TW301468U - Packaged semiconductor device having stress absorbing film and comb-shaped insulating film - Google Patents

Packaged semiconductor device having stress absorbing film and comb-shaped insulating film

Info

Publication number
TW301468U
TW301468U TW083202104U TW83202104U TW301468U TW 301468 U TW301468 U TW 301468U TW 083202104 U TW083202104 U TW 083202104U TW 83202104 U TW83202104 U TW 83202104U TW 301468 U TW301468 U TW 301468U
Authority
TW
Taiwan
Prior art keywords
comb
semiconductor device
shaped insulating
packaged semiconductor
stress absorbing
Prior art date
Application number
TW083202104U
Other languages
Chinese (zh)
Inventor
Masazumi Amagai
Ichiro Anjo
Junichi Arita
Kunihiro Tsubosaki
Masahiro Ichitani
Darvin Edwards
Thiam Beng Lim
Original Assignee
Hitachi Ltd
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Texas Instruments Inc filed Critical Hitachi Ltd
Priority to TW083202104U priority Critical patent/TW301468U/en
Publication of TW301468U publication Critical patent/TW301468U/en

Links

TW083202104U 1992-03-18 1992-03-18 Packaged semiconductor device having stress absorbing film and comb-shaped insulating film TW301468U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW083202104U TW301468U (en) 1992-03-18 1992-03-18 Packaged semiconductor device having stress absorbing film and comb-shaped insulating film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW083202104U TW301468U (en) 1992-03-18 1992-03-18 Packaged semiconductor device having stress absorbing film and comb-shaped insulating film

Publications (1)

Publication Number Publication Date
TW301468U true TW301468U (en) 1997-03-21

Family

ID=54616535

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083202104U TW301468U (en) 1992-03-18 1992-03-18 Packaged semiconductor device having stress absorbing film and comb-shaped insulating film

Country Status (1)

Country Link
TW (1) TW301468U (en)

Similar Documents

Publication Publication Date Title
EP0504821A3 (en) Packaged semiconductor device having stress absorbing film
KR0136684B1 (en) Semiconductor device and manufacture thereof
GB2269935B (en) Semiconductor device
EP0564204A3 (en) Semiconductor device
EP0594441A3 (en) Semiconductor device
EP0576271A3 (en) Inverter protection device
SG74556A1 (en) Device package
EP0585926A3 (en) Insulated gate semiconductor device
DE69301171D1 (en) Hand strapping device
KR960012648B1 (en) Resin-seal type semiconductor device
GB9425763D0 (en) Semiconductor device
KR0135576B1 (en) Semiconductor device having planerizing insulating film
BR8901393A (en) AEROSOL VALVE DEVICE AND AEROSOL PACKAGE
KR970006537B1 (en) Semiconductor device
EP0551712A3 (en) Semiconductor device with field plates
GB9311146D0 (en) Semiconductor device
EP0730347A3 (en) Semiconductor device
GB2274203B (en) Semiconductor device
EP0486829A3 (en) Semiconductor device and semiconductor device packaging system
GB2283376B (en) Power semiconductor device package
NO932877L (en) Procedure and device for protection
SG49206A1 (en) Semiconductor device
GB9118260D0 (en) Semiconductor device and its manufacture
IT8467614A0 (en) DEVICE FOR UNLOADING AND CLOSING SQUARE PACKAGES
TW335216U (en) Film semiconductor device