TW350983B - Wafer edge deposition elimination - Google Patents

Wafer edge deposition elimination

Info

Publication number
TW350983B
TW350983B TW086114900A TW86114900A TW350983B TW 350983 B TW350983 B TW 350983B TW 086114900 A TW086114900 A TW 086114900A TW 86114900 A TW86114900 A TW 86114900A TW 350983 B TW350983 B TW 350983B
Authority
TW
Taiwan
Prior art keywords
alignment
shade
substrate
wafer edge
edge deposition
Prior art date
Application number
TW086114900A
Other languages
Chinese (zh)
Inventor
Ai-Hua Chen
Karl A Littau
Da-Shun S Zhou
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/729,210 external-priority patent/US6033480A/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of TW350983B publication Critical patent/TW350983B/en

Links

Landscapes

  • Chemical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A sort of wafer edge deposition elimination, including at least: (a) using a pair of alignment objects to support the substrate alignment; (b) provision of a shade screen for physical obstruction of manufacture fluid in vertical direction to a part of the substrate; (c) use of the alignment substance for alignment of the screen shade to the substrate support; and (d) introduction of flush fluid between the shade of the substrate and the screen shade.
TW086114900A 1996-10-15 1997-10-09 Wafer edge deposition elimination TW350983B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/729,210 US6033480A (en) 1994-02-23 1996-10-15 Wafer edge deposition elimination

Publications (1)

Publication Number Publication Date
TW350983B true TW350983B (en) 1999-01-21

Family

ID=24930042

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086114900A TW350983B (en) 1996-10-15 1997-10-09 Wafer edge deposition elimination

Country Status (2)

Country Link
JP (1) JPH10214798A (en)
TW (1) TW350983B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111364022A (en) * 2020-03-10 2020-07-03 北京北方华创微电子装备有限公司 Reaction chamber

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6159299A (en) * 1999-02-09 2000-12-12 Applied Materials, Inc. Wafer pedestal with a purge ring
US6589352B1 (en) * 1999-12-10 2003-07-08 Applied Materials, Inc. Self aligning non contact shadow ring process kit
US20050196971A1 (en) * 2004-03-05 2005-09-08 Applied Materials, Inc. Hardware development to reduce bevel deposition
JP2010150605A (en) * 2008-12-25 2010-07-08 Sharp Corp Mocvd system and film deposition system using the same
JP5650935B2 (en) * 2009-08-07 2015-01-07 東京エレクトロン株式会社 Substrate processing apparatus, positioning method, and focus ring arrangement method
JP5992334B2 (en) * 2009-12-31 2016-09-14 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Shadow ring to correct wafer edge and bevel deposition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111364022A (en) * 2020-03-10 2020-07-03 北京北方华创微电子装备有限公司 Reaction chamber
WO2021179886A1 (en) * 2020-03-10 2021-09-16 北京北方华创微电子装备有限公司 Reaction chamber

Also Published As

Publication number Publication date
JPH10214798A (en) 1998-08-11

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Legal Events

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