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A thermosetting composition characterized in comprising essentially, (A) a compound having in the molecule two or more functional groups of the formula (1): (1); (B) a compound having in the molecule two or more reactive functional groups, which can form chemical bonds with the above-mentioned functional groups; (C) at least one selected from the following component (a), (b) and (c): (a) a thermal latent acid catalyst comprising (i) an epoxy-containing compound; (ii) a thio-containing compound represented by the following general formula (2): (2); (iii) a Lewis acid represented by the following formula (3): (3) (iv) carboxylic acid compound and/or carboxylic acid anhydride compound; (b) a thermal latent acid catalyst comprising (v) a nitrogen, oxygen, phosphorus or sulfur-containing compound represented by the following formula (4) (4); (vi) a halogen-containing compound represented by the following formula (5): (5); and (vii) an aluminum atom, zinc atom or tin atom-containing Lewis acid represented by the following formula (6) (6); and (c) a mixture of (viii) a metal chelate compound and (ix) an organic silicon compound represented by the following formula (7) or condensate thereof: (7).
TW083107941A1993-09-061994-08-30Curing compositions, thermal latent acid catalysts, methods of coating, coating article, molding method and molded article
TW328548B
(en)