TW316949B - Magnetic field detecting device - Google Patents

Magnetic field detecting device Download PDF

Info

Publication number
TW316949B
TW316949B TW86102617A TW86102617A TW316949B TW 316949 B TW316949 B TW 316949B TW 86102617 A TW86102617 A TW 86102617A TW 86102617 A TW86102617 A TW 86102617A TW 316949 B TW316949 B TW 316949B
Authority
TW
Taiwan
Prior art keywords
magnetic field
stack structure
layer
conductive
conductive stack
Prior art date
Application number
TW86102617A
Other languages
Chinese (zh)
Inventor
Jaw-Chyng Lu
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to TW86102617A priority Critical patent/TW316949B/en
Application granted granted Critical
Publication of TW316949B publication Critical patent/TW316949B/en

Links

Landscapes

  • Measuring Magnetic Variables (AREA)

Abstract

A magnetic field detecting device at least comprises of: (1) one conductive stack structure, formed on one semiconductor substrate, in which the conductive stack structure at least contains multiple adjacent ion doped layer, and ion density of each ion doped layer decreases from top to down; (2) one first conductive contact, located one first end of upmost layer of the multiple ion doped layers; (3) one second conductive contact, located on second end of upmost layer of the multiple ion doped layers, current via the first contact flows to the conductive stack structure, and out from the second conductive contact, one magnetic field with horizontal direction functions on the magnetic field detecting device.

Description

316949 A7 B7 __ 五、發明説明() 5·1發明領域: 本發明係有關於一種磁場感測器,特别是有關於 一種可同時測量磁場大小及分量的磁場感測装置。 5·2發明背景: 霍爾(Hall)感測器是一種利用霍爾效應(Hall effect)以測量磁場大小的半導體元件。霍爾效應發生在同 時以電場及磁場作用於一導體板上時,如第一圈所示。當 施以一方向如圈所示之電流丨,及一向下的重場B時,則 會產生—霍爾電場Eh,其方向如圈所示,而其大小对係 根據下式得出:316949 A7 B7 __ 5. Description of the invention () 5.1 Field of the invention: The present invention relates to a magnetic field sensor, in particular to a magnetic field sensing device that can simultaneously measure the size and component of a magnetic field. 5.2 Background of the invention: The Hall sensor is a semiconductor element that uses the Hall effect to measure the size of the magnetic field. The Hall effect occurs when an electric field and a magnetic field act on a conductor plate at the same time, as shown in the first circle. When a current 丨 shown in a circle is applied in one direction, and a downward heavy field B is generated, a Hall electric field Eh is generated, the direction of which is shown in the circle, and its magnitude is obtained according to the following formula:

Eh = Rh,B/A 其中Rh代表霍爾係數(Ha丨I coefficient),而A代表導雅 板之截面積》維然霍爾感測器普遍用於測量磁場的大小, 但是對於垂直於霍爾感測器之磁場,則無法方便的經由— 次即量測得出》 5_3發明目的及概述: 經濟部中央標準局員工消費合作社印裝 (請先閱讀背面之注意事項再填寫本頁) 鑒於上述之發明背景中,傳統的感測器所具有的諸多 缺麻,本發明的主要目的在提供一種可同時測量磁場各分 量大小的磁場感測裝置。本發明至少包含一導電堆φ結 構,形成於一半導體基底上。導電堆疊結構至少包含多個 本纸張尺度適用中國國家標準(CMS > A4規格(210X297公釐) 經濟部中央標準局貝工消費合作杜印裝 A7 ―一--_____B7 五、發明説明() 緊鄰的離子掺雜層,且各層的離子濃度由上往下遞減。第 導電接觸點位於離子摻雜層之最上層的第一端,且第二 導電接觸點位於離子掺雜層之最上層的第二端。電流經由 第接觸點流入導電堆要結構,並由第二導電接觸點流 出,用以量測作用於磁場感測裝置之水平方向磁場。本發 明更包含多個鄰近於導電堆疊結構旁之隔離區,用以侷限 流經導電堆疊結構内的電流。 δ·4圈式簡單説明: 第一®顯示傳统霍爾(Ha丨丨)感測器β 第二Α圈類示本發明實施例之透視两。 第·一 B圖類示本發明另一實施例之透視圈。 第一 C圈類示第二B國之感測器的剖面囷。 第二DB類示感測器之剖面圈,及電流受到磁場影窨 之路徑。 第二圈類示本發明另一實施例之感測器,用以同時測 量不同方向之磁場。 5-5發明詳编説明: 第二A圖顯示本發明實施例之透視圈,堆要21 包含多層(在本實施例中爲三層)離子摻雜層2〇、22及 24,其摻雜濃度依次減低,也就是説,第一層之捧雜 本紙張度適用中國國家標準(CNS ) A4規格(210X29?公釐) (請先閱讀背面之注意事項再填寫本頁) 裝. 訂 51β949 經濟部中央標準局員工消费合作社印製 Α7 Β7 五、發明説明() 濃度較第二層22高,且第二層22之摻雜濃度較第三層 24高》在本實施例中,係使用N型雜質,第一層2〇之捧 雜濃度爲N ’第一層22之挣雜濃度爲n+,而第三層之4 之摻雜濃度爲N。 第二B圈顯示本發明另一實施例之透視圈,除了 上述之堆4 2 1感測器以外,又使用溝槽1 2或是塡充的溝 榜12以作爲堆要21感測器之間的隔離區。 第二C圈顯示第二B圖之堆疊感測器21之剖兩 圖,此結構係以傳统製程來形成。在本實施例十,實行第 一離子佈植及擴散以形成濃度爲N* +之第一層20,接著 實行第二次離子佈植及擴散以形成濃度爲N+之第二層 22,及第三次離子佈植及擴散以形成濃度爲n之第三屠 24。在本實施例中使用如砷或磷之n型雜質,濃度N + +、 N +及N之摻雜濃度分别爲5E15、5E14及5E13原子 /cm2。參閲第二A圖,堆疊感測器21之長1 1、t; 1 3、 深度1 5分别爲1 〇〇、1 〇及5微米》 當隔離層14(例如墊氧化層)被形成於基底16之 部份表面積後,形成金屬層17以形成接觸黠26及28。 通常完成之堆疊感測器21上面會再覆蓋一層高- μ保護材 質1 8,使得堆疊感測器21不會受到鄰近感測器或半導體 元件的影響。 本紙張尺度適用中國國家榡準(CNS ) M規格(210 X 297公釐) C請先閲讀背面之注意事項再填寫本頁j -訂. 線一 五、發明説明() A7 B7 由於第一層20具有最大的導電性,因此流入接 觸點26的電流會經由第一層20靠近表面部份,再由接觸 點28流出。然而,當施以一垂直磁場時,則路徑會受到 改變·>原先在第一層20内的電流會受到相對於磁場之羅 偷斯(Lorentz)力的影響,使得電子受到往下的力量,而 使得電流流至第二層22 ;甚至當磁場夠強時,將使得電 流流至第三層24 »第二D圖顯示堆疊感測器21之剖面 圈,虚線部份23及25爲電流受到磁場影響之路徑,其中 電流於路徑25所受到的磁場強度大於電流於路徑23所 受到的磁場強度。再者,由於第三層24之阻抗最大,因 此電流於路徑25所受到阻力大於電流於路徑23所受到 阻力。對於每一個磁場強度’都會有一個相對應的阻抗, 且此阻抗可以經由接鲭點26及28之間的電壓、電流比値 得出》 ---------装------訂 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央揉準局員工消費合作社印裝 的阻抗値之後,則堆要感測器21可以作爲一感測器,以 測量外部磁場的強度。當一磁場和第二Α圖之磁場方向相 反時’則可以藉由將電流方向反向而得到。再者,一磁場 和第二A圈之磁場方向成90度時,則可以將堆疊感測器 21水平旋轉90度而得。然而,一種更爲方便的作法係爲 使用第三圈所示的結耩,以同時測量B1磁場及B2磁場方 向’其中’感测器40及42作爲量測兩種磁場方向, 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 線V, i、發明説明() 而感測器44及46則作爲量測兩種B2磁場方向。至於其 他和Β1磁場及Β2磁場成一角度且成水平方向之磁場,也 同樣可以經由感測器40、42、44及46來量測。參閲第 三圖,其中區域41或43係爲溝樯或是填充的溝槽,以作 爲各感測器之間的隔離,使得電流會局限於各個感測器 内。在本發明中,感測器4〇、42、44及46可以用來量 測大約0.5-10高斯(gauss)的磁場強度。 以上所述僅爲本發明之較佳實施例而已,並非用 以限定本發明之申請專利範園;凡其它未脱離本發明所揭 示之猜神下所完成之等效改變或修飾,均應包含在下述之 申請專利範面内。 ----------裝-- (請先閲讀背面之注意事項再填寫本頁) 訂 I. 經濟部中央標準局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4规格(210X297公漦)Eh = Rh, B / A where Rh stands for the Hall coefficient (Hai I coefficient), and A stands for the cross-sectional area of the guide plate "Viran Hall sensors are commonly used to measure the size of the magnetic field, but for the perpendicular to the Huo The magnetic field of the Seoul sensor cannot be easily measured by the following measurement. 5_3 Purpose and Summary of the Invention: Printed by the Employees ’Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back and fill in this page) In the above background of the invention, the conventional sensors have many shortcomings. The main purpose of the present invention is to provide a magnetic field sensing device that can simultaneously measure the magnitude of each component of the magnetic field. The present invention includes at least a conductive stack φ structure formed on a semiconductor substrate. The conductive stacking structure contains at least a number of the paper standards applicable to the Chinese national standard (CMS > A4 specification (210X297 mm), Central Bureau of Standards, Ministry of Economic Affairs, Beigong Consumer Cooperation Du Printing Equipment A7 ― 一 --_____ B7 V. Invention description () Immediately adjacent ion doped layer, and the ion concentration of each layer decreases from top to bottom. The first conductive contact point is located at the first end of the uppermost layer of the ion doped layer, and the second conductive contact point is located at the uppermost layer of the ion doped layer The second end. Current flows into the conductive stack structure through the first contact point and flows out from the second conductive contact point to measure the horizontal magnetic field acting on the magnetic field sensing device. The present invention further includes a plurality of adjacent conductive stack structures The isolation zone next to it is used to limit the current flowing through the conductive stack structure. Δ · 4 turns type brief description: the first ® shows the traditional Hall sensor β second circle type shows the implementation of the invention Examples of perspective two. Figure 1B shows the perspective circle of another embodiment of the present invention. The first circle C shows the cross-section of the sensor of the second country B. The second DB shows the cross-section of the sensor Circle, and the current is magnetized The path of the shadow. The second circle shows the sensor of another embodiment of the invention, which is used to measure the magnetic field in different directions at the same time. 5-5 Detailed description of the invention: The second figure A shows the perspective circle of the embodiment of the invention The stack 21 contains multiple layers (three layers in this embodiment) of ion-doped layers 20, 22, and 24, and their doping concentrations are sequentially reduced. That is to say, the first layer of paper is suitable for China. Standard (CNS) A4 specification (210X29? Mm) (please read the precautions on the back before filling in this page) Pack. Order 51β949 Printed Α7 Β7 by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy V. Description of invention () The second layer 22 is high, and the doping concentration of the second layer 22 is higher than that of the third layer 24. In this embodiment, N-type impurities are used, and the impurity concentration of the first layer 20 is N ′ of the first layer 22 The doping concentration is n +, and the doping concentration of 4 of the third layer is N. The second B circle shows a perspective circle of another embodiment of the present invention, in addition to the above-mentioned stack 4 2 1 sensor, a trench is also used 1 2 or 囡 充 的 沟 榜 12 is used as the isolation area between the sensors of the stack 21. The second C circle display The sectional view of the stacked sensor 21 in the second image B is formed by a conventional process. In the tenth embodiment, the first ion implantation and diffusion are performed to form the first layer 20 with a concentration of N * + , And then perform the second ion implantation and diffusion to form a second layer 22 with a concentration of N +, and the third ion implantation and diffusion to form a third layer 24 with a concentration of n. In this embodiment, such as arsenic is used Or N-type impurities of phosphorus, the doping concentrations of N + +, N + and N are 5E15, 5E14 and 5E13 atoms / cm2, respectively. Refer to the second diagram A, the length of the stacked sensor 21 is 11, t; 1 3. Depth 15 is 100, 10, and 5 microns, respectively. After the isolation layer 14 (eg, pad oxide layer) is formed on part of the surface area of the substrate 16, a metal layer 17 is formed to form contact points 26 and 28 . The finished stacked sensor 21 is usually covered with a layer of high-μ protective material 18 so that the stacked sensor 21 will not be affected by adjacent sensors or semiconductor elements. This paper scale is applicable to China National Standard (CNS) M specifications (210 X 297 mm) C Please read the precautions on the back and then fill out this page j-book. Thread one five, invention description () A7 B7 Due to the first layer 20 has the greatest conductivity, so the current flowing into the contact point 26 will approach the surface portion through the first layer 20, and then flow out from the contact point 28. However, when a vertical magnetic field is applied, the path will be changed. ≫ The current in the first layer 20 will be affected by the Lorentz force relative to the magnetic field, making the electrons under the downward force , So that the current flows to the second layer 22; even when the magnetic field is strong enough, it will cause the current to flow to the third layer 24 »The second D shows the cross-sectional circle of the stacked sensor 21, the dotted parts 23 and 25 are The path of the current affected by the magnetic field, wherein the magnetic field strength of the current on path 25 is greater than the magnetic field strength of the current on path 23. Furthermore, since the impedance of the third layer 24 is the largest, the resistance of the current on the path 25 is greater than the resistance of the current on the path 23. For each magnetic field strength, there will be a corresponding impedance, and this impedance can be obtained from the voltage and current ratio between the connection points 26 and 28 "--------- install ---- --Order (please read the precautions on the back before filling in this page) After the impedance value printed by the Employee Consumer Cooperative of the Central Ministry of Economic Affairs of the Ministry of Economic Affairs, the stack sensor 21 can be used as a sensor to measure the external magnetic field Strength of. When a magnetic field is opposite to the magnetic field direction of the second graph A, it can be obtained by reversing the current direction. Furthermore, when the direction of a magnetic field and the magnetic field of the second circle A are 90 degrees, the stacked sensor 21 can be rotated horizontally by 90 degrees. However, a more convenient method is to use the knot shown in the third circle to simultaneously measure the B1 magnetic field and the B2 magnetic field direction. Among them, the sensors 40 and 42 are used to measure the two magnetic field directions. China National Standard (CNS) A4 specification (210X297mm) Line V, i, description of invention () and sensors 44 and 46 are used to measure two B2 magnetic field directions. As for other magnetic fields that are at an angle to the B1 magnetic field and the B2 magnetic field and are horizontal, they can also be measured by the sensors 40, 42, 44, and 46. Refer to the third figure, where the area 41 or 43 is a trench or a filled trench to serve as an isolation between the sensors, so that the current is limited to each sensor. In the present invention, the sensors 40, 42, 44, and 46 can be used to measure the magnetic field strength of about 0.5-10 gauss. The above are only preferred embodiments of the present invention and are not intended to limit the scope of the patent application for the present invention; all other equivalent changes or modifications that have been completed without departing from the guesswork disclosed by the present invention should be Included in the following patent application. ---------- Installation-- (Please read the precautions on the back before filling out this page) Order I. The paper standard printed by the Employee Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs is applicable to the Chinese National Standard (CNS) A4 Specification (210X297 Gongluo)

Claims (1)

六、申請專利範園 A8 B8 C8 D8 經濟部中央標準局員工消費合作社印製 1· 一種磁場感測裝置,至少包含: 一導電堆疊結構,形成於一半導體基底上,其中該導 電堆疊結構至少包含多數個緊鄭的離子摻雜層,且各離子 掺雜層的離子濃度由上往下遞減; 一第一導電接觸點,位於該多麩個難子摻雜層之最上 層的第一蜷;及 一第二導電接觸點,位於該多數個離子摻雜層之該最 上層的第二端,電流經由該第一接觸點流入該導電堆4結 構,並由該第二導電接觸點流出,一水平方向之磁場作用 於該磁場感測裝置。 2.如申請專利範園第1項之磁場感測裝置,其中上述之離 子摻雜層係以N型離子摻雜。 3·如申請專利範園第1項之磁場感測裝置,其中上述之導 電堆*結構至少包含一第一層,位於該導電堆疊結構之最 上端;一第二層,位於該導電堆疊結構之中間位置;及一 第三層,位於該導電堆疊結構之最底端。 4·如申請專利範圍第3項之磁場感測裝置,其中上述第一 層之濃度约爲5E15原子/cm2,該第二層之濃度约爲5E14 原子/cm2,且該第三層之濃度約爲5E13原子/cm2。 (請先閲讀背面之注意事項再填寫本頁) 裝. 訂 本紙張尺度適用中國國家標隼(CNS)八4規格(210><297公釐) ABCD 316949 六、申請專利範圍 5. 如申請專利範固第3項之磁場感測裝置,其中上述導電 堆疊結構之長度约爲100微米,該導電堆疊結構之宽度约 爲10微米’且該導電堆疊結構之深度約爲5微米β 6. 如申請專利範面第1項之磁場感測裝置,更包含一保護 層,形成於該第一導電接觸點及該第二導電接觸點上。 7_如申請專利範团第1項之磁場感測裝置,更包含多數個 隔離區’郝近於該導電堆疊結構旁,以侷限流經該導電堆 疊結構内的電流。 8.—種磁場感測裝置,至少包含: 一導電堆疊結構,形成於一半導髖基底上,其中該導 電堆垂結構至少包含多數個緊鄰的離子摻雜層,且各離子 摻雜層的離子濃度由上往下遞減; 一第一導電接觸點,位於該多數個離子摻雜層之最上 層的第一端; 一第二導電接觸點,位於該多數個離子摻雜層之該最 上層的第二埃’電流經由該第一接觸點流入該導電堆番結 構’並由該第一導電接觸點流出’ 一水平方向之磁場作用 於該磁場感測裝置;及 多數個隔離區’鄰近於該導電堆疊結構旁,以偈限流 經該導電堆疊結構内的電流。 14 本紙張尺度適用中國國家梯準(CNS )八4規格(21〇><297公釐) {請先閱讀背面之注意事項再填寫本頁} 裝· -訂- 經濟部中央標準局員工消費合作杜印裝 A8 B8 C8 D8 經濟部中央標準局負工消費合作社印装 、申請專利範圍 9如申請專利範圓第8項之磁場感測装置,其中上述之離 子摻雜層係以N型離子掺雜。 10. 如申請專利範園第8項之磁場感測装置,其中上述之 導電堆疊結構至少包含一第一層,位於該導重堆疊結構之 最上端;一第二層,位於該導電堆疊結構之中間位置;及 一第三層’位於該導電堆疊結構之最底端。 11. 如申請專利範固第1〇項之磁場感測裝置,其中上述第 一層之濃度约爲5E15原子/cm2,該第二層之濃度约爲 5E14原子/cm2 ’且該第三層之濃度约爲5E13原子/cm2。 12·如申請專利範園第10項之磁場感測裝置,其中上述導 雹堆疊結構之長度约爲1〇〇微米,該導電堆疊結構之寬度 約爲10微米,且該導電堆疊結構之深度約爲5微米。 13_如申請專利範面第8項之磁場感測裝置,更包含一保 護層,形成於該第一導電接觸點及該第二導電接觸麻上„ 1 4 · 一種磁場感測裝置,至少包含: 多數個導電堆疊結構,形成於一半導體基底上,其中 該導電堆疊結構至少包含多數値緊鄭的離子掺雜層,且各 離子摻雜層的離子濃度由上往下遞減; 本紙張尺度逋用中國國家標率(CNS ) A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本育) •裝. 订 經濟部中央標準局員工消費合作杜印製 A8 δδ C8 ____________D8 六、申請專利範国 ' "~ --- 一第一導電接觸點,位於每一個該導葺堆疊結構之該 多數個離子摻雜層之最上層的第一端;及 一第一導電接觸點,位於每一個該導電堆疊結構之該 多數個離子摻雜層之該最上層的第二端,電流經由該第一 接觸點流入該導電堆疊結構,並由該第二導電接觸點流 出,至少一水平方向之磁場作用於該磁場感測裝置❶ 15. 如申請專利範固第14項之磁場感測裝置,其中上述之 離子掺雜層係以Ν型離子摻雜。 16. 如申請專利範固第14項之磁場感測裝置其中上述之 導電堆疊結構至少包含一第一層,位於該導電堆疊結構之 最上端;一第二層,位於該導貧堆疊結構之中間位置;及 一第三層,位於該導電堆疊結構之最底端。 17. 如申請專利範困第16項之磁場感測裝置,其中上迷第 一層之濃度约爲5Ε15原子/cm2,該第二層之濃度約爲 5E14原子/cm2,且該第三層之濃度約爲5E13原子/cm;}。 1 8.如申請專利範園第1 6項之磁場感測裝置,其中上述導 電堆疊結構之長度约爲1〇〇微米,該導電堆疊結構之定度 約爲10微米,且該導電堆疊結構之深度約爲5微米。 19·如申請專利範圍第14項之磁場感測装置,更包含—保 護層,形成於該第一導電接觸點及該第二導電接觸點上。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) I II 11 11 11 II |,11 ! I 訂!. II i n I^ (請先閲讀背面之注意事項再填寫本頁j —----1 咖 49 A8 B8 C8 D8 々、申請專利範圍 20.如申請專利範圍第14項之磁場感測装置,更包含多數 個隔離區,鄰近於該多數個導電堆疊結構旁’以侷限流經 該導電堆疊結構内的電流。 (請先閱讀背面之注意事項再填寫本頁) 裝. 訂 經濟部中央標準局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐)6. Patent application Fanyuan A8 B8 C8 D8 Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy 1. A magnetic field sensing device, at least comprising: a conductive stack structure formed on a semiconductor substrate, wherein the conductive stack structure contains at least There are a number of tight ion-doped layers, and the ion concentration of each ion-doped layer decreases from top to bottom; a first conductive contact point is located at the first curl of the uppermost layer of the bran-doped sub-layer; And a second conductive contact point, located at the second end of the uppermost layer of the plurality of ion-doped layers, current flows into the conductive stack 4 structure through the first contact point, and flows out from the second conductive contact point, a A horizontal magnetic field acts on the magnetic field sensing device. 2. A magnetic field sensing device as claimed in item 1 of the patent application park, wherein the above-mentioned ion doped layer is doped with N-type ions. 3. The magnetic field sensing device as described in item 1 of the patent application park, wherein the above conductive stack * structure includes at least a first layer located at the uppermost end of the conductive stack structure; a second layer located at the top of the conductive stack structure The middle position; and a third layer at the bottom end of the conductive stack structure. 4. The magnetic field sensing device as claimed in item 3 of the patent application, wherein the concentration of the first layer is about 5E15 atoms / cm2, the concentration of the second layer is about 5E14 atoms / cm2, and the concentration of the third layer is about It is 5E13 atoms / cm2. (Please read the precautions on the back before filling in this page). The size of this paper is applicable to China National Standard Falcon (CNS) 84 specifications (210 > < 297mm) ABCD 316949 VI. Application for patent scope 5. If applying Patent Fan Gu's item 3 magnetic field sensing device, wherein the length of the conductive stack structure is about 100 microns, the width of the conductive stack structure is about 10 microns' and the depth of the conductive stack structure is about 5 microns β 6. The magnetic field sensing device of patent application item 1 further includes a protective layer formed on the first conductive contact point and the second conductive contact point. 7_ The magnetic field sensing device as described in item 1 of the patent application group further includes a plurality of isolation regions near the conductive stack structure to limit the current flowing through the conductive stack structure. 8. A magnetic field sensing device, comprising at least: a conductive stack structure formed on half of the hip guide base, wherein the conductive stack structure includes at least a plurality of immediately adjacent ion-doped layers, and the ions of each ion-doped layer The concentration decreases from top to bottom; a first conductive contact is located at the first end of the uppermost layer of the plurality of ion-doped layers; a second conductive contact is located at the uppermost layer of the plurality of ion-doped layers The second Angstrom current flows into the conductive stack structure through the first contact point and flows out from the first conductive contact point. A horizontal magnetic field acts on the magnetic field sensing device; and a plurality of isolation regions are adjacent to the Next to the conductive stack structure, the current flowing through the conductive stack structure is limited. 14 This paper scale is applicable to China National Standards (CNS) 8.4 specifications (21〇 < 297mm) {Please read the precautions on the back before filling out this page} Consumer Cooperation Du Printed A8 B8 C8 D8 Printed and applied for by the Consumer Labor Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 9 Scope of Patent Application 9 For example, the magnetic field sensing device of patent application No. 8 in which the above-mentioned ion doped layer is N Ion doping. 10. A magnetic field sensing device as claimed in item 8 of the patent application park, wherein the above-mentioned conductive stack structure includes at least a first layer located at the uppermost end of the conductive stack structure; a second layer located at the top of the conductive stack structure The middle position; and a third layer 'is located at the bottom end of the conductive stack structure. 11. The magnetic field sensing device according to patent application No. 10, wherein the concentration of the first layer is about 5E15 atoms / cm2, the concentration of the second layer is about 5E14 atoms / cm2 'and the third layer The concentration is about 5E13 atoms / cm2. 12. The magnetic field sensing device according to item 10 of the patent application park, wherein the length of the hail-guiding stack structure is about 100 microns, the width of the conductive stack structure is about 10 microns, and the depth of the conductive stack structure is about It is 5 microns. 13_ The magnetic field sensing device as described in item 8 of the patent application scope further includes a protective layer formed on the first conductive contact point and the second conductive contact. 1 4 · A magnetic field sensing device, at least comprising : A plurality of conductive stack structures are formed on a semiconductor substrate, wherein the conductive stack structure includes at least a majority of ion-doped layers, and the ion concentration of each ion-doped layer decreases from top to bottom; Use the Chinese National Standard Rate (CNS) A4 specification (210X297mm) (please read the precautions on the back before filling in this education) • Packing. Order A8 δδ C8 ____________D8 for consumer cooperation of the Central Standards Bureau of the Ministry of Economic Affairs. Patent Fan Guo '" ~ --- a first conductive contact point, located at the first end of the uppermost layer of each of the plurality of ion-doped layers of the conductive stack structure; and a first conductive contact point, located at The second end of the uppermost layer of the plurality of ion-doped layers of each conductive stack structure, current flows into the conductive stack structure through the first contact point, and from the second conductive contact At the point of outflow, at least one horizontal magnetic field acts on the magnetic field sensing device ❶ 15. For example, in the magnetic field sensing device of patent application No. 14, the above-mentioned ion doped layer is doped with N-type ions. 16. For example, the magnetic field sensing device of patent application No. 14 in which the above conductive stack structure includes at least a first layer located at the uppermost end of the conductive stack structure; a second layer located at the middle of the poor conductive stack structure; And a third layer, located at the bottom end of the conductive stack structure. 17. For example, in the magnetic field sensing device of patent application No. 16, where the concentration of the first layer is about 5E15 atoms / cm2, the second The concentration of the layer is about 5E14 atoms / cm2, and the concentration of the third layer is about 5E13 atoms / cm;}. 1 8. The magnetic field sensing device according to item 16 of the patent application, wherein the above-mentioned conductive stack structure The length is about 100 micrometers, the certainty of the conductive stack structure is about 10 micrometers, and the depth of the conductive stack structure is about 5 micrometers. 19. The magnetic field sensing device according to item 14 of the patent application scope further includes- Protective layer formed on the first One conductive contact point and the second conductive contact point. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) I II 11 11 11 II |, 11! I ordered !. II in I ^ (please Read the precautions on the back first and then fill out this page j —---- 1 Coffee 49 A8 B8 C8 D8 々, patent application scope 20. For example, the magnetic field sensing device of the patent application scope item 14 contains more isolation areas, Adjacent to the plurality of conductive stack structures to limit the current flowing through the conductive stack structure. (Please read the precautions on the back before filling in this page). Packing. Printed by the Staff Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. The paper size is applicable to China National Standard (CNS) A4 (210X297mm)
TW86102617A 1997-03-04 1997-03-04 Magnetic field detecting device TW316949B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW86102617A TW316949B (en) 1997-03-04 1997-03-04 Magnetic field detecting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW86102617A TW316949B (en) 1997-03-04 1997-03-04 Magnetic field detecting device

Publications (1)

Publication Number Publication Date
TW316949B true TW316949B (en) 1997-10-01

Family

ID=51566794

Family Applications (1)

Application Number Title Priority Date Filing Date
TW86102617A TW316949B (en) 1997-03-04 1997-03-04 Magnetic field detecting device

Country Status (1)

Country Link
TW (1) TW316949B (en)

Similar Documents

Publication Publication Date Title
US5831513A (en) Magnetic field sensing device
US11287490B2 (en) Magnetoresistive sensor with sensing elements and permanent magnet bars oriented at non-orthogonal and non-parallel angles with respect to the sensing direction of the sensing elements
EP2696209B1 (en) Single-chip push-pull bridge-type magnetic field sensor
US7054114B2 (en) Two-axis magnetic field sensor
TWI264739B (en) Magnetic element with an improved magnetoresistance ratio and fabricating method thereof
CN102621504B (en) Monolithic reference full bridge magnetic field sensor
JP6137577B2 (en) Current perpendicular magnetoresistive effect element
TW538429B (en) Semiconductor memory device utilizing tunneling magneto resistive effect and method for manufacturing the same
US9423474B2 (en) Integrated multilayer magnetoresistive sensor and manufacturing method thereof
JPS6393178A (en) Hall device which can be integrated
EP1986015A2 (en) MTJ sensoring including domain stable free layer
US6072382A (en) Spin dependent tunneling sensor
US10930842B2 (en) Multiferroic magnetic tunnel junction devices
WO2012122851A1 (en) Magnetic sensor chip and magnetic sensor
CN107004762B (en) Magnetic tunnel junction
US20030042900A1 (en) Three dimensional conductive strap for a magnetorestrictive sensor.
TW316949B (en) Magnetic field detecting device
EP4256629A1 (en) External magnetic bottom contact structure for mram
JP7207671B2 (en) Magnetic sensor utilizing anomalous Hall effect, Hall sensor, and method for manufacturing Hall sensor
TWI292619B (en) Narrow contact design for magnetic random access memory (mram) arrays
CN103942872B (en) Magnetic picture identification sensor chip in a kind of low fly height face
CN104155620B (en) Magnetic sensing device and its inducing method, preparation technology
Wagner et al. Influence of the cooperative Jahn-Teller effect on the transport and magnetic properties of La 7/8 Sr 1/8 MnO 3 single crystals
WO2022067599A1 (en) Three-axis hall magnetometer
CN203858698U (en) Low-flying height in-plane magnetic image recognition sensor chip

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent