TW338770B - Method for the pattern-processing of photosensitive resin compositions - Google Patents

Method for the pattern-processing of photosensitive resin compositions

Info

Publication number
TW338770B
TW338770B TW085115887A TW85115887A TW338770B TW 338770 B TW338770 B TW 338770B TW 085115887 A TW085115887 A TW 085115887A TW 85115887 A TW85115887 A TW 85115887A TW 338770 B TW338770 B TW 338770B
Authority
TW
Taiwan
Prior art keywords
photosensitive resin
nhco
mole
pattern
processing
Prior art date
Application number
TW085115887A
Other languages
Chinese (zh)
Inventor
Toshio Banba
Toshiro Takeda
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Application granted granted Critical
Publication of TW338770B publication Critical patent/TW338770B/en

Links

Abstract

A method of pattern-processing of a photosensitive resin composition comprising coating on a substrate a positive photosensitive resin composition having a polyamide represented by the following formula: (1) and a diazoquinone compound, subjecting the same to prebaking and then to irradiation with a light; wherein X is a tetravalent aromatic group given as follows: and A for -CH2-, -O-, -S-, -SO2-, -CO-, -NHCO- or -CO-, -NHCO- or -C(CF3)2-; Y is a divalent group; given as follows; where A for -CH2-, -O-, -S-, -SO2-, -CO-, -NHCO- or -CO-, -NHCO- or -C(CF3)2-; Z is in which R1 and R2 are divalent organic groups and R3 and R4 are monovalent organic groups, a and b are mole fractions; a + b = 10-0 mole %; a = 60.0 - 100 mole %; b = 0 - 40.0 mole % and n = 2 - 500.
TW085115887A 1995-06-30 1996-12-23 Method for the pattern-processing of photosensitive resin compositions TW338770B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP16649495 1995-06-30
JP17247895A JP3313012B2 (en) 1995-06-30 1995-07-07 Pattern processing method for photosensitive resin composition

Publications (1)

Publication Number Publication Date
TW338770B true TW338770B (en) 1998-08-21

Family

ID=26490849

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085115887A TW338770B (en) 1995-06-30 1996-12-23 Method for the pattern-processing of photosensitive resin compositions

Country Status (2)

Country Link
JP (1) JP3313012B2 (en)
TW (1) TW338770B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3973730B2 (en) * 1997-05-06 2007-09-12 富士ゼロックス株式会社 Charge imparting member and method for producing the same, electrostatic latent image developer using the same, image forming apparatus, and image forming method
JP4840014B2 (en) * 2006-07-31 2011-12-21 日立化成デュポンマイクロシステムズ株式会社 Positive photosensitive resin composition, method for producing patterned cured film, and electronic component

Also Published As

Publication number Publication date
JPH0973176A (en) 1997-03-18
JP3313012B2 (en) 2002-08-12

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees