TW343428B - IC heat discharge method for PC boards and device therefor - Google Patents

IC heat discharge method for PC boards and device therefor

Info

Publication number
TW343428B
TW343428B TW086114729A TW86114729A TW343428B TW 343428 B TW343428 B TW 343428B TW 086114729 A TW086114729 A TW 086114729A TW 86114729 A TW86114729 A TW 86114729A TW 343428 B TW343428 B TW 343428B
Authority
TW
Taiwan
Prior art keywords
heat discharge
enclosure
high temperature
heat
discharge material
Prior art date
Application number
TW086114729A
Other languages
Chinese (zh)
Inventor
Shyh-Tsong Shieh
Wei-Tsong Tsay
Original Assignee
Dong Sheng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dong Sheng Co Ltd filed Critical Dong Sheng Co Ltd
Priority to TW086114729A priority Critical patent/TW343428B/en
Application granted granted Critical
Publication of TW343428B publication Critical patent/TW343428B/en

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

An IC heat discharge method for a PC board which can be positioned in an electric equipment and used by applying a current on the power terminals thereof, in which the IC thereof will generate an appropriate high temperature while in use and require constant heat discharge; which is characterized in that the heat discharge method comprises: (1) a first step of directly contacting the top of the IC with the bottom of a plastic heat discharge material having excellent heat discharge properties; (2) a second step of conducting the high temperature thermal energy generated by the IC to the heat discharge material through direct contact; (3) a third step of positioning the heat discharge material on the enclosure of the electric equipment thereby sequentially forming direct contact between the IC on the PC board, the heat discharge material, and the enclosure; and (4) a fourth step of conducting high temperature thermal energy in the heat discharge material and in the interior of the enclosure to the exterior enclosure having excellent heat discharge properties and a larger heat discharge area through direction conduction, and dissipating the heat to the outside.
TW086114729A 1997-10-06 1997-10-06 IC heat discharge method for PC boards and device therefor TW343428B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW086114729A TW343428B (en) 1997-10-06 1997-10-06 IC heat discharge method for PC boards and device therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW086114729A TW343428B (en) 1997-10-06 1997-10-06 IC heat discharge method for PC boards and device therefor

Publications (1)

Publication Number Publication Date
TW343428B true TW343428B (en) 1998-10-21

Family

ID=58263663

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086114729A TW343428B (en) 1997-10-06 1997-10-06 IC heat discharge method for PC boards and device therefor

Country Status (1)

Country Link
TW (1) TW343428B (en)

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