TW326102B - Card comprising an electronic unit and method for manufacturing such a card - Google Patents

Card comprising an electronic unit and method for manufacturing such a card

Info

Publication number
TW326102B
TW326102B TW085114945A TW85114945A TW326102B TW 326102 B TW326102 B TW 326102B TW 085114945 A TW085114945 A TW 085114945A TW 85114945 A TW85114945 A TW 85114945A TW 326102 B TW326102 B TW 326102B
Authority
TW
Taiwan
Prior art keywords
layer
card
electronic unit
applying
integrated circuit
Prior art date
Application number
TW085114945A
Other languages
Chinese (zh)
Inventor
Alain Juan
Original Assignee
Em Microelectronic Marin Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Em Microelectronic Marin Sa filed Critical Em Microelectronic Marin Sa
Application granted granted Critical
Publication of TW326102B publication Critical patent/TW326102B/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

A method of manufacturing a card, which comprises the steps of: (I) supplying a first planar layer (30) of a hot melt material; (II) applying at least one electronic unit (32) to the first layer, the unit comprising an integrated circuit (4) and electronic junction pads (34, 36) electrically connected to the integrated circuit, and a conductive material coil at least forming a winding (14), both ends of which are separately connected to the two electronic junction pads (34, 36); the integrated circuit being surrounded by a module (38) and its contour having a symmetry relative to the median plane (40) of the module; (III) applying a planar layer (42) of a second hot melt material on the first layer on the electronic unit and the coil; (IV) applying a hot press mechanism on the first and the second planar layer sufficient to soften the first and second layer for combining with each other and encompassing the electronic unit and the coil in the first and second layer while maintaining the relative external surface (46, 48) flat.
TW085114945A 1995-11-01 1996-12-04 Card comprising an electronic unit and method for manufacturing such a card TW326102B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH308495A CH690469A5 (en) 1995-11-01 1995-11-01 Manufacture of two-layer card incorporating integrated circuit

Publications (1)

Publication Number Publication Date
TW326102B true TW326102B (en) 1998-02-01

Family

ID=4248280

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085114945A TW326102B (en) 1995-11-01 1996-12-04 Card comprising an electronic unit and method for manufacturing such a card

Country Status (2)

Country Link
CH (1) CH690469A5 (en)
TW (1) TW326102B (en)

Also Published As

Publication number Publication date
CH690469A5 (en) 2000-09-15

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