TW332211B - Thermosetting resin compositions containing maleimide and/or vinyl compounds - Google Patents

Thermosetting resin compositions containing maleimide and/or vinyl compounds

Info

Publication number
TW332211B
TW332211B TW084109064A TW84109064A TW332211B TW 332211 B TW332211 B TW 332211B TW 084109064 A TW084109064 A TW 084109064A TW 84109064 A TW84109064 A TW 84109064A TW 332211 B TW332211 B TW 332211B
Authority
TW
Taiwan
Prior art keywords
carbon atoms
thermosetting resin
compositions containing
resin compositions
vinyl compounds
Prior art date
Application number
TW084109064A
Other languages
Chinese (zh)
Inventor
M Dershem Stephen
B Patterson Dennis
A Osuna Jose Jr
Original Assignee
Quantum Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/300,721 external-priority patent/US6034194A/en
Application filed by Quantum Materials Inc filed Critical Quantum Materials Inc
Application granted granted Critical
Publication of TW332211B publication Critical patent/TW332211B/en

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  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Pyrrole Compounds (AREA)

Abstract

A dimaleimide compound of the following structure: (I) in which m = 1, 2 or 3, each R is independently selected from hydrogen or alkyl containing up to 5 carbon atoms, and X is a monovalent or polyvalent residue selected from the following: branched alkyl, alkylene or alkylene oxide containing 12 to 500 carbon atoms; aryl having the following structure: (structure) in which n = 1, 2 or 3; w = 0 or 1; each Ar is mono-, di- or tri-substituted aryl or heteroaryl ring containing 3 to 10 carbon atoms; and Z is a branched alkyl, alkylene or alkylene oxide containing 12 to 50 carbon atoms in its main chain, or a mixture thereof.
TW084109064A 1994-06-02 1995-08-30 Thermosetting resin compositions containing maleimide and/or vinyl compounds TW332211B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US46049594A 1994-06-02 1994-06-02
US08/300,721 US6034194A (en) 1994-09-02 1994-09-02 Bismaleimide-divinyl adhesive compositions and uses therefor

Publications (1)

Publication Number Publication Date
TW332211B true TW332211B (en) 1998-05-21

Family

ID=58262739

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084109064A TW332211B (en) 1994-06-02 1995-08-30 Thermosetting resin compositions containing maleimide and/or vinyl compounds

Country Status (1)

Country Link
TW (1) TW332211B (en)

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees