TW339449B - Processing apparatus and processing method of processing objects - Google Patents
Processing apparatus and processing method of processing objectsInfo
- Publication number
- TW339449B TW339449B TW086108422A TW86108422A TW339449B TW 339449 B TW339449 B TW 339449B TW 086108422 A TW086108422 A TW 086108422A TW 86108422 A TW86108422 A TW 86108422A TW 339449 B TW339449 B TW 339449B
- Authority
- TW
- Taiwan
- Prior art keywords
- processing
- objects
- processing part
- rotary processing
- processing apparatus
- Prior art date
Links
- 238000003672 processing method Methods 0.000 title 1
- 238000001035 drying Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Drying Of Solid Materials (AREA)
- Photographic Processing Devices Using Wet Methods (AREA)
Abstract
A sort of processing apparatus, having: a rotary processing part for rotating and drying a plurality of sheets of objects being processed collectively in order to allow the object be rotated immediately after they are accommodated in the rotary processing part; a balance adjusting mechanism for adjusting balance of the rotary processing part by moving counterweights in accordance with the number of the objects.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17841596A JP3624054B2 (en) | 1996-06-18 | 1996-06-18 | Processing apparatus and processing method |
Publications (1)
Publication Number | Publication Date |
---|---|
TW339449B true TW339449B (en) | 1998-09-01 |
Family
ID=16048105
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086108422A TW339449B (en) | 1996-06-18 | 1997-06-17 | Processing apparatus and processing method of processing objects |
Country Status (4)
Country | Link |
---|---|
US (2) | US5960562A (en) |
JP (1) | JP3624054B2 (en) |
KR (1) | KR100432269B1 (en) |
TW (1) | TW339449B (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6158449A (en) * | 1997-07-17 | 2000-12-12 | Tokyo Electron Limited | Cleaning and drying method and apparatus |
JP3627132B2 (en) * | 1997-11-18 | 2005-03-09 | 東京エレクトロン株式会社 | Substrate drying processing apparatus and substrate drying processing method |
KR100300030B1 (en) * | 1997-12-30 | 2001-10-19 | 김영환 | Reticle cleaning apparatus |
WO2001068489A1 (en) * | 2000-03-13 | 2001-09-20 | Laurier Inc. | Automated feed mechanism for electronic components of silicon wafer |
CN1223258C (en) * | 2000-03-28 | 2005-10-12 | 西门子公司 | Method and device for monitoring electric component in pick-and-place device for substrates |
US6748961B2 (en) * | 2001-03-30 | 2004-06-15 | Lam Research Corporation | Angular spin, rinse, and dry module and methods for making and implementing the same |
JP4033689B2 (en) * | 2002-03-01 | 2008-01-16 | 東京エレクトロン株式会社 | Liquid processing apparatus and liquid processing method |
JP4347156B2 (en) * | 2004-07-28 | 2009-10-21 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
JP5043021B2 (en) * | 2005-10-04 | 2012-10-10 | アプライド マテリアルズ インコーポレイテッド | Method and apparatus for drying a substrate |
US20090098527A1 (en) * | 2006-09-12 | 2009-04-16 | Fischer Gerald W | Biological organism identification product and methods |
JP5212165B2 (en) * | 2009-02-20 | 2013-06-19 | 東京エレクトロン株式会社 | Substrate processing equipment |
US9099481B2 (en) | 2013-03-15 | 2015-08-04 | Semiconductor Components Industries, Llc | Methods of laser marking semiconductor substrates |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05166757A (en) * | 1991-12-13 | 1993-07-02 | Tokyo Electron Ltd | Temperature regulator for material to be pr0cessed |
JP2575077B2 (en) * | 1992-03-31 | 1997-01-22 | 住友精密工業株式会社 | Spin dryer |
JP3190929B2 (en) * | 1992-10-26 | 2001-07-23 | 保 目崎 | Drainer and dryer for semiconductor materials |
JP2604561B2 (en) * | 1994-12-26 | 1997-04-30 | 山形日本電気株式会社 | Wafer drying equipment |
JP3030228B2 (en) * | 1995-04-14 | 2000-04-10 | 三洋電機株式会社 | Centrifugal dehydrator |
US5804507A (en) * | 1995-10-27 | 1998-09-08 | Applied Materials, Inc. | Radially oscillating carousel processing system for chemical mechanical polishing |
US5738574A (en) * | 1995-10-27 | 1998-04-14 | Applied Materials, Inc. | Continuous processing system for chemical mechanical polishing |
US5610104A (en) * | 1996-05-21 | 1997-03-11 | Cypress Semiconductor Corporation | Method of providing a mark for identification on a silicon surface |
-
1996
- 1996-06-18 JP JP17841596A patent/JP3624054B2/en not_active Expired - Fee Related
-
1997
- 1997-06-17 US US08/877,565 patent/US5960562A/en not_active Expired - Fee Related
- 1997-06-17 TW TW086108422A patent/TW339449B/en not_active IP Right Cessation
- 1997-06-18 KR KR1019970025287A patent/KR100432269B1/en not_active IP Right Cessation
-
1998
- 1998-09-17 US US09/154,741 patent/US6187060B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR980005774A (en) | 1998-03-30 |
US6187060B1 (en) | 2001-02-13 |
JPH1012586A (en) | 1998-01-16 |
JP3624054B2 (en) | 2005-02-23 |
US5960562A (en) | 1999-10-05 |
KR100432269B1 (en) | 2004-10-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |