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A composition of aluminum alloy hard solder filler, which comprises 6~8 wt% of Si, 15~25 wt% of Cu, 1~3 wt% of Sn, 0~1.5 wt% of Mg and the balance of Al.
TW086118335A1997-12-051997-12-05Aluminum alloy hard solder filler and preparation and soldering methods thereof
TW345518B
(en)