TW346644B - Molding die, molding device and molding method for producing laminated elements - Google Patents

Molding die, molding device and molding method for producing laminated elements

Info

Publication number
TW346644B
TW346644B TW086105278A TW86105278A TW346644B TW 346644 B TW346644 B TW 346644B TW 086105278 A TW086105278 A TW 086105278A TW 86105278 A TW86105278 A TW 86105278A TW 346644 B TW346644 B TW 346644B
Authority
TW
Taiwan
Prior art keywords
molding
laminated elements
mold
elements
sub
Prior art date
Application number
TW086105278A
Other languages
Chinese (zh)
Inventor
Hiroaki Nishizawa
Ichiro Yasuu
Tetuya Hayashida
Etuhisa Abe
Toshimitu Kaneko
Original Assignee
Hitachi Ltd
Shinko Sairubick Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Shinko Sairubick Kk filed Critical Hitachi Ltd
Application granted granted Critical
Publication of TW346644B publication Critical patent/TW346644B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49537—Plurality of lead frames mounted in one device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

A molding die for producing laminated elements, which comprises a main mold having a cavity formed in the lamination direction in which the elements are laminated, the main mold being capable of opening and closing in the lamination direction of the laminated elements; and a sub-mold having a cavity formed in the direction perpendicular to the lamination of the laminated elements, the sub-mold being capable of opening and closing in the lamination direction of the laminated elements, which cavity in the sub-mold are divided into cavities arranged along the parting line of the sub-mold.
TW086105278A 1997-04-16 1997-04-23 Molding die, molding device and molding method for producing laminated elements TW346644B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1997/001317 WO1998047174A1 (en) 1997-04-16 1997-04-16 Mold, device, and method for molding laminated element

Publications (1)

Publication Number Publication Date
TW346644B true TW346644B (en) 1998-12-01

Family

ID=14180429

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086105278A TW346644B (en) 1997-04-16 1997-04-23 Molding die, molding device and molding method for producing laminated elements

Country Status (2)

Country Link
TW (1) TW346644B (en)
WO (1) WO1998047174A1 (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0350841A (en) * 1989-07-19 1991-03-05 Toshiba Corp Metal mold apparatus for semiconductor resin sealing
JPH0870079A (en) * 1994-08-30 1996-03-12 Hitachi Ltd Semiconductor device
JP3688312B2 (en) * 1994-11-18 2005-08-24 株式会社日立製作所 Semiconductor integrated circuit device

Also Published As

Publication number Publication date
WO1998047174A1 (en) 1998-10-22

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