Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics CorpfiledCriticalUnited Microelectronics Corp
Priority to TW085112612ApriorityCriticalpatent/TW350131B/en
Application grantedgrantedCritical
Publication of TW350131BpublicationCriticalpatent/TW350131B/en
A sort of method of formation of corrosion-proof welding pad, including: forming a protective film on the metal layer, being it to coat a semiconductor substrate having a semiconductor element; forming of a polyimide layer on the protective layer; solidifying the polyimide having a graphic for flattening the polyimide having a graphic; removing a part of the protection layer, using the polyimide layer having a graphics as a mask; and removing a plurality of side products created by removing said steps, being the polyimide having a graphics, the protection layer and the metal layer placed in a thermal vacuum environment.
TW085112612A1996-10-151996-10-15Method of formation of corrosion-proof welding pad
TW350131B
(en)