Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omlron KkfiledCriticalOmlron Kk
Priority to TW085108729ApriorityCriticalpatent/TW333740B/en
Application grantedgrantedCritical
Publication of TW333740BpublicationCriticalpatent/TW333740B/en
Encapsulation Of And Coatings For Semiconductor Or Solid State Devices
(AREA)
Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits
(AREA)
Abstract
A kind of manufacturing process for electronic apparatus which is to inject resin into the case when the electronic apparatus is forming. The feature is the steps of deflating the air through the channel connecting the inside and outside of the case to reduce the pressure inside and the steps of injecting the resin into the case from the inlet.
TW085108729A1996-07-181996-07-18Electronic apparatus with resin filled inside and the manufacturing process
TW333740B
(en)
Method for pressing a plastic which cures by means of a reaction into a mould cavity a pressing auxiliary in pill form to be used in this method and a holder composed of such material