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A method of forming protective coatings on electronic substrate comprises: (1) Applying coating combination including a polysilazane with 10~90 weight percentage and filler selected from powder, particles, fiber, sheet and micro-balloon and with 1~90 weight percentage; (2) Under 100 to 500 centigrade heating coated substrate for at most 6 hours so as to convert the coating combination into ceramic.
TW084102812A1995-03-231995-03-23Protective electronic coatings using filled polysilizanes
TW331025B
(en)