Hu
Shiou-Mei You
Li-Huei Yang
Jr-Chiang Ju
Original Assignee
Ind Technology Res Er Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Technology Res Er Inst filed Critical Ind Technology Res Er Inst
Priority to TW083106559A priority Critical patent/TW353260B/en
Application granted granted Critical
Publication of TW353260B publication Critical patent/TW353260B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Abstract

A bonding structure comprising: an integrated circuit element having input/output pads; a substrate having input/output pads; a plurality of physical and electrical interconnects located between the input/output pads of the integrated circuit element and the substrate, in which each of the interconnects comprises a micro-bump which is deformable during bonding and consisting of a polymeric body and an electrically conductive metallic film covered thereon.
TW083106559A 1994-07-15 1994-07-15 Composite micro-bump structure and process for producing the same and the bonding application thereof TW353260B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW083106559A TW353260B (en) 1994-07-15 1994-07-15 Composite micro-bump structure and process for producing the same and the bonding application thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW083106559A TW353260B (en) 1994-07-15 1994-07-15 Composite micro-bump structure and process for producing the same and the bonding application thereof

Publications (1)

Publication Number Publication Date
TW353260B true TW353260B (en) 1999-02-21

Family

ID=57940125

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083106559A TW353260B (en) 1994-07-15 1994-07-15 Composite micro-bump structure and process for producing the same and the bonding application thereof

Country Status (1)

Country Link
TW (1) TW353260B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7919412B2 (en) 2004-07-16 2011-04-05 Megica Corporation Over-passivation process of forming polymer layer over IC chip

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7919412B2 (en) 2004-07-16 2011-04-05 Megica Corporation Over-passivation process of forming polymer layer over IC chip

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees