TW350090B - Method for recycling wafers a method for recycling wafers - Google Patents

Method for recycling wafers a method for recycling wafers

Info

Publication number
TW350090B
TW350090B TW086120041A TW86120041A TW350090B TW 350090 B TW350090 B TW 350090B TW 086120041 A TW086120041 A TW 086120041A TW 86120041 A TW86120041 A TW 86120041A TW 350090 B TW350090 B TW 350090B
Authority
TW
Taiwan
Prior art keywords
controlled
wafers
settlement
recycling
silicon
Prior art date
Application number
TW086120041A
Other languages
Chinese (zh)
Inventor
qing-yu Zhang
Original Assignee
Macronix Int Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macronix Int Co Ltd filed Critical Macronix Int Co Ltd
Priority to TW086120041A priority Critical patent/TW350090B/en
Application granted granted Critical
Publication of TW350090B publication Critical patent/TW350090B/en
Priority to TW086120041A priority patent/TW511140B/en

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

A method for recycling wafers by first carrying out settlement of silicon oxide on the controlled wafers not used, for settlment of an oxidized layer on the silicon surface of the controlled wafer, before using the controlled wafers in the furnace for settlement of silicon oxide layers and for indication of surface cleanliness; the controlled wafter after settlement of the silicone nitride shall undergo rinse by phosphoric acid solution for removal of the silicon nitride layer, while the remaining malignant chips and the oxidized layer undergoing a further ething with 49% of fluorine hydride solution, before mechanical cleaning the machine, for removal of potential remaining chips and keeping the controlled wafer surface clean.
TW086120041A 1997-12-31 1997-12-31 Method for recycling wafers a method for recycling wafers TW350090B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW086120041A TW350090B (en) 1997-12-31 1997-12-31 Method for recycling wafers a method for recycling wafers
TW086120041A TW511140B (en) 1997-12-31 2001-09-25 Recycle handling method of the monitor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW086120041A TW350090B (en) 1997-12-31 1997-12-31 Method for recycling wafers a method for recycling wafers

Publications (1)

Publication Number Publication Date
TW350090B true TW350090B (en) 1999-01-11

Family

ID=27752166

Family Applications (2)

Application Number Title Priority Date Filing Date
TW086120041A TW350090B (en) 1997-12-31 1997-12-31 Method for recycling wafers a method for recycling wafers
TW086120041A TW511140B (en) 1997-12-31 2001-09-25 Recycle handling method of the monitor wafer

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW086120041A TW511140B (en) 1997-12-31 2001-09-25 Recycle handling method of the monitor wafer

Country Status (1)

Country Link
TW (2) TW350090B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6663674B2 (en) 2001-04-19 2003-12-16 Infineon Technologies Sc300 Gmbh & Co. Kg Method of handling a silicon wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6663674B2 (en) 2001-04-19 2003-12-16 Infineon Technologies Sc300 Gmbh & Co. Kg Method of handling a silicon wafer

Also Published As

Publication number Publication date
TW511140B (en) 2002-11-21

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Legal Events

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MK4A Expiration of patent term of an invention patent