TW340080B - Method of manufacturing semiconductor base plates - Google Patents

Method of manufacturing semiconductor base plates

Info

Publication number
TW340080B
TW340080B TW086100015A TW86100015A TW340080B TW 340080 B TW340080 B TW 340080B TW 086100015 A TW086100015 A TW 086100015A TW 86100015 A TW86100015 A TW 86100015A TW 340080 B TW340080 B TW 340080B
Authority
TW
Taiwan
Prior art keywords
manufacturing semiconductor
base plates
semiconductor base
base plate
primary grinding
Prior art date
Application number
TW086100015A
Other languages
Chinese (zh)
Inventor
Hisashi Masumura
Tadahiro Kato
Hideo Kudo
Original Assignee
Mutsubishi Gum Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mutsubishi Gum Kk filed Critical Mutsubishi Gum Kk
Application granted granted Critical
Publication of TW340080B publication Critical patent/TW340080B/en

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Weting (AREA)

Abstract

The method of manufacturing semiconductor base plates, having: twin-side primary grinding of the two sides of the base plate; etching of the inside of the base plate in primary grinding; and mirror polishing of the surface of the mirror inside the base plate of the etched inside.
TW086100015A 1996-01-31 1997-01-03 Method of manufacturing semiconductor base plates TW340080B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1484296 1996-01-31

Publications (1)

Publication Number Publication Date
TW340080B true TW340080B (en) 1998-09-11

Family

ID=58263381

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086100015A TW340080B (en) 1996-01-31 1997-01-03 Method of manufacturing semiconductor base plates

Country Status (1)

Country Link
TW (1) TW340080B (en)

Similar Documents

Publication Publication Date Title
AU1683899A (en) Abrasive, method of polishing wafer, and method of producing semiconductor device
AU4472997A (en) Semiconductor substrate polishing pad dresser, method of manufacturing the same, and chemicomechanical polishing method using the same dresser
MY132588A (en) Apparatus and method for double-side polishing semiconductor wafers
EP0637065A3 (en) Chemical mechanical planarization of shallow trenches in semiconductor substrates.
AU8453298A (en) Polishing semiconductor wafers
MY122784A (en) Abrasive article suitable for modifying a semiconductor wafer
EP1261020A4 (en) Wafer manufacturing method, polishing apparatus, and wafer
MY130639A (en) Method of rough polishing semiconductor wafers to reduce surface roughness
EP0373501A3 (en) Fine polishing composition for wafers
IL155856A0 (en) Abrasive article having a window system for polishing wafers, and methods
MY116265A (en) A polishing composition including an inhibitor of tungsten etching
WO2001078116A3 (en) System for the preferential removal of silicon oxide
IL123235A (en) Semiconductor wafer polishing apparatus
EP1055486A3 (en) Dressing apparatus and polishing apparatus
EP0820092A4 (en) Cerium oxide abrasive, semiconductor chip, semiconductor device, process for the production of them, and method for the polishing of substrates
SG73539A1 (en) Semiconductor wafer surface flattening apparatus
SG75876A1 (en) Process and device for polishing semiconductor wafers
TW372902B (en) Polishing machine
WO2000013852A8 (en) Apparatuses and methods for polishing semiconductor wafers
EP1205280A4 (en) Wafer polishing method and wafer polishing device
TW375554B (en) Wafer holder for chemical and mechanical planarization machines
MY123286A (en) Semiconductor wafer manufacturing method
SG116418A1 (en) Semiconductor wafer grinding method.
TW344862B (en) Manufacture of semiconductor wafer
TW357405B (en) Method for pre-shaping a semiconductor substrate for polishing and structure