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Priority claimed from KR1019940039002Aexternal-prioritypatent/KR0144936B1/en
Priority claimed from KR1019950001778Aexternal-prioritypatent/KR0175001B1/en
Application filed by Samsung Electronics Co LtdfiledCriticalSamsung Electronics Co Ltd
Application grantedgrantedCritical
Publication of TW353197BpublicationCriticalpatent/TW353197B/en
Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure
(AREA)
Exposure And Positioning Against Photoresist Photosensitive Materials
(AREA)
Abstract
A method of forming a pattern using a chemically amplified resist, which comprises the following steps: applying a surface treating for enhancing adhesion of the material layer formed between a coated resist and the substrate; applying a high temperature bake process on the surface-treated substrate; and coating a resist on the baked structure.
TW084114059A1994-12-291995-12-28Method for forming fine pattern using chemically amplified resist
TW353197B
(en)
Aqueous coating composition, katalyst for such aqueous coating composition, method of obtaining such catalyst and method of coating surface of a product with a polymer and method of coating metallic substrate with a polymer
Coated substrate with metallic surface impression, method for adhesively coatingsubstrates with corrosive optical layers and use of said coated substrate and p roducts obtained from a method for adhesively coating with corrosive optical layers