TW326577B - Solid state motion picture device - Google Patents

Solid state motion picture device

Info

Publication number
TW326577B
TW326577B TW082104865A TW82104865A TW326577B TW 326577 B TW326577 B TW 326577B TW 082104865 A TW082104865 A TW 082104865A TW 82104865 A TW82104865 A TW 82104865A TW 326577 B TW326577 B TW 326577B
Authority
TW
Taiwan
Prior art keywords
motion picture
solid state
state motion
base stand
stand
Prior art date
Application number
TW082104865A
Other languages
English (en)
Inventor
Hideo Yamanaka
Original Assignee
Sony Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Co Ltd filed Critical Sony Co Ltd
Priority to TW082104865A priority Critical patent/TW326577B/zh
Application granted granted Critical
Publication of TW326577B publication Critical patent/TW326577B/zh

Links

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
TW082104865A 1993-06-21 1993-06-21 Solid state motion picture device TW326577B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW082104865A TW326577B (en) 1993-06-21 1993-06-21 Solid state motion picture device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW082104865A TW326577B (en) 1993-06-21 1993-06-21 Solid state motion picture device

Publications (1)

Publication Number Publication Date
TW326577B true TW326577B (en) 1998-02-11

Family

ID=58262288

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082104865A TW326577B (en) 1993-06-21 1993-06-21 Solid state motion picture device

Country Status (1)

Country Link
TW (1) TW326577B (zh)

Similar Documents

Publication Publication Date Title
TW332348B (en) Manufacturing method for solid state motion picture device provides a highly accurate and low cost solid state motion picture device by use of empty package made of resin.
TW338180B (en) Semiconductor and its manufacturing method
CA2196268A1 (en) Package
TW338559U (en) Resin package type semiconductor device
EP1089335A4 (en) SEMICONDUCTOR DEVICE
EP0587399A3 (en) Semiconductor component with a contact and method for its production.
EP0398587A3 (en) A method of encapsulation for devices
TW344873B (en) Semiconductor device, manufacture thereof, and its mounting method
KR890012380A (ko) 전자 소자 패키지 및 제조방법
GB2341277B (en) An electronic component package with posts on the active surface
EP0320244A3 (en) Electrical contact bump and a package provided with the same
IT1294758B1 (it) Contenitore per semiconduttori ad alta potenza a montaggio superficiale perfezionato,e metodo per la sua fabbricazione
ATE216205T1 (de) Blumenübertopf mit gekräuseltem teil
EP0450944A3 (en) An epoxy resin composition for encapsulating a semiconductor device
EP0702408A3 (en) Package for mounting a semiconductor device
EP0608051A3 (en) Resin-sealed semiconductor device.
DE3376926D1 (en) Semiconductor device with an improved bonding section
GB9800980D0 (en) Semiconductor device with improved connection reliability
EP0902475A3 (en) A single-sided package including an integrated circuit semiconductor chip and inductive coil and method therefor
GB2243026B (en) Electronic device package mounting assembly
TW562245U (en) Resin encapsulating type semiconductor device
EP0739877A3 (en) Epoxy resin, resin composition and resin-encapsulated semiconductor device
GB2231336B (en) Gold wire for the bonding of a semiconductor device
SG47534A1 (en) Wire bonding over the active circuit area of an integrated circuit device
GB9111994D0 (en) Bonding wire for semiconductor device

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees