TW339449B - Processing apparatus and processing method of processing objects - Google Patents

Processing apparatus and processing method of processing objects

Info

Publication number
TW339449B
TW339449B TW086108422A TW86108422A TW339449B TW 339449 B TW339449 B TW 339449B TW 086108422 A TW086108422 A TW 086108422A TW 86108422 A TW86108422 A TW 86108422A TW 339449 B TW339449 B TW 339449B
Authority
TW
Taiwan
Prior art keywords
processing
objects
processing part
rotary processing
processing apparatus
Prior art date
Application number
TW086108422A
Other languages
Chinese (zh)
Inventor
Tatsuya Nishida
Kenji Miyachi
Haruo Okahide
Original Assignee
Tokyo Electron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Co Ltd filed Critical Tokyo Electron Co Ltd
Application granted granted Critical
Publication of TW339449B publication Critical patent/TW339449B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00Cleaning and liquid contact with solids
    • Y10S134/902Semiconductor wafer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/14Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
  • Photographic Processing Devices Using Wet Methods (AREA)

Abstract

A sort of processing apparatus, having: a rotary processing part for rotating and drying a plurality of sheets of objects being processed collectively in order to allow the object be rotated immediately after they are accommodated in the rotary processing part; a balance adjusting mechanism for adjusting balance of the rotary processing part by moving counterweights in accordance with the number of the objects.
TW086108422A 1996-06-18 1997-06-17 Processing apparatus and processing method of processing objects TW339449B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17841596A JP3624054B2 (en) 1996-06-18 1996-06-18 Processing apparatus and processing method

Publications (1)

Publication Number Publication Date
TW339449B true TW339449B (en) 1998-09-01

Family

ID=16048105

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086108422A TW339449B (en) 1996-06-18 1997-06-17 Processing apparatus and processing method of processing objects

Country Status (4)

Country Link
US (2) US5960562A (en)
JP (1) JP3624054B2 (en)
KR (1) KR100432269B1 (en)
TW (1) TW339449B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6158449A (en) * 1997-07-17 2000-12-12 Tokyo Electron Limited Cleaning and drying method and apparatus
JP3627132B2 (en) * 1997-11-18 2005-03-09 東京エレクトロン株式会社 Substrate drying processing apparatus and substrate drying processing method
KR100300030B1 (en) * 1997-12-30 2001-10-19 김영환 Reticle cleaning apparatus
WO2001068489A1 (en) * 2000-03-13 2001-09-20 Laurier Inc. Automated feed mechanism for electronic components of silicon wafer
CN1223258C (en) * 2000-03-28 2005-10-12 西门子公司 Method and device for monitoring electric component in pick-and-place device for substrates
US6748961B2 (en) * 2001-03-30 2004-06-15 Lam Research Corporation Angular spin, rinse, and dry module and methods for making and implementing the same
JP4033689B2 (en) * 2002-03-01 2008-01-16 東京エレクトロン株式会社 Liquid processing apparatus and liquid processing method
JP4347156B2 (en) * 2004-07-28 2009-10-21 大日本スクリーン製造株式会社 Substrate processing equipment
JP5043021B2 (en) * 2005-10-04 2012-10-10 アプライド マテリアルズ インコーポレイテッド Method and apparatus for drying a substrate
US20090098527A1 (en) * 2006-09-12 2009-04-16 Fischer Gerald W Biological organism identification product and methods
JP5212165B2 (en) * 2009-02-20 2013-06-19 東京エレクトロン株式会社 Substrate processing equipment
US9099481B2 (en) 2013-03-15 2015-08-04 Semiconductor Components Industries, Llc Methods of laser marking semiconductor substrates

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05166757A (en) * 1991-12-13 1993-07-02 Tokyo Electron Ltd Temperature regulator for material to be pr0cessed
JP2575077B2 (en) * 1992-03-31 1997-01-22 住友精密工業株式会社 Spin dryer
JP3190929B2 (en) * 1992-10-26 2001-07-23 保 目崎 Drainer and dryer for semiconductor materials
JP2604561B2 (en) * 1994-12-26 1997-04-30 山形日本電気株式会社 Wafer drying equipment
JP3030228B2 (en) * 1995-04-14 2000-04-10 三洋電機株式会社 Centrifugal dehydrator
US5804507A (en) * 1995-10-27 1998-09-08 Applied Materials, Inc. Radially oscillating carousel processing system for chemical mechanical polishing
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US5610104A (en) * 1996-05-21 1997-03-11 Cypress Semiconductor Corporation Method of providing a mark for identification on a silicon surface

Also Published As

Publication number Publication date
KR980005774A (en) 1998-03-30
US6187060B1 (en) 2001-02-13
JPH1012586A (en) 1998-01-16
JP3624054B2 (en) 2005-02-23
US5960562A (en) 1999-10-05
KR100432269B1 (en) 2004-10-26

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees