鐘濟部中央橾率為負工消费合作社印*. S95559 at B7 五、發明说明（/) 本發明係有闞一個設有至少一道加工光束的材料加 工裝置。在埴加工裝置内·«由一《裝置設計將加工光束 導引至欲進行加工的試樣的表面上的不連鑛位置。逭一《 装置設計在至少一個方向上可受控制。 埴種加工裝置在長久以來已是現有的技術發展水平 。在軟質和硬質的印«镲路板上製作精细孔可使用以下的 加工程序。 Μ普遍為人熟知的機械鑽孔方式，用特別的鑽孔機 可以在印刷嬢路板上同時鑽取高達數百個孔。 埴方式的缺點是由於细小繙頭的機械穩定性受到限 制，可Μ達到的最小孔徑約為200微米。其另一缺黏係由 於鎪孔櫬的形吠構埴•使得緬孔的配置成為固定。鑽孔位 置改變必須花《許多時間重行讕整鑽孔欐的形狀構造。 可以用光化學技術在印刷繚路板上進行塗佈Κ便触 刻出所需要的孔，然而埴一方式的複蟾性是其缺點。更特 別的是必須在印刷嬝路板上塗敷許多次並再剝雛。埴方法 的另一缺點是腐«t班^I#的環境問題，Μ及由於触刻方 法的孔普遍有蝕刻#嫌ώ緣•產生雙球形《孔。 藉由一個晰雷射ϋ蔽層，可用砉當波長的笛射光 束在預先處理a的印刷«路板上"孔。可以作出直徑 僅達嫌届微米的孔。疽方式的缺貼在於：由於屏蔽蹰的结 構使得蟥孔霱有固定的配置•改變鑽孔案檷型需要另一 個屏蔽曆。 使用獨立式霣射光束法•可無需屏蔽歷即可鑕孔和 切削。這雷射光束是被分別導引到每一俪需要«孔的位置 >其明顯的缺黏是需要花费多量的時間才能做出許多孔。 瑄類加工裝置已為人所知•例如美_専利5,268,554 本纸»尺度逋用中_國家標車（CNS ) A4洗格（210X297公釐） 83.3.10,000 ---------^-- <請先閱讀背面之注$項再V寫本頁) 订 線 鍾濟部中央搞準局貝工消费合作社印簟 A7 B7 五、發明说明（2 ) 其中•雷射光束是經由不同的鏑子聚焦於欲加工試揉的表 面。曲射鏡片的位置可藉由致動器在兩個軸的方向上進行 改變*雷射光束可Μ被導引到欲加工試樣上的特定匾域範 園内不連缅工作位置•連績在多個加工位置上進行加工。 其另一個缺點是依雷射光束的«移量•在工件表面上的入 射點•會有不同的大小。 美國專利5,113,0f5揭示另一個材料加工裝置•其 中設有一個由許多縯片前後排列播放姐成的光學系統。» 由逭一個糸統*可MS揮性地連讀移動到工件表面上多個 位置。 美國専利L553f017揭示一個多光束產生裝置，其 中*利用一個光柵•從一個能量光柱產生許多光束*埴些 光束的焦點全部位於一條直镍上。 另一個笛射光束分割裝置是掲示於美圔専利 4f 328 f894。埴裝置能從一道雷射光束内蠹生兩個不連績的 光束，搶擊在工件表面的兩個位置上。埴也可參照歐洲專 利公報 0.360,328、德國專利 4,111,876 和 2,708,039 、和美國專利4,623,776。 美國專利 4,713,518和5,055,653椹示的材料加 工裝置是從一道雷射光束•賴由許多在同一方向上相郾排 列的鏡Η *產生許多不埋纗的笛射光束。 一個材料加工裝置是揭示在美囲専利 4,950,862。 其中，藉由一個霣流計鏡，將一道雷射光束導引到一個透 鏑陣列，這陣列的每一鏡片將一道光束照射到工件表面。 本發明的一個目的是提供一涸材料加工裝置•可在 一工件表面的許多位置上同時進行加工，經由一個«移控 制裝置可以靜態或是動態地改變加工位置。 -3 - 本紙張尺度逋用中围國家橾率（CNS ) A4规格（210X297公釐〉 83.3.10,000 ----------^------iT------体 (請先閱讀背面之注$項再填寫本頁) 經濟部中央#準為Λ工消费合作社印装 A7 B7 五、發明説明（3 > 埴個目檷可經由本發明的申請専利篛第一項的特 戡部分予Μ達成。本發明的其他優酤在申請専利範圔的其 他相闞項目内說明。 疽個對工件表面進行加工的材料加工装置可同時使 用許多不連鑛加工光束，以便能抅進行更快«的工件表面 加工作業。 每一道加工光束被一個傾移裝置的元件予以轉向* 每一個元件被指定用於一個特定的光束，而可由控制装置 在至少一個軸的方向上自由調整特定《移量。 這使得在欲加工試樣的表面上不同位置同時進行加 工的作業成為可能。 可拜由一個控制装置，以目禰测定方式，改變儀移 裝置的個別元件位置•並且可以在至少一個座標方向上， 不連續地移動埴镉移裝置的個別元件，因此可Μ獲得遠超 過目前工藝水平的加工«度和加工能力。新增的加工速度 和加工能力是由於可以靜態（亦即在每一次加工後）或動 戆地（亦即在加工邊程中）改變僱移量所致。 不僅可以在一β位置進行加工•同時可Μ在工件表 面產生镲性结構。 因為在工件表面的許多可自由選擇位置上•可以同 時進行加工作業，依照本發明可Μ獲得更明顯快速的材料 加工裝置•埴些位置不必位於次一工件的相同位置*而可 以自由選擇。 當在傾移裝置前方的加工光束是彼此平行時•可以 沿光束軸的方向移動埴儀移装置*埴種沿光束軸的位移對 工件表面不會產生副作用。 -4 - 本紙浪尺度逋用中•圃家橾率< CNS >Α4规格（210X297公釐） 83.3.10,000 ---------—装------tr------Λ (請先U讀背面之注意事項再填寫本頁) A7 B7 _ 五、發明説明（夺） 將偏移裝置的所有旎轉酤安排在同-*平面以便可Μ 獲得一個緊湊的加工装置是有利的》然而·埴有光學上的 缺點。 相反地•假如傾移裝置的所有元件是排列在一條抛 物線上，則在加工室内的所有光束是Μ«心逸鏡式般行進 •且分佈均勻。埴些優酤也伴鏞著產生每一光束不同截取 距艫造成淸晰度間鼸的缺點。 逭可由將傾移裝置的元件搌放在一钃園上來解決。 埴個圓需與精確落在聚集屏蔽曆中央的聚焦點成同心圆， 且霈將锚移装置的元件的表面製成球面形吠。但埴有高成 本的缺貼。 當來自僱移装置元件的加工光束·是與它們各自的 主光束圼軸平行時·可自由選擇欲逭行加工的表面範·。 然而在掃瞄物鏑和欲加工表面之間的間隔必須_持固定。 繞射元件和/或反射元件可更佳地做為偏移裝置内 的折射元件，它們具有可Μ用現有已知的工藝水平β濟地 生產的優點。 特別是•當偏移装置是由反射元件構成時•對電磁 束有極佳的折射效果*在材科加工上•逭類輻射是非常重 要的。 經濟部中央橾準局貝工消費合作社印装 (請先《讀背面乏注$項再4奉頁) 鏑子是特別適合用做於反射元件》 餳移裝置可以有利地由片段組合成，埴可容許非常 經濟的生產方式。 每一Η段應該能狗在至少一俪座禰軸上或》此一座 欏_移動。除在工件面的一個粬上改變位置之外·逭也能 夠改變每一各自的聚焦貼相對於工件表面的高度。 當逋些片段能夠在一個或兩個座檷粬上或纗座__ 本紙張尺度逋用中Β國家揉率（CNS ) Α4说格（210X297公嫠） 83. 3. 10.000 A7 _ B7 _ 五、發明说明（夕） 移動時•將是非常方便的。逭使得能构對工件表面上的所 有點逭行加工•而不是在一條《上進行黏的加工。此外· 埴也能夠改變每一個偭別的加工光束的聚焦黏的离度。 反射元件的表面可Μ有利地製作成平面的形狀•使 得加工光束的入射線和反射線可以平行地行進•而在軸射 上有最低可能的影響。 一偭成像《鏑可以用一個有利的方式安装在傾移裝 置的後方•使得加工光束能夠儘可能垂直地撞擊在欲加工 工件的表面上。 然而•傾移裝置元件的表面也能夠被製作成特別的 形吠（例如：在使用鏞子的時候）•使得反射光鑲被傾移 裝置元件聚焦在工件表面•因此在某些情況中•即無需掃 瞄物鏡。 雷射光是特別遽合於做為加工用的射鑲•逭是因為 非常優異的低成本雪射光束»引技術已為人熟知。 霣射光鑲提供更進一步的優點：用低成本的透鏡可 Κ很容易地専引和改變它們〇然而*也能使用所有其他可 分割線束，例如：«子束、X射鑲、嘖砂或喷水柱等之類 0 特別是•當加工光鑲是霣射光的時候，則在装置内Printed by the Central Economic Department of Zhongji Ministry of Labor Cooperatives *. S95559 at B7 V. Description of the invention (/) The present invention is a material processing device with at least one processing beam. In the processing device, "the design of the device guides the processing beam to the position of the non-continuous ore on the surface of the sample to be processed." "Yi Yi" The device design can be controlled in at least one direction. The seed processing device has long been an existing technological development level. The following processing procedures can be used to make fine holes on soft and hard printed cymbals. Μ is generally known as the mechanical drilling method. With a special drilling machine, it is possible to drill up to hundreds of holes on the printed board at the same time. The disadvantage of this method is that the mechanical stability of the small turning head is limited, and the smallest pore size that can be achieved is about 200 microns. The other lack of stickiness is due to the shape of the bark-shaped structure. The change of the drilling position must take a lot of time to reshape the shape and structure of the drilling hole. Photochemical techniques can be used to coat K on the printed circuit board and the required holes can be carved out, but the venom nature of this method is its disadvantage. More specifically, it is necessary to coat the printed loop board many times and then peel off the chicks. Another shortcoming of the Cui method is the environmental problem of «t 班 ^ I #. Μ and the holes due to the engraving method are generally etched # annoyed. • A double spherical" hole "is produced. With a clear laser shielding layer, it is possible to use a flute beam of sapphire wavelength on the pre-processed printed «road board " hole. It is possible to make holes with diameters as small as micrometers. The shortcoming of the gangrene method is that: due to the structure of the shield, the hole configuration has a fixed configuration. • Changing the drilling pattern requires another shielding calendar. Use the independent singular beam method. It can drill and cut without shielding the calendar. This laser beam is directed to each position where each hole requires «holes> The obvious lack of stickiness takes a lot of time to make many holes. Xuan processing equipment is already known • For example, the United States _ 専 利 5,268,554 original paper »standard use in the national standard car (CNS) A4 wash grid (210X297 mm) 83.3.10,000 --------- ^ -< Please read the note $ item on the back and then write this page in V) Line booking Zhongji Ministry of Central Affairs Bureau Beigong Consumer Cooperative Inquiry A7 B7 V. Description of invention (2) Among them Dysprosium focuses on the surface to be kneaded. The position of the curved lens can be changed in the direction of the two axes by the actuator * The laser beam can be directed to the specific plaque field on the sample to be processed. Processing at each processing position. Another disadvantage is that depending on the «shift of the laser beam • the incident point on the workpiece surface • will have different sizes. U.S. Patent 5,113,0f5 discloses another material processing device • It has an optical system made up of many actors arranged in front and behind. »From a single system *, MS can move to multiple positions on the surface of the workpiece in a continuous wave. US L553f017 discloses a multi-beam generating device, in which * uses a grating • generates many beams from an energy beam * the focus of some beams is all on a straight nickel. Another device for beam splitting is shown in Meixili 4f 328 f894. The beam device can generate two unsuccessful beams from a laser beam and rush to two positions on the surface of the workpiece. See also European Patent Gazette 0.360,328, German Patent 4,111,876 and 2,708,039, and US Patent 4,623,776. The material processing devices shown in U.S. Patent Nos. 4,713,518 and 5,055,653 are produced from a laser beam. Many mirrors H * arranged in the same direction produce many unburied blaze beams. A material processing device is revealed at Meijili 4,950,862. Among them, a laser beam is used to guide a laser beam to a dysprosium array, and each lens of the array irradiates a beam to the surface of the workpiece. An object of the present invention is to provide a dry material processing device that can process simultaneously at many positions on the surface of a workpiece, and the processing position can be changed statically or dynamically through a «shift control device. -3-This paper adopts the Central Peripheral National Rate (CNS) A4 specification (210X297mm> 83.3.10,000 ---------- ^ ------ iT ------ (Please read the note $ item on the back and then fill out this page) The Ministry of Economic Affairs Central # quasi-printed A7 B7 for Λ industry consumer cooperatives V. Description of invention (3 > A project can be obtained through the application of the invention A special part of a project was reached by M. Other advantages of the present invention are described in other phases of the application of the application. The material processing device that processes the surface of the workpiece can use many non-continuous processing beams at the same time. In order to be able to perform faster workpiece surface processing operations. Each processing beam is diverted by a component of the tilting device * Each component is designated for a specific beam and can be controlled by the control device in the direction of at least one axis Freely adjust the specific shift amount. This makes it possible to perform simultaneous processing operations at different positions on the surface of the sample to be processed. A control device can be used to change the position of individual components of the shift device by visual measurement Can be in at least one seat In the direction of the mark, the individual components of the cadmium transfer device are moved discontinuously, so the processing power and processing capacity far exceeding the current state of the art can be obtained. The new processing speed and processing capacity are due to the static (ie, each After one processing) or moving (that is, in the processing edge) to change the amount of employment. Not only can be processed at a β position • At the same time, cymbals can be produced on the surface of the workpiece. Because there are many on the surface of the workpiece The position can be freely selected • The machining operation can be performed at the same time. According to the present invention, a more obvious and faster material processing device can be obtained. These positions do not have to be in the same position of the next work piece * and can be freely selected. When the processing beams are parallel to each other • The instrument shifting device can be moved in the direction of the beam axis * The displacement of the species along the beam axis will not have a side effect on the surface of the workpiece. -4-This paper wave scale is in use • Pu Jiali rate < CNS > Α4 specification (210X297mm) 83.3.10,000 ---------— installed ---- tr ------ Λ (please read the precautions on the back first and then fill in this Page) A7 B7 _ 5. It is stated that it is advantageous to arrange all the rotation of the offset device in the same-* plane so that a compact processing device can be obtained. However, there are optical disadvantages. On the contrary • If the tilting device All the elements are arranged on a parabola, then all the beams in the processing chamber travel like a mirror-like mirror and are evenly distributed. Some of these excellent features are also accompanied by the production of different intercepts for each beam, resulting in clarity The shortcomings of intermittent reeds can be solved by placing the components of the tilting device on a metal ring. The circle must be concentric with the focus point that accurately falls on the center of the aggregation shield, and the components of the anchoring device should be moved. The surface is made into a spherical bark. However, there are high cost shortfalls. When the processing beams from the components of the hiring device are parallel to the axis of their respective main beams, the surface range to be processed can be freely selected. However, the distance between the dysprosium to be scanned and the surface to be processed must be fixed. The diffractive element and / or the reflective element can preferably be used as a refractive element in the offset device, and they have the advantage that they can be produced economically with the currently known process level β. Especially • when the offset device is composed of reflective elements • has an excellent refraction effect on the electromagnetic beam * in the processing of materials science • radiated radiation is very important. Printed by the Beigong Consumer Cooperative of the Central Bureau of Economic Affairs of the Ministry of Economic Affairs (please first read the "Notes on the Back" and then 4 pages). Dysprosium is particularly suitable for use as a reflective element. The sugar transfer device can be advantageously combined from fragments. Allows very economical production methods. Each H segment should be able to move the dog on at least one of your shafts. In addition to changing the position on a waffle on the workpiece surface, Yau can also change the height of each individual focus patch relative to the workpiece surface. When these fragments can be placed on one or two blocks of rice paddles or squat __ This paper scale is used in the national B rubbing rate (CNS) Α4 said grid (210X297 public daughter) 83. 3. 10.000 A7 _ B7 _ five 2. Description of invention (Xi) When moving • It will be very convenient. It allows you to construct a little bit of machining on the surface of the workpiece • instead of sticking on a strip. In addition, it is also possible to change the focus viscosity of each different processing beam. The surface of the reflecting element can be advantageously made into a planar shape • so that the incident beam and the reflected line of the processing beam can travel in parallel • and have the lowest possible impact on the axial radiation. Yi Imaging "Dysprosium can be installed in an advantageous way behind the tilting device. • The processing beam can hit the surface of the workpiece to be processed as perpendicular as possible. However • The surface of the tilting device element can also be made into a special shape (for example: when using yoke) • The reflected light is focused on the surface of the workpiece by the tilting device element • So in some cases • That is No need to scan the objective lens. The laser light is particularly suitable for the processing of the laser mounting. It is because of the excellent low-cost snow beam beam »The technology is well known. Engraved light mounts provide a further advantage: they can be easily indexed and changed with low-cost lenses. However, all other divisible beams can also be used, for example: «sub-beam, X-ray mount, sand or spray Water column, etc. 0 Especially • When the processing light setting is engraved light, it is in the device
經濟部中央揉準局貝工消费合作社印I (請先W讀背面之注$項再γ j本頁) •對每一加工光束使用一不缠鱭折射透鏑，是特別有利的 0 也可以利用光鼙效應（利用聲波改變腔室内的密度 )的原理作折射。然而*埴並不始终能夠供給所希望的射 線品霣•且很難實規相應的装備小型化。 本«移裝置的另一Λ點在於使用鐃射元件。逭使得 能狗利用平行投射在饑移裝置上的光束•由傾移裝置聚焦 . 在工件表面的光束。 * - 6 - 未紙張尺度適用中B國家棵率（CNS ) A4说格ί 210X297公筹） 83. 3. 10.000 A7 B7 _ 五、發明说明（彡） 埴繞射元件是有利地放置於一反射元件上面或在其 之後•使得它能同時被許多加工光束利用。 一《光束均霣器被有利地設置在雪射器的後方•使 得從雷射器發出的所有加工光束都有相等大小的能量強度 ，如此的光束均質器已被揭示，例如：德圃專利1918,293 。由埴光束均質器•可Μ確定從一雷射光束產生的多數傾 加工光束全部具有相等的強度。 埴雷射器是有利地被驅動以鼷衢吠皤工作•因為： 一方面·齦銜雷射器可以嫌得高的陡量，而較無禊鶫性； 另一方面，ΜΚ衡轜射可Μ執行更準確的表面加工•同時 •防止在工件上產生不受歡迎的热副作用。 可以選定雪射閃光的强度，使得只在工件上去除部 份材料。埴使得可以容許在不同高度的面上*進行表面加 工切削*並且可在加工工件的表面，產生出鑲形结構。 光束分割装置的設置*可W大大減少必須的加工光 束源的數目。逭光束分割裝置可以分期I至少一條以上的加 工光束，成為許多不連鑛的成分單元光束。由埴一方式， 一道強烈的光束被画分為許多較微弱的光束•每一光束都 具有足夠的能量密度。埴使得產生加工光束的成本降低。 經濟部中央梯準局貞工消費合作社印菜 (請先聞讀背面之注意事項再1 .本頁j 埴光束分割裝置是Μ—個有利的方式，安裝在一俪 可受控制的《移裝置的前方。 當光束分別裝置是由許多的透鏑組成時*可以得到 一個非常籣單的構造。 逋種簡犟的構造可由兩個陣列姐成的光束分割装置 得到佐黢。逭兩陣列確保個別的光束在光束分割装置的下 方相互之間有某一空間間隔。 為了能狗儘可能快速地分別對某一β域範矚進行加 f -7 - 本紙張尺度逍用中國國家梂準（CNS ) A4規格（210X297公釐〉 經濟部中失橾準局貝工消费合作社印*. A7 B7 _五、發明说明（7 ) 工•針對加工面•分別加工光束是有利的方式。因此· Μ 可產生二次元分佈的成分翬元光束的透鏞W列來姐成一傾 光束分割裝置是具有優點的。 一個光學放大糸统安裝在光束分剌裝置的後方* Κ 便將加工光束埸的尺寸計算•變捵*用於偏移裝置的尺寸 計算。 加工光束應該有利地Μ —《不太大的角度¢((小於5· )摘擊在欲加工的印刷嬢路板的表面•埴可使得Μ後的電 氣/«子零件的组装變得籣單》 以下將參照附圓所示的較佳實施例，對本發明作詳 细的解鞸，並將描述其他的簠要特微、以及能提供較佳瞭 解的說明、和本發明構想的可能形狀構造。 <式之篛覃說明> 附者： 第一_為整鼸结構的示意_。 第二圈為聚集屏蔽層的细部說明_。 第三_為光束分割装置的側視詳騮。 第四為光束分期I装置的平面視圏。 第五圓為一移透縯元件的底視 <較佳具體實施例之描述> 第一_是依據本發明的可在印躏嬝路板上製作圓孔 圈莱的材料加工装置1實旛例。埴種印刷嬢路板11在謂 子業中·需要有許多變化•作為«氣和《子零件的姐合安 裝_助方法和雄接手段。 材料加工裝置 1霈要能同時具有許多加工光束< 2.11........ 2·1η>，埴些加工光束被全部偏轉至欲加工 ---------^------ir------A { (請先閱讀背面之注$項再稹寫本頁) 本紙张尺度遑用中«國家榉车（CNS > A4規格（2丨〇><297公釐） 83. 3.10,000 五、發明说明u ) 試樣11的表面11a上的各個不連鑛位置。依逭一方式· 在連黷加工的多個試樣 （11, 11', 11'··)的表面11a 應產生的孔或鑲·菜可以是完全地彼此不同。 材料加工装置1具有雷射光束_入装置•逭®射光 束_入装置具有一願微透鏡装置·可產生各別的加工光束 (2.11........2·1η>。埴顏微透鏑裝置被用來當作一個光 束分割裝置4 ·在埴光束分割裝置内•從入射霣射光束 (2.10, 2.10) 產生的許多的個別光束 <2·11.....2.1η) 具有平行的光束路徑。第三和第四圈更詳细地顯示疽光 束分割裝置4 ·埴光束分割装置基本包括前後排列的兩傾 透鏑陣列（4_lf 4·2>·每一陣列設有複數個個別的小鏑Η <4· 11, 4·2|>排列姐合以界定一陣列鏑面。一針孔光櫊板 4·3是安裝在兩«鏑》列（4·1, 4·2>之間·並且具有對 應數目的針孔4·31。 入射霣射光束 <2·10, 2·20>因而被分解成許多成 分睪元光束 <<2.11,...... 2.1n) , (2.21,..., 2.2η)). 彼此有某些空間間隔•改變後方»列4·2的透鏡4·21和 前方陣列4·1的透鏡4·11之間的相對距離可Μ改變成分 單元光束 <<2·11,.··，2·1η), (2_21,···，2.2η> 的光束 經濟部中央樑準局貝工消费合作社印氧 直徑。需要的時候*將致動器設置在支承架4·4内部，或 依照現有技術水平，將整儡支承架4·4規劃成致動器（例 如：壓電致動器*活塞式致動器等）。依此方式，可以改 變兩陣列 （4.1, 4·2>的透鏑<4·11, 4·21>之間的間隔 大小。 視主雪射器2·1發出的雷射光束2·10的發射品質 而定，雷射光束2·10的發射品質可在撞擊到光束分割裝 置之前，依照德國專利3,918,293所述•以透鏡光檷2·3 « - 9 - 83. 3.10,000 (請先Μ讀背面之注意事項再#寫本贾) 本紙張尺度逍用中國國家揉率（CNS ) Μ规格（210Χ297公釐） 經濟部中央輮準局貝工消费合作社印装 A7 B7_五、發明说明（今） 加以均質化，逭透鏔光檷2·3設置有一镅下游装置，可平 行化處理笛射光束2·10。 在主雷射器2·1發出®射光束2·10的時候，檷記 霣射器的笛射光束2·20也同時通過光束分期1装置4。禰 記雷射器2·2是經由光束分戆器 3連接至主笛射器2·1 的光束路媒上。光束分雛器3的外蹰塗佈層•必須被構建 成能讓主雷射器2·1的笛射光束2·10儘可能不受干播地 通過光束分離器3*而僅有最少程度的損失。然而•禰記 霣射器2·2的®射光束2·20是被儘可能完整地结合入主 光束路徑。 由於光束分鐮器3和光束分割装置4的緣故，會 損失某些數量的放射能，笛射光束<2·1(^2·20>會損失 明鼷數量的能最*特別是在光束分割装置4的透鏡4·11 邊緣，和在針孔光欄板4· 3的位置•損失情形尤其明顧。 針孔光橘板4· 3應該依照實嫌需要加以冷卻•明顯的霣射 能量損失特別發生在透鏑陣列4·1的位置，而埴種損失 可經由對陣列4·1的個別鏑片4·11作一最佳化的排列· 而將埴損失減少到最低的程度。 一光學放大糸統5是設置在光束分期裝置4的後 方，埴光學放大系統 5將來自光束分割装置4的光束 ((2.11,...r2.1n), (2.21,...,2. 變更以缠應編移透 鏑裝置6的尺寸。第五_係傾移透鏑装置6的詳细說明 _ 〇 褊移透鏡裝置6基本包含複數價具有反射鏑面的籲 別透鏡元件（6<1>.....6<n>> · «移通鏡装置6能夠經由 三個致動器<6·10, 6·20, 6·30>，分刖在三個軸的方向上 移動。埴些致動器可Μ是壓電晶《或是活塞致動的元件， 295559 (請先閏讀背面之注$項再續窝本買) 本纸張尺度逋用中國國家梯率（CNS ) Α4規格（210Χ297公釐） 83. 3.10,000 M濟部中央榡率為—工消费合作社印*. A7 _B7_ 五、發明説明（丨〇 ) 被《移透鏑裝置6反射的成分單元光束（2·11.....2.1η) ，（2·21,···, 2··2η>撞擊在一個掃瞄物鏑9·埴掃瞄物 «將埴些成分單元光束 <<2·11, ，（2·21, Η聚焦在欲加工工件11的表面Ua。此畤，掃_物鏑 9 確保成分單元光束 （<2·11,···,2·1η>，（2.21...... 2·2η>>垂直成饞乎垂亶地撞擊在欲加工的工件11的表 面 11a 〇 聚集屏蔽暦14安装在掃瞄物鏡9的前方•並收集 所有不意投射至工件表面11a的成分犟元光束U2*1U ··, 2·1η>, (2.21,··,2.2η>>。埴聚集屏敲醑14是被構 建成可令榷擊它的成分單元光束 Π2·1ΐ\ ··, 2.1η), <2·21,··,2·2ηΗ失效。疽脅導致聚集屏敲蹰 14的湛度 明顯上升*因此，應該相應地予以密集冷卻。 另一個光束分離器7裝設在聚集屏蔽層14和掃瞄 物鏑9之間。埴個光束分鐮器 7將一小部分摑擊它的霤 射光 < (2·11, · ·，2·1η> , (2·21，· . ·，2·2η> > 鶴轉朗向一 相機8·2。埴一相機8·2是一髑霄荷耩合器相機•具有 离的解析度*使用埴相機可Μ足夠精確地控制成分犟元光 束 <<2.11,.·,2·1ιΟ,<2·21,··,2·2η> 在欲加工工件 11 表面11a上的位置◊然後•埴相機控制餳移逋鏑装置 6 ，當成分單元笛射光束 <<2·11，··，2·1η>，（2·21，··，2·2η>> 通邊掃瞄物鏑9，衢擊到工件11的表面11a的時候，掃 瞄物鏑9反射回一部份的成分單元光束。适反射回的成分 單元光束 <<2.11, .·, 2·1η>，<2·21, · · ,2·2η> > 再次通 遇揷瞄物鏑9 ·並在光束分饑器 7上折射入第二髑相機 8.1 〇 第二儡相機8·1也是一個霣荷縝合器相供•並且對 • - 11 - 本紙張尺度逋用中國國家橾率（CNS ) A4规格（210X297公釐） 83. 3.10,000 ---------1^.------tr------冰 i. . U (請先聞讀背面之注$項再姨寫本頁) 經濟部中央標準局負工消費合作社印聚 A7 B7 五、發明説明（丨丨） 欲檢視工件11的工作面lla具有足夠大的解析度，可» 由埴«相櫬8·1控制成分單元®射光束<<2·11，·”2·1ηΚ (2·21,··, 2·2ηΠ 在工件表面11a的進展。也藉肋埴相 機，可對加工成分單元光束<<2·11,··,2·η> ， (2.21,.. 2·2η>>落在工件11的表面11a上的實際位置加以判定。 欲加工的工件11本身係安装在可在X-Y平面上移 動工件的一 β X-ϊ載«上。當工件11的尺寸大於加工装 置1所能加工的範時，覦髖12是Μ在结束一表面單位 的加工後，繼續加工下一個酈接的表面單位的方式驅動，載 體12可被調整至高的精確度•使得加工位置的傾移量逮少 於先前提及的設定值。 材料加工装置1的所有可更換元件（2·1, 2·2, 3, 4.2, (6(1),...,6(Ν), 7, 12)都被連接到控制裝置 13 的輸入和_出部份13_1。進而，相機（8·1,8·2>也被連 接至控制裝置的_入部份•控制裝置 13被連接至可更換 元件 <2.1, 2.2, 3, 4.2, <6(1>,..,6<^>,7,12>>以及相 櫬<8·1, 8·2> 。由於逭些速接•控制装置可以接收到個別 可更換元件 <2·1,2.2,3,4·2,(6<1>,··,6<Ν>,7,12 > 致動狀 態的宣告，並能夠以目檷测定的方式調整埴些個別可更換元 件。控制裝置13包含閉環控制嬢路，保證工件11的表面 11a是以所希望的方式進行加工。另外•控制裝置13具 有一 _入部份13*2，以供_入新的加工參數。再者•控制 裝置有至少一個監視器13·3·控制装置13可以調整加工 装置1的連接部份•或者視霱要將光束分離器<%7)禰轉移 出光束路徑。 在中央控制器13内•加工光束產生器的搡作和材料 加工装置1的驅動可被细分為下列的作業棋式： -12 - R1 1 10 000 ----------0------r------^ (請先閱讀背面之注意事項再r ,本萸) A7 B7 五、發明説明（（2 ) 待命搡作； 拥試和監視操作； 操作的設定供式；和 搡作的工作棋式。 在打開«源之後，材料加工裝置即進入澜試和監視 操作•其中，所有連接至控制裝置13的零件都受檢査是 否有故陣。假如沒有故陣，然後控制裝置13將材料加工 裝置1切換至搡作的待命棋式。在此棋式内*所有的零件 是已完成操作準備·但並非在活動狀態。 Μ下將連同操作的設定和工作横式，更進一步說明 本材料加工装置的搡作。 在設定作業裏*控制装置13鼷動座檷台12·並將 欲加工的工件11或其表面11a的一部份·放置在工作匾 域内掃瞄物鏑9的下方，藉由檢視装置8·1·對工件11 的呈現進行檢査，其後·工件11上的圚孔影像是《由目 禰测定笛射光束予以調整如下。 經濟部中央標準局負工消費合作社印製 從控制裝置13啟動工作雷射器2·1產生笛射光束 2·1〇,或是啟動所謂引導定向或目禰测定笛射器2·2。播 釉支承的光束分離器3減弱雷射光束2·10使得它不再對 工件11有任何加工的效果，取而代之的是，僅產生檢視 系統 8·1和8·2可辨識的光點。所謂引導定向或目欏澜 定雪射器2·2經由光束分雛器3傳送一雷射光束2·20進 入材料加工裝置1，埴笛射光束同樣僅在工件11上產生光 黏。 笛射光束2·1或笛射光束2·2此時被鼷微透縯装置 4分解成對應於顧微透鏡數目<4·11, 4·21>的複數個 僩別的成分軍元光束 < <2·η，· · ·，2·1η>，<2·21，· ·，2·2ηΠ -13 - 9,% % tO 000 (請先閲讀背面之注意事項再从本頁) 本紙張尺度適用中國國家棋準（CNS ) Α4说格（210X297公籥） 經濟部中央標準局負工消費合作社印策 A7 _______B7_ 五、發明説明（β ) 。顯微透縯裝置4基本包含顬微透鏞區4·1和4·2以及 一個S間横隔膜4·3。埴種分解作用的發生，主要係«由 顯微透鏡區 4·1和4·2彼此之間的一個癯當安排。個別 的成分單元光束（（2·11,··,2·1η>, (2·21,··,2·2η>> 的 行進路線彼此平行，且是有利地鞴由一放大逋鏡装置5予 Μ掮展放大。 個別成分單元光束 .·, 2.1n), (2.21,. ·2·2η>>現在是明確地彼此分離，但相互之間仍是一固定的 幾何排列。逭些個別的成分單元光束（<2·11,· (2.21,..,2.2η))現在撞擊在用作為傾移透鏡裝置的傾斜 鏡子匾6 ，涸別的傾斜縯子 （6(1>.....6(Ν>>是有利地 固定在傾斜鏑支架内，使得每一儸個別的成分軍元雷射光束 2.1η始終精確地播擊在同一個鏡子6<Ν>上•且對每一面 個別鏡子6(1>至6(Ν>都是如此。 傾斜鏡子裝置6的個別元件，依其個別的置放位置 ，將成分單元雷射光束 <<2·11,··2·1η>, (2·21,··2·2η>> •在正常搡作時反射通過聚集屏蔽層14的開孔，並撞擊 在光束分雄器7。假如不欲令某些成分單元笛射光束撞撃 到工件11上，那麽經由控制裝置13鼷動和移動對應的 傾斜縯子<6<1>,··6(Ν>>，使得成分單元笛射光束<16.1, ···, 16·Μ>被反射至聚集屏蔽》14,然而，需要的光束則 呈一束射線15穿過聚集屏蔽曆開口 （參見第二匾）。 聚集屏蔽層14將撞擊在它上面的成分單元光束 16·ιη <16.1 至 16·Μ> 完全吸收。 在另一方面，光束分離器7引専來自鏑子 • ·6<Ν>)並通逢聚集屏蔽靥14的成分軍元光束 H2.ll, ··, 2.1η), <2.21,··2·2ηΗ的影像，使它們進入檢視系統 8.2,檢視系統評估埴影像，並將结果傳送至控制装置13。 -14 - 本紙張尺度逋用中國國家標準（CNS ) Α4規格（2丨0Χ297公嫠） 81 3 10 000 — — — — — — — — 裝 I 訂— —* I —II ^ (請先Μ讀背*-之注意事項再>*►本頁) Μ濟部中央梂準局貝工消费合作社印製 A7 __ _B7_ 五、發明说明（终） 假如所需要的放射影像和真實放射影像不一致，控制裝置13 能採取一個修正行動·逋當地驅動對應的傾斜鏑子（6(1>, ..,6(N))〇 播瞄物鏑9導引通過光束分離器7的成分單元光束 ..... 2·1η>> ·使它們離開掃瞄物鏑9之後，K呈 适心透鐃式行進，並被聚焦在工件11的表面11a。在搡 作的設定横式中•僅使用低能量的目欏测定光束（1·21至 2·2Ν> 。因此·埴些目檷拥定光束僅在工件11上“能量光 束 （2·1至2·1Ν>稍後將加工的位置”產生光點。埴些 光黏反射在工件11的表面，埴些光點的影像通ift掃瞄物 鏡9和經由光束分離器7被専引至監視系統8·1。在此 處r它們被評估•且將其结果傅送固控制裝置。假如所需要 的放射點影像和在工件11表面11a的實際放射黏影曲不 一致，控制裝置13會作一修正，缠當地驅動對應的傾斜 鏑子（6<1>至6(N>>。所有光點位置的絕對正確性可藉由 出現在工件 11上的檷示物加以檢査*埴些禰示物是被構 建成可被監視糸铳測知8.1。 假如所需要的放射點影像和實際的放射點影像彼此 對應在容許誤差的範圍内，然後操作的設定棋式即被成功 地完成。控制装置13可以自動地或由人工搡作地轉換到 操作的工作棋式中。 在操作的設定镆式褢，傾斜鏑子6(N>是被調整成使 目檷測定雷射器 2.2的射線是在工件11a的設定位置上 上。在操作的加工撗式中•光束分離器3被傾轉離開光束 的路徑（且，假如使用目檷測定雷射器2.2,此時·目禰测 定笛射器將被翮閉，而加工雷射器2.1被啟動）且加工笛 射光束2· 10現在Μ完整的強度，通通進入光學裝置内，通 本紙張尺度遑用中國國家揲率（CNS ) Α4规格（210X297公釐） 83.3.10,000 ----------^------tr------^ - - ί (請先閱讀背面之注$項再填寫本頁) A7 B7 五、發明説明（/5 ) 遇與目禰測定雷射器2·2相同的光學路徑。且穿過聚集屏 蔽層14的雷射光束H2.ll ,··,2.1η)>對工件11進行加 工》 在雷射光束 <2·11,··,2·1η>對工件11上的遘定 位置加工完畢後*再次切換入搡作的設定棋式中。χ-γ座 禰工作台12將欲加工工件 11的下一加工區域移»至掃 瞄物鏑9下方成分單元雷射光束（（2·11, • ·2· 2ηΠ的作業範圃內。此後•目欄测定操作再度開始。 假如在雷射光束（<2·11, ··, 2.1n) , (2.21,.. 2.2η))的作業範園内有比雷射光束 <<2·11,··, 2·1η>, (2.21f_,2_2nH的數目更多的位置需要加工，則在结束 第一個加工步驟後•對應的鏡子被糴動，使成分單元雪射 光束（<2·11,.·,2·1η>, (2.21,··,2·2η>> 被導向所需的 新位置上，而超通需要數目的成分軍元笛射光束（（2.11 ···，2.1η>, <2·21，··，2·2η>> 則被對應的鏡子（6<1>， • 導向聚集屏蔽層14。 或者*當工作雷射器2·1正在搡作的時候，也能夠 移動鏡子 <6(1>----6<ΝΠ ，此一方式下，可在工件11 上或其内部製作出連鑛的结構。 經濟部中央標準局貝工消費合作社印策 (請先閱讀背面之注意事項再*本頁) 波長 248 run的脈街激發雷射器是特別邃合做為工 作雷射器2·1，用於平均厚度50ym«鼸亞胺箔製成的工件 11。這種聚醢亞胺萡是用於印刷線路板11，瑄些印刷嬢路 板是被做為工件來加工的。此_紫外繚雷射器2·1可被控 制以如100至200 Hz的匿衝頻率鼴動。當承受約100次 放射之後•可以穿透此種印刷線路板，而不會在埭路板上產 生干擾热效應。以每涸脈街的能量密度為lJ/sq· cm·每 _ 16 — 本纸張尺Λ逍用中《國家楯牵（CNS > Α4«ϋ ί 210X207公 M濟部中央檬準局Λ工消费合作社印装 A7 _B7_ 五、發明説明（Μ > 50 ym。在光束分割裝置4處的能量損失是在50%大小 程度•但邃當的形狀構造可降低損失。光束分割裝置4·視 形狀構造而定•產生數百個別S射光束（<2·11,..,2.11:0, (2.21, · · ,2.2n> > (例如· 30 X 30， 50 x 50等）。埴些 個別的成分單元雷射光束由偏移透鏑装置6内對應數目的 透鏡元件<6(1>----6(N>>均勻分佈在工件11的表面lla〇 本發明“可在印刷鑲路板上緬孔或去除導·繚路的 材料加工装置"具有Μ下的優黏： 孔徑的下限沒有限制。也就是說，可以作出小達5νιη^ 孔； (b>所讚的孔沒有固定的排列，而是一儺可變化調整的圓 孔彩像； (c>無霱雷射屏藪暦•因此改善雪射光的利用； <d>使用未經處理過的印刷線路板。也躭是沒有跼箔、光 阻材料等的覆Μ暦； <e>消除腐蝕液和其他可能對瓖境有影響的加工程序所引 起的環境間鼸； (f>製成的孔·»何形狀良好。例如•沒有触刻造成的凸 緣； (g>可改變和可自由程式設定的孔影慊； (h>孔影像的孔密度可改變和可自由程式設定； <i>每片印刷嬢路板的孔數目可改變和可自由Μ程式設定Printed by the Beigong Consumer Cooperative Society of the Central Bureau of Economic Development of the Ministry of Economic Affairs (please read the remarks on the back and then γ j this page) • It is particularly advantageous to use a non-wrapped anchovy refraction dysprosium for each processing beam. Use the principle of photoluminescence (using sound waves to change the density in the chamber) for refraction. However, it is not always possible to provide the desired radiation products and it is difficult to plan the corresponding equipment miniaturization. Another point of this «shifting device is the use of a shot element. This enables the dog to use the beam projected parallel on the hungry device. The beam is focused on the workpiece surface by the tilting device. *-6-The B-state tree rate (CNS) A4 said grid 210X297 public fund is not applicable to the paper scale 83. 3. 10.000 A7 B7 _ 5. Description of the invention (彡) The diffraction element is advantageously placed on a reflection Above or behind the component • Make it available for many processing beams at the same time. A "Beam homogenizer is advantageously placed behind the snow launcher so that all the processing beams emitted from the laser have equal energy intensity, such a beam homogenizer has been disclosed, for example: Depu Patent 1918 , 293. By the beam homogenizer, it can be determined that most of the tilting beams generated from a laser beam have the same intensity. The laser is beneficially driven to work with a snarl. Because: On the one hand, the gingival laser can be regarded as a high steepness, and it is less sloppy; on the other hand, Perform more accurate surface processing • At the same time • Prevent undesirable thermal side effects on the workpiece. The intensity of the snow flash can be selected so that only part of the material is removed from the workpiece. It makes it possible to allow surface machining cutting * on surfaces of different heights and to produce a mosaic structure on the surface of the processed workpiece. The setting of the beam splitting device * can greatly reduce the number of necessary processing beam sources. The beam splitting device can stage I at least one or more processing beams and become many unit beams of non-contiguous mines. By the way, a strong beam is divided into many weaker beams • Each beam has sufficient energy density. This reduces the cost of producing the processing beam. Printed dishes of the Zhenggong Consumer Cooperative of the Central Bureau of Economic Affairs of the Ministry of Economic Affairs (please read the precautions on the back and then 1. This page j ゴ Beam splitting device is an advantageous way, installed in a controllable "shift device" The front of the beam. When the beam splitting device is composed of many transparent dysprosiums, a very simple structure can be obtained. The simple structure can be obtained by the beam splitting device formed by the two array sisters. The two arrays ensure individuality The light beams have a certain space between each other under the beam splitting device. In order to be able to add a β-domain fan to each of the dogs as quickly as possible f -7-This paper scale is used by the Chinese National Standard (CNS) A4 size (210X297mm)> Printed by the Ministry of Economic Affairs of the Ministry of Economic Affairs of the Beigong Consumer Cooperatives *. A7 B7 _V. Description of the invention (7) Working • For the processing surface • Processing the beam separately is an advantageous way. Therefore, Μ can be produced The components of the second-element distribution are the advantages of the transmissible beam of the element beam, which is a tilt beam splitter. An optical magnification system is installed behind the beam splitter * Κ will process the size of the beam. Calculate • Change * for the calculation of the size of the offset device. The processing beam should be advantageously Μ-"not too large angle ¢ ((less than 5 ·) picking on the surface of the printed road board to be processed • It can make After Μ electrical / "assembly of sub-components become a list" The following will refer to the preferred embodiment shown in the enclosed circle to make a detailed solution to the present invention, and will describe other essential features and can provide A better understanding of the description, and the possible shapes and structures conceived by the present invention. ≪ Explanation of the expression of the formula > Attachment: The first _ is a schematic representation of the entire structure. The second circle is a detailed description of the aggregate shielding layer. The third _ is the side view detail of the beam splitting device. The fourth is the plane view of the beam staging device I. The fifth circle is the bottom view of a transmission element < description of the preferred embodiment > first _ Is a practical example of a material processing device 1 that can make a round hole ring on a printed road board according to the present invention. The printed road board 11 has many changes in the so-called sub-industry. "Sister-part installation of sub-parts_help method and male connection method. Material processing device 1 At the same time, there are many processing beams < 2.11 ........ 2 · 1η >, some of the processing beams are all deflected to be processed --------- ^ ------ ir-- ---- A {(Please read the note $ item on the back and then write this page) This paper size is used in the «National Beech Car (CNS > A4 specification (2 丨 〇 > < 297mm) 83 . 3.10,000 V. Description of invention u) Each unconnected ore position on the surface 11a of the sample 11. According to the one-in-one method · Multiple samples (11, 11 ', 11' ··) processed in a continuous mill The holes or inlays to be produced on the surface 11a may be completely different from each other. The material processing device 1 has a laser beam_entrance device • 逭 ®ray beam_entry device has a wish microlens device · can produce various processing beams (2.11 ......... 2 · 1η>. The dysprosium microtransparency device is used as a beam splitting device4. Within the beam splitting device • Many individual beams generated from the incident beam (2.10, 2.10) < 2 · 11 ... 2.1η) have parallel beam paths. The third and fourth circles show the beam splitting device in more detail. 4. The beam splitting device basically includes two tilted dysprosium arrays arranged in front and back (4_lf 4 · 2>. Each array is provided with a plurality of individual small dysprosium < 4 · 11, 4 · 2 | > Arrange the sister to define an array of dysprosium surfaces. A pinhole light plate 4 · 3 is installed between the two «dysprosium '' columns (4 · 1, 4 · 2 > · And has a corresponding number of pinholes 4.31. The incident descent beam < 2 · 10, 2 · 20 > is thus decomposed into many constituent test beams < < < 2.11, ...... 2.1n) , (2.21, ..., 2.2η)). There is a certain spatial separation from each other • Change the relative distance between the lens 4 · 21 of the rear »column 4 · 2 and the lens 4 · 11 of the front array 4.1 Change the beam diameter of the component unit beam < < 2 · 11,. ··, 2 · 1η), (2_21, ···, 2.2η >) Ministry of Economic Affairs Central Beam Preparatory Bureau Beige Consumer Cooperative Printed oxygen diameter. When needed * Set the actuator inside the support frame 4 · 4, or according to the state of the art, plan the whole support frame 4 · 4 as an actuator (for example: piezoelectric actuator * piston actuator, etc.). In this way, you can change two bursts (4.1, 4 · 2> Transdysium < 4 · 11, 4 · 21 > The size of the interval between. Depending on the emission quality of the laser beam 2 · 10 emitted by the main snow launcher 2 · 1, the laser The emission quality of the beam 2 · 10 can be in accordance with the German patent 3,918,293 before hitting the beam splitting device • With the lens light filter 2 · 3 «-9-83. 3.10,000 (please read the notes on the back first # Write this book) This paper scale is easy to use the Chinese National Crushing Rate (CNS) Μ specifications (210Χ297 mm) Printed by the Central Bureau of Economic Affairs of the Ministry of Economic Affairs, Beigong Consumer Cooperative A7 B7_V. Description of the invention (present) It is homogenized and passed through The light beam 2 · 3 is provided with an americium downstream device, which can parallelize the flute beam 2 · 10. When the main laser 2 · 1 emits the ® beam 2 · 10, the beam beam of the beam radiator 2 · 20 also passes through the beam staging 1 device 4. Youji laser 2 · 2 is connected to the beam path of the main blaster 2 · 1 via the beam splitter 3. The outer part of the beam splitter 3 Coating layer • Must be constructed so that the main laser 2 · 1 ’s beam 2 · 10 passes through the beam splitter 3 * as dry as possible Loss. However, the beam 2 · 20 of the laser device 2 · 2 is integrated into the main beam path as completely as possible. Due to the beam splitter 3 and the beam splitting device 4, some of the loss The amount of radiant energy, the flute beam < 2 · 1 (^ 2 · 20 >) will lose the most amount of energy. Especially at the edge of the lens 4 · 11 of the beam splitter 4, and at the pinhole light barrier 4 · The position of 3 • The loss situation is especially clear. The pinhole light orange plate 4.3 should be cooled according to the actual needs. Obvious shot energy loss occurs especially in the position of the dysprosium array 4.1, and the loss of species can be achieved through the individual dysprosium 4 of the array 4.1 · Make an optimal arrangement of 11 and reduce the loss of the ballast to the minimum. An optical amplification system 5 is provided behind the beam staging device 4. The optical amplification system 5 converts the light beam from the beam splitting device 4 ((2.11, ... r2.1n), (2.21, ..., 2. Change to fit the size of the transfer dysprosium device 6. The fifth _ is a detailed description of the tilt-transmissive dysprosium device 6 _ The shift lens device 6 basically includes a complex valence lens element with a reflective dysprosium surface (6 < 1 > ..... 6 < n > > «Transmission mirror device 6 can be divided into three axis directions via three actuators < 6 · 10, 6 · 20, 6 · 30 > Move up. Some of the actuators can be piezoelectric crystals or piston-actuated components, 295559 (please read the note on the back first before re-purchasing this book) This paper size uses the national rate of China (CNS) Α4 specification (210Χ297mm) 83. 3.10,000 M Ministry of Central Government rate is printed by the industrial and consumer cooperative *. A7 _B7_ 5. Description of the invention (丨 〇) The component unit reflected by the "Transparent Dysprosium 6 Beam (2 · 11 ..... 2.1η), (2 · 21, ···, 2 ·· 2η > impinge on a scanning object dysprosium 9 · scanning object «will be composed of some component unit beams < < 2 · 11,, (2 · 21, Ηfocus on The surface Ua of the workpiece 11 is processed. In this case, the scan_object dysprosium 9 ensures the component unit beam (< 2 · 11, ···, 2 · 1η >, (2.21 ...... 2 · 2η > > vertical Shockedly hit the surface 11a of the workpiece 11 to be processed. The gathering shield 14 is installed in front of the scanning objective lens 9 and collects all the component beams U2 * 1U that are not projected onto the surface 11a of the workpiece. 2 · 1η >, (2.21, ··, 2.2η > >. The converging screen knockout 14 is constructed to make it possible to attack its component unit beam Π2 · 11 \, 2.1η), < 2 · 21, ··, 2 · 2ηΗ failed. The anthrax threatened the sharpness of the cluster screen knock 14 * Therefore, it should be intensively cooled accordingly. Another beam splitter 7 is installed on the cluster shield 14 and the scanning Between dysprosium 9. A beam splitter 7 slaps a small part of its glare light < (2 · 11, · ·, 2.1η >, (2 · 21, · · ·, 2 · 2η >; > He turned to a camera 8.2. 圴 一 camera 8 · 2 is a 雑 小荷 覩 合 机 camera • has a resolution of * * using the ゴ ゴ camera can be sufficiently accurate to control the composition of the light beam < < 2.11,. ·, 2 · 1ιΟ , < 2 · 21, ··, 2 · 2η > position on the surface 11a of the workpiece 11 to be processed ◊then • the camera controls the sugar-shifting dysprosium device 6, when the component unit radiates the beam < < 2 · 11 , ··, 2 · 1η >, (2 · 21, ··, 2 · 2η > > when the edge scans the object dysprosium 9, when the slam hits the surface 11a of the workpiece 11, the scanning object dysprosium 9 reflects back to one Part of the component beam. The component unit beam suitable for reflection back < < 2.11,. ·, 2 · 1η >, < 2 · 21, ··, 2 · 2η > > again encounters the target dysprosium 9 · and splits the beam 7 is refracted into the second camera 8.1 〇 The second camera 8.1 is also available as a coupler • and right •-11-This paper uses the Chinese National Standard (CNS) A4 specification (210X297 Mm) 83. 3.10,000 --------- 1 ^ .------ tr ------ Bing i.. U (please read the note $ item on the back first Write this page) Printed poly A7 B7 by the Ministry of Economic Affairs Central Standards Bureau Consumer Cooperative V. Invention description (丨 丨) If you want to check the working surface 11 of the work piece 11 has a sufficiently large resolution, you can »Yukun« 相 榇 8 · 1 Control component unit ® beam <2 · 11, · "2 · 1ηΚ (2 · 21, ··, 2 · 2ηΠ progress on the surface of the workpiece 11a. Also with the rib camera, the processing component unit beam <; < 2 · 11, ··, 2 · η >, (2.21, .. 2 · 2η > > The actual position on the surface 11a of the workpiece 11 is determined. The workpiece 11 to be processed itself is installed on the Move a β X-ϊ load of the workpiece on the XY plane «. When the workpiece 11 When the size is larger than the range that the processing device 1 can process, the hip 12 is driven by M after finishing the processing of a surface unit and continuing to process the next attached surface unit. The carrier 12 can be adjusted to a high accuracy The amount of tilting of the processing position is less than the previously mentioned set value. All replaceable elements of the material processing device 1 (2 · 1, 2 · 2, 3, 4.2, (6 (1), ..., 6 ( Ν), 7, 12) are connected to the input and output part 13_1 of the control device 13. Furthermore, the camera (8 · 1,8 · 2> is also connected to the input part of the control device • Control device 13 Connected to replaceable components < 2.1, 2.2, 3, 4.2, < 6 (1 >, .., 6 < ^ >, 7,12 > > and relative components < 8 · 1, 8.2 >;. Because of some quick-connect • The control device can receive individual replaceable components < 2 · 1,2.2,3,4 · 2, (6 < 1 >, ··, 6 < Ν >, 7,12 > Announcement of the actuated state, and the ability to adjust some individual replaceable elements in the form of visual inspection. The control device 13 includes a closed-loop control circuit to ensure that the surface 11a of the workpiece 11 is processed in the desired manner. In addition, the control device 13 has one _In part 13 * 2, for _ into new processing parameters. Furthermore, the control device has at least one monitor 13 · 3 · the control device 13 can adjust the connection part of the processing device 1 • or depending on the vision, the beam splitter <% 7) must be diverted out of the beam path. In the central controller 13 • The operation of the processing beam generator and the driving of the material processing device 1 can be subdivided into the following operations: -12-R1 1 10 000 ---------- 0 ------ r ------ ^ (Please read the precautions on the back before r, this cornel) A7 B7 V. Description of invention ((2) Standby operation; test and monitoring operation; operation Set the supply mode; and work in a chess game. After turning on the «source, the material processing device enters the test and monitoring operation. Among them, all the parts connected to the control device 13 are checked for whether there is a fault. If there is no fault Then, the control device 13 switches the material processing device 1 to a stand-by chess mode. In this chess mode * all the parts are ready for operation, but not in the active state. The settings and work will be carried out together with the operation The horizontal mode further explains the operation of the material processing device. In the setting operation, the * control device 13 moves the pedestal 12 and places the part of the workpiece 11 or its surface 11a to be processed in the work plaque field Scan the lower part of dysprosium 9 and check the presentation of the workpiece 11 by the inspection device 8 · 1 · Afterwards, the image of the hole on the workpiece 11 is "The ray beam is measured by Mie and adjusted as follows. Printed by the Ministry of Economic Affairs, Central Bureau of Standards, Negative Consumer Cooperatives. The laser is activated from the control device 13 to generate the ray beam. 2.10, or start the so-called guided orientation or eye measurement device 2.2.2. The beam splitter 3 supported by the glaze attenuates the laser beam 2.10 so that it no longer has any processing effect on the workpiece 11, Instead, only the light spots identifiable by the inspection systems 8.1 and 8.2 are generated. The so-called guided orientation or deflecting light transmitter 2 · 2 transmits a laser beam 2 · 20 through the beam splitter 3 to enter In the material processing device 1, the flute beam also produces light adhesion only on the workpiece 11. The flute beam 2 · 1 or the flute beam 2 · 2 is now decomposed into the number corresponding to the number of micro lenses ; 4 · 11, 4 · 21 > a plurality of different component junyuan beams < < 2 · η, ···, 2 · 1η >, < 2 · 21, ··, 2 · 2ηΠ -13 -9,%% tO 000 (Please read the precautions on the back and then from this page) This paper size is applicable to China National Chess Standard (CNS) Α4 说 格 (210X 297 public fund) Printed by the Negative Consumers Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs A7 _______B7_ V. Description of the invention (β). The microscopic transillumination device 4 basically includes the microscopic translucent areas 4 · 1 and 4 · 2 and an S-diaphragm 4 · 3. The occurrence of the decomposition of the main species is mainly caused by the arrangement of the microlens regions 4 · 1 and 4 · 2 between each other. The individual component beams ((2 · 11, ··, 2 The travel paths of 1η >, (2 · 21, ··, 2 · 2η > > are parallel to each other, and are advantageously magnified by a magnifying mirror device 5. Individual component beams. ·, 2.1n), (2.21,. · 2 · 2η> > are now clearly separated from each other, but still have a fixed geometric arrangement between them. Only some individual component beams (<; 2 · 11, · (2.21, .., 2.2η)) is now hitting the tilting mirror plaque 6 used as a tilting lens device, and the other tilting actors (6 (1> ..... 6 (Ν >; > is advantageously fixed in the tilted dysprosium support, so that each 㑩 individual component army laser beam 2.1η always accurately hits the same mirror 6 < Ν > 1 > 6 (Ν > is the same. The individual elements of the tilting mirror device 6, according to their individual placement positions, the component unit laser beam < < 2 · 11, ·· 2 · 1η >, (2 · 21, · 2 · 2η > > • During normal operation, the reflection passes through the opening of the aggregation shielding layer 14 and strikes the beam splitter 7. If you do not want to make some component beams hit by the beam On the workpiece 11, then the tilting actors < 6 < 1 >, ·· 6 (Ν > >, corresponding to the movement and movement of the control device 13 so that the component unit radiates the beam < 16.1, ···, 16 Μ> is reflected to the gathering shield "14, however, the required beam of light passes through the opening of the gathering shield in the form of a ray 15 (see the second plaque). The gathering shield layer 14 will strike the component beam 16 on it ιη < 16.1 to 16.M > completely absorbed. On the other hand, the beam splitter 7 draws from dysprosium • 6 < Ν >) and gathers the component army element beam H2.ll, which gathers the shielded Ta 14 ·, 2.1η), < 2.21, ·· 2 · 2ηΗ images, so that they enter the inspection system 8.2, the inspection system evaluates the image, and transmits the results to the control device 13. -14-This paper scale uses the country of China Standard (CNS) Α4 specifications (2 丨 0Χ297 public daughter) 81 3 10 000 — — — — — — — — Pack I order — — * I —II ^ (please read the back *-the precautions before then >> ►This page) Printed A7 by the Beigong Consumer Cooperative of the Central Bureau of Economic Development of the Ministry of Economic Affairs __ _B7_ V. Description of the Invention (End) If the required radiographic image and the real radiographic image are inconsistent, the control device 13 can take a corrective action. Drive the corresponding tilted dysprosium (6 (1>, .., 6 (N)). Broadcast target dysprosium 9 The component beams directed through the beam splitter 7... 2 · 1η > · After moving them away from the scanning object dysprosium 9, K travels in a prudent manner and is focused on the surface 11a of the workpiece 11 . In the set horizontal mode of the operation, only the low-energy objective measurement beam (1 · 21 to 2.2N>) is used. Therefore, some of the objective beams only hold the “energy beam (2.1-1 to 2 · 1Ν> The spot will be processed later to generate a light spot. The light is reflected on the surface of the workpiece 11, and the image of the light spot is scanned through the objective lens 9 and passed through the beam splitter 7 to the monitoring system. 8.1. Here they are evaluated and the results are sent to the solid-state control device. If the required radiation point image is not consistent with the actual radiation viscosity on the surface 11a of the workpiece 11, the control device 13 will make a correction , Drive the corresponding tilted dysprosium (6 < 1 > to 6 (N > >). The absolute correctness of all the light spot positions can be checked by the display on the workpiece 11 * some display It is constructed so that it can be monitored by the monitor 8.1. If the required radiation point image and the actual radiation point image correspond to each other within the allowable error range, then the operation setting chess pattern is successfully completed. The control device 13 Can be switched to operation automatically or manually In the operation chess mode. In the operation setting mode, the tilted dysprosium 6 (N > is adjusted so that the beam of the laser measurement 2.2 is at the set position of the workpiece 11a. In the operation process mode Middle • The beam splitter 3 is tilted away from the path of the beam (and, if using a telescope to measure the laser 2.2, then the Muji measuring lance will be shut down and the processing laser 2.1 will be activated) and Processing the flute beam 2 · 10 now has a complete intensity, and it enters into the optical device, and the paper standard adopts the Chinese national rate (CNS) Α4 specification (210X297 mm) 83.3.10,000 -------- -^ ------ tr ------ ^--ί (please read the $ item on the back and then fill in this page) A7 B7 5. Description of the invention (/ 5) The same optical path as the laser 2 · 2. And the laser beam H2.ll, ··, 2.1η) that passes through the collective shield layer 14> processing the workpiece 11 "in the laser beam < 2 · 11, · ·, 2 · 1η> After finishing the fixed position on the workpiece 11, * switch to the setting chess mode again. The XY-table table 12 moves the next processing area of the workpiece 11 to be processed » Scan the laser beam of the component unit under the dysprosium 9 ((2 · 11, • · 2 · 2ηΠ in the operating range. After that • the target column measurement operation starts again. If the laser beam (< 2 · 11, · ·, 2.1n), (2.21, .. 2.2η)) There are more than laser beams < < 2 · 11, ··, 2 · 1η >, (2.21f_, 2_2nH If the position needs to be processed, after the first processing step is completed, the corresponding mirror is moved to make the snow beam of the component unit (< 2 · 11,. ·, 2 · 1η >, (2.21, ··, 2 · 2η > > is directed to the new position required, and the super pass requires a number of component corps whistle beams ((2.11 ···, 2.1η >, < 2 · 21, ··, 2 · 2η > >; Then it is directed to the gathering shield layer 14 by the corresponding mirror (6 < 1 >). Or * when the working laser 2 · 1 is working, it can also move the mirror < 6 (1 > ---- 6 < ΝΠ, in this way, a connection can be made on the workpiece 11 or inside The structure of the mine. The policy of the Beigong Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the precautions on the back before * this page) The pulse street laser with a wavelength of 248 run is particularly suitable as a working laser 2 1. Used for workpieces with an average thickness of 50 μm «imide foil. This polyimide is used for printed circuit boards 11, and some printed circuit boards are processed as workpieces. This _ The UV laser 2 · 1 can be controlled to move at an impulse frequency such as 100 to 200 Hz. After about 100 times of radiation • It can penetrate this printed circuit board without being generated on the road board Disturb the thermal effect. Take the energy density of each street as lJ / sq · cm · each _16 — the size of the paper is used in the book "National Frame (CNS > Α4« ϋ 210X207 Gong M Department Central Lemon A7 _B7_ printed by the quasi-bureau Λ industry consumer cooperative. V. Description of the invention (Μ > 50 ym. The energy loss at the beam splitting device 4 is 50% Degree • However, the proper shape and structure can reduce the loss. Beam splitting device 4. Depends on the shape and structure • Generates hundreds of individual S beams (< 2 · 11, .., 2.11: 0, (2.21, ·,, 2.2n > (e.g. 30 X 30, 50 x 50, etc.). The individual component laser beams are shifted by the corresponding number of lens elements in the dysprosium device 6 < 6 (1 > ---- 6 (N > > uniformly distributed on the surface 11a of the work piece 11 The present invention "a material processing device that can bore holes or remove guides on the printed panel board" " with excellent adhesion under M: the lower limit of the pore size is not Restrictions. That is to say, it is possible to make holes as small as 5νιη ^; (b > the holes praised do not have a fixed arrangement, but a circular image of circular holes that can be adjusted and adjusted; (c > No image laser screen 舮 暦 • Therefore, the utilization of snow beams is improved; < d > Use of untreated printed circuit boards. It is also covered with no foil, photoresist, etc .; < e > Eliminate corrosive liquids and other possible environmental hazards Environmental interferon caused by influential machining procedures; (f > made holes · »He has a good shape. For example • No bumps caused by engraving Margin; (g > hole shadows that can be changed and freely programmable; (h > hole density of hole images can be changed and freely programmable; < i > the number of holes in each printing plate can be changed and adjustable Free M program settings
I 減少加工時間； <k)可在印刷嬢路板的表面製作構造。例如，製作導體鑲 路； <1>臢孔位置有高的精確度； 9 - 17 - 本纸張尺度逍用中國國家梂準（CNS ) A4规格（210X297公釐） 83.3.10,000 ---------&------tr------终 ' ί (請先閱讀背面之注$項再填寫本賈) 295569 A7 B7_ 五、發明説明（（7 ) <πι>使用不同的笛射器和霤射光波長；Μ及 <η>能夠被併入一條加工裝Β» ·加工装配鑲上的工件可 以移動進入和雕開加工工作站。 (請先"讀背面之注$項再填寫本買) 在上述的較佳《豳例中 > 初始時若將許多蟈別的成 分單元光束（（2·11,·.,2·1η>, <2·21，··，2·2η> 引入材料 加工裝置1*則可省略光束分割装置4。所使用的射束 Η2·11,··2·1η>, (2.21,..,2.211))不必如同前述的實豳 例K及附圖所示般使用雷射光束•任何可镉移轉向的射束 都可使用。例如•對於«轉有困難的射束*可將放射束的 產生直接放置在偏移装置6的地方•當有傾轉時•此類發 射的能量攢失太大•例如•嗔水柱的嗔嘴或用於霣射器發 射的雷射二植tt。 最後•本發明的資現至少需包含一或多儸產生加工 射束<2·11,的裝置•以及一儡魍於導引《別射束 的裝置6。 雷射光束（2·10, 2·20>的前述用法廚豪生钃別的 成分單元光束 Π2· 11,的方法 留有許多可能性。直接或隨後給予埴些個別的成分單元光 束 < (2·11, · · ,2·1η> ,<2·21, · . ,2·2η> > —個使彼此平行的 經濟部中*標率扃貝工消费合作社中装 調整，使得它們彼此間有一個明確的間隕·個別的成分單 元光束 Η2.11,··,2.1η>,(2·21,Λ,2·2ηΜ可以用許多方 式產生（光檷、光束分鐮器等）且可在稍後形成。此刻在 較佳實施例中所討諭和解釋的，僅是最簡睪且最有效的方 法。一具有鏞當頻率和能量密度的雷射二《«陣列（也躭 是*表面排列的雪射二極體）在將來應會成為一種產生加 工射束 <<2·11,··,2·1η>,<2·21,··,2·2η>> 的具有》爭力 的方法。锾如來自光束分割装置4的加工射束<2·11,··， 83.3.10,000 本紙張尺度逋用中國家標率（CNS ) Α4規格（210Χ297公釐） M濟部中央橾率局員工消费合作社印装 A7 B7_五、發明说明（冴〉 2·1η>已經具有所需要的截面大小•則在光束分割裝置4 下游的擴展适鏡装置5可被省略。 當在欲加工表面11a外部的傾移裝置6將加工射 束 （（2·11，··，2·1η>,儀移轉向至一 «應合此加工射束的 面積S域時，可將聚集屏蔽曆14省略》 當有足构的加工時間，或是在加工期間可容許不精 確的放射光摑擊•或是假如巳可保證光束偏移始终是以所 希望（傾移裝置的控制）的方式進行•兩個射束控制相櫬 (8·1, 8·2>的其中之一可被省略。 當在邊緣部位可容許材料的傾斜加工•或是欲加工 面Ua的尺寸可容許的時候•可以省略播瞄物鏞9。 當欲加工面11a絕不會大於偏移装置6的反射容 曇時*可省略載物台。 即使使用霣射光束<<2·11---- 2.1n), (2.21,.., 2·2η>>·實際的僱移裝置6可能看起來不同。其他巳知類 型的射束僑移（例如•用於S射光束的平面透鏑或旋轉光 楔）可用來取代反射面•使用繞射黼意諝較大的能ft攢失 0 當工作霣射器2·1巳被光束分鑲器3充分減弱· 以判別工件面 Ua上的光束位置時，可省略指示笛射器 2.2〇 射束的截面形狀不必須如_所示般為圆形•依照目 前已知的工藝水平所能獲得的任何形狀》可使用。 搏瞄物鏡 6不必然包含兩緬彼此前後排列的适鏑 (9·1, 9.2>>而是，在放射轴和與其垂直的座檷軸上的透 鏡數目可Μ改變》 當光束分期I裝置4的作用被其他裝置（例如：被锚 移裝置6)取代時，可省略此一光束分割裝置。 * - 19 - ----------A------tr------珠 (請先閱讀背面之注$項再填寫本頁) 本纸張尺度遑用中_國家橾率（CNS ) Μ规格（21〇Χ297公釐） 83.3.10,000I Reduce processing time; < k) Can make structure on the surface of the printed road board. For example, making conductor inlays; < 1 > The location of the holes has high accuracy; 9-17-This paper scale is easy to use China National Standards (CNS) A4 specifications (210X297 mm) 83.3.10,000 --- ------ & ------ tr ------ End 'ί (please read the $ item on the back before filling in Benja) 295569 A7 B7_ V. Description of the invention ((7) < πι > Use different irradiators and glare wavelengths; Μ and < η > can be incorporated into a processing assembly B »· The workpieces assembled in the processing assembly can be moved into and carved out of the processing workstation. (Please first " Read the note $ item on the back and then fill in the purchase.) In the above-mentioned "Big Example"> Initially, if many beams of other elementary units are combined ((2 · 11, ·., 2 · 1η >, < 2 · 21, ··, 2 · 2η> Introduction of the material processing device 1 * can omit the beam splitting device 4. The beam used is H2 · 11, ·· 2 · 1η>, (2.21, .., 2.211)) Use the laser beam as shown in the previous example K and the drawings. Any beam that can be turned by cadmium can be used. For example, for «difficult beams *, the generation of the radiation beam can be placed directly in Offset 6 places • When there is a tilt • The energy of such launches is too large to be lost • For example • The nipple of the water column or the laser diode used for the launch of the laser launcher tt. Finally • The present invention requires at least cash Contains one or more devices that produce the processing beam < 2 · 11, and a device that guides the "different beam 6. The previous usage of the laser beam (2 · 10, 2 · 20 > There are many possibilities for the method of generating component beams Π2 · 11 for other components. Direct or subsequent individual component beams are given < (2 · 11, ··, 2 · 1η >, < 2 · 21 , · .2 · 2η >-an adjustment of the economy of the Ministry of Economic Affairs, which is parallel to each other, to adjust them so that they have a clear interval between each other. · Individual component beams H2.11 , ··, 2.1η >, (2 · 21, Λ, 2 · 2ηΜ can be produced in many ways (optical filter, beam splitter, etc.) and can be formed later. At this moment, it is discussed in the preferred embodiment and Explained, it is only the simplest and most effective method. A laser with frequency and energy density of Yung Dang II «Array (also arbitrarily * surface arrangement Snow-emitting diode) in the future should become a kind of production beam < < 2 · 11, ··, 2 · 1η >, < 2 · 21, ··, 2 · 2η > > Competitive method. For example, the processing beam from the beam splitting device 4 < 2 · 11, ··, 83.3.10,000 The paper standard adopts the Chinese National Standard Rate (CNS) A4 specification (210 × 297 mm) M Department A7 B7_Published by the Central Consumer ’s Bureau Consumer Cooperative. V. Description of the invention (冴> 2 · 1η> already has the required cross-sectional size. • The extended mirror suitable device 5 downstream of the beam splitting device 4 can be omitted. When the tilting device 6 outside the surface to be processed 11a shifts the processing beam ((2 · 11, ··, 2 · 1η>, instrument shifts to a «field S area that should fit this processing beam, you can change Convergence shielding calendar 14 is omitted. "When there is sufficient processing time, or inaccurate slamming of the emitted light can be tolerated during processing. Or if it is possible to ensure that the beam deviation is always as desired (control of the tilting device) The two beam control phases (8 · 1, 8 · 2 > one of them can be omitted. When the edge of the material can be allowed to be inclined processing • Or the size of the surface Ua to be processed is acceptable When it is possible to omit the target sight 9. When the surface 11a to be processed is never greater than the reflection capacity of the offset device 6, * the stage can be omitted. Even if using a dazzling beam < < 2 · 11 --- -2.1n), (2.21, .., 2 · 2η> > · The actual employment shifting device 6 may look different. Other known types of beam shifting (e.g. • Planar dysprosium for S-beams Or rotating optical wedge) can be used to replace the reflective surface. • Use a diffractive beam, which means that the larger one can save 0 ft. When the working reflector 2 · 1 is split by the beam The device 3 is sufficiently weakened. In order to determine the position of the beam on the workpiece surface Ua, the indicator beam 2.2 can be omitted. The cross-sectional shape of the beam does not have to be circular as shown in the figure. Any shape "can be used. The objective lens 6 does not necessarily include two suitable dysprosiums arranged in front of each other (9.1, 9.2 > > instead, the number of lenses on the radiation axis and the sac axis perpendicular thereto can be Μ Change》 When the role of the beam staging I device 4 is replaced by other devices (for example, by the anchor shifting device 6), this beam splitting device can be omitted. *-19----------- A- ----- tr ------ beads (please read the note $ item on the back and then fill in this page) This paper is in use _ National Standard Rate (CNS) Μ Specification (21〇Χ297mm) 83.3.10,000