TW338770B - Method for the pattern-processing of photosensitive resin compositions - Google Patents
Method for the pattern-processing of photosensitive resin compositionsInfo
- Publication number
- TW338770B TW338770B TW085115887A TW85115887A TW338770B TW 338770 B TW338770 B TW 338770B TW 085115887 A TW085115887 A TW 085115887A TW 85115887 A TW85115887 A TW 85115887A TW 338770 B TW338770 B TW 338770B
- Authority
- TW
- Taiwan
- Prior art keywords
- photosensitive resin
- nhco
- mole
- pattern
- processing
- Prior art date
Links
Abstract
A method of pattern-processing of a photosensitive resin composition comprising coating on a substrate a positive photosensitive resin composition having a polyamide represented by the following formula: (1) and a diazoquinone compound, subjecting the same to prebaking and then to irradiation with a light; wherein X is a tetravalent aromatic group given as follows: and A for -CH2-, -O-, -S-, -SO2-, -CO-, -NHCO- or -CO-, -NHCO- or -C(CF3)2-; Y is a divalent group; given as follows; where A for -CH2-, -O-, -S-, -SO2-, -CO-, -NHCO- or -CO-, -NHCO- or -C(CF3)2-; Z is in which R1 and R2 are divalent organic groups and R3 and R4 are monovalent organic groups, a and b are mole fractions; a + b = 10-0 mole %; a = 60.0 - 100 mole %; b = 0 - 40.0 mole % and n = 2 - 500.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16649495 | 1995-06-30 | ||
JP17247895A JP3313012B2 (en) | 1995-06-30 | 1995-07-07 | Pattern processing method for photosensitive resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
TW338770B true TW338770B (en) | 1998-08-21 |
Family
ID=26490849
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW085115887A TW338770B (en) | 1995-06-30 | 1996-12-23 | Method for the pattern-processing of photosensitive resin compositions |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP3313012B2 (en) |
TW (1) | TW338770B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3973730B2 (en) * | 1997-05-06 | 2007-09-12 | 富士ゼロックス株式会社 | Charge imparting member and method for producing the same, electrostatic latent image developer using the same, image forming apparatus, and image forming method |
JP4840014B2 (en) * | 2006-07-31 | 2011-12-21 | 日立化成デュポンマイクロシステムズ株式会社 | Positive photosensitive resin composition, method for producing patterned cured film, and electronic component |
-
1995
- 1995-07-07 JP JP17247895A patent/JP3313012B2/en not_active Expired - Fee Related
-
1996
- 1996-12-23 TW TW085115887A patent/TW338770B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH0973176A (en) | 1997-03-18 |
JP3313012B2 (en) | 2002-08-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |