TW339322B - Package for temperature-sensitive planar optical components - Google Patents

Package for temperature-sensitive planar optical components

Info

Publication number
TW339322B
TW339322B TW086119272A TW86119272A TW339322B TW 339322 B TW339322 B TW 339322B TW 086119272 A TW086119272 A TW 086119272A TW 86119272 A TW86119272 A TW 86119272A TW 339322 B TW339322 B TW 339322B
Authority
TW
Taiwan
Prior art keywords
temperature
package
optical components
planar optical
circuit
Prior art date
Application number
TW086119272A
Other languages
Chinese (zh)
Inventor
Marcel Jean Beguin Alain
Scotta Felice
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Application granted granted Critical
Publication of TW339322B publication Critical patent/TW339322B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating

Landscapes

  • Control Of Temperature (AREA)
  • Semiconductor Lasers (AREA)
  • Measuring Fluid Pressure (AREA)
  • Light Receiving Elements (AREA)

Abstract

A sort of package of temperature-sensitive components, including: an outer container (12); an inner container (14), located in the outer container, temperature sensitive component (20), housed in the inner container, circuit (16), located inside the outer container and outside the inner container, temperature sensor (R21) and component (20) in thermoal contact, providing said sensor input signals to the circuit (16), heating element (26) and component (20) in thermal contact, with the circuit (16) controlling the heating element for thermal energy.
TW086119272A 1996-12-06 1997-12-16 Package for temperature-sensitive planar optical components TW339322B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9615002 1996-12-06

Publications (1)

Publication Number Publication Date
TW339322B true TW339322B (en) 1998-09-01

Family

ID=9498410

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086119272A TW339322B (en) 1996-12-06 1997-12-16 Package for temperature-sensitive planar optical components

Country Status (5)

Country Link
JP (1) JP2002516596A (en)
KR (1) KR20000057385A (en)
CN (1) CN1238898A (en)
CA (1) CA2273865A1 (en)
TW (1) TW339322B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102386557A (en) * 2010-08-25 2012-03-21 Agx技术股份有限公司 Internal-cooled heat-blocking modular laser packaging system
CN102183977B (en) * 2011-01-31 2013-08-21 北京东方计量测试研究所 Temperature-controllable resistor and temperature-self-controlling resistance device
JP5842584B2 (en) * 2011-09-29 2016-01-13 富士通株式会社 Optical connector and electronic device using the same
WO2017188351A1 (en) * 2016-04-27 2017-11-02 北陸電気工業株式会社 Pressure sensor device
US10460966B2 (en) * 2016-06-15 2019-10-29 Kla-Tencor Corporation Encapsulated instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications
WO2019058634A1 (en) * 2017-09-25 2019-03-28 オリンパス株式会社 Optical module
JP7135645B2 (en) * 2018-09-19 2022-09-13 住友大阪セメント株式会社 optical module
CN111891533B (en) * 2020-08-13 2022-05-13 北京硅元医疗科技有限责任公司 Storage facilities is accomodate to medical instrument

Also Published As

Publication number Publication date
CA2273865A1 (en) 1998-06-11
JP2002516596A (en) 2002-06-04
KR20000057385A (en) 2000-09-15
CN1238898A (en) 1999-12-15

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