TW350090B - Method for recycling wafers a method for recycling wafers - Google Patents
Method for recycling wafers a method for recycling wafersInfo
- Publication number
- TW350090B TW350090B TW086120041A TW86120041A TW350090B TW 350090 B TW350090 B TW 350090B TW 086120041 A TW086120041 A TW 086120041A TW 86120041 A TW86120041 A TW 86120041A TW 350090 B TW350090 B TW 350090B
- Authority
- TW
- Taiwan
- Prior art keywords
- controlled
- wafers
- settlement
- recycling
- silicon
- Prior art date
Links
Landscapes
- Weting (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
A method for recycling wafers by first carrying out settlement of silicon oxide on the controlled wafers not used, for settlment of an oxidized layer on the silicon surface of the controlled wafer, before using the controlled wafers in the furnace for settlement of silicon oxide layers and for indication of surface cleanliness; the controlled wafter after settlement of the silicone nitride shall undergo rinse by phosphoric acid solution for removal of the silicon nitride layer, while the remaining malignant chips and the oxidized layer undergoing a further ething with 49% of fluorine hydride solution, before mechanical cleaning the machine, for removal of potential remaining chips and keeping the controlled wafer surface clean.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW086120041A TW350090B (en) | 1997-12-31 | 1997-12-31 | Method for recycling wafers a method for recycling wafers |
TW086120041A TW511140B (en) | 1997-12-31 | 2001-09-25 | Recycle handling method of the monitor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW086120041A TW350090B (en) | 1997-12-31 | 1997-12-31 | Method for recycling wafers a method for recycling wafers |
Publications (1)
Publication Number | Publication Date |
---|---|
TW350090B true TW350090B (en) | 1999-01-11 |
Family
ID=27752166
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086120041A TW350090B (en) | 1997-12-31 | 1997-12-31 | Method for recycling wafers a method for recycling wafers |
TW086120041A TW511140B (en) | 1997-12-31 | 2001-09-25 | Recycle handling method of the monitor wafer |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086120041A TW511140B (en) | 1997-12-31 | 2001-09-25 | Recycle handling method of the monitor wafer |
Country Status (1)
Country | Link |
---|---|
TW (2) | TW350090B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6663674B2 (en) | 2001-04-19 | 2003-12-16 | Infineon Technologies Sc300 Gmbh & Co. Kg | Method of handling a silicon wafer |
-
1997
- 1997-12-31 TW TW086120041A patent/TW350090B/en not_active IP Right Cessation
-
2001
- 2001-09-25 TW TW086120041A patent/TW511140B/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6663674B2 (en) | 2001-04-19 | 2003-12-16 | Infineon Technologies Sc300 Gmbh & Co. Kg | Method of handling a silicon wafer |
Also Published As
Publication number | Publication date |
---|---|
TW511140B (en) | 2002-11-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4A | Expiration of patent term of an invention patent |