TW291604B - The manufacturing method of glass diaphragm in wafer microstructure - Google Patents

The manufacturing method of glass diaphragm in wafer microstructure

Info

Publication number
TW291604B
TW291604B TW84106953A TW84106953A TW291604B TW 291604 B TW291604 B TW 291604B TW 84106953 A TW84106953 A TW 84106953A TW 84106953 A TW84106953 A TW 84106953A TW 291604 B TW291604 B TW 291604B
Authority
TW
Taiwan
Prior art keywords
wafer
manufacturing
glass
diaphragm
glass diaphragm
Prior art date
Application number
TW84106953A
Other languages
Chinese (zh)
Inventor
Dong-Shing Wuu
Jong-Ru Shieh
Huey-Fen Wu
Gwo-Long Lei
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW84106953A priority Critical patent/TW291604B/en
Application granted granted Critical
Publication of TW291604B publication Critical patent/TW291604B/en

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Abstract

A manufacturing method of glass diaphragm in wafer microstructure is used for silicon wafer with a groove, includes: - Form a glass layer on wafer and groove by flame hydrolysis deposition; - Consolidate the glass into the glass diaphragm, which binds tightly with wafer and contracts into part of diaphragm main body in groove position.
TW84106953A 1995-07-04 1995-07-04 The manufacturing method of glass diaphragm in wafer microstructure TW291604B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW84106953A TW291604B (en) 1995-07-04 1995-07-04 The manufacturing method of glass diaphragm in wafer microstructure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW84106953A TW291604B (en) 1995-07-04 1995-07-04 The manufacturing method of glass diaphragm in wafer microstructure

Publications (1)

Publication Number Publication Date
TW291604B true TW291604B (en) 1996-11-21

Family

ID=51398341

Family Applications (1)

Application Number Title Priority Date Filing Date
TW84106953A TW291604B (en) 1995-07-04 1995-07-04 The manufacturing method of glass diaphragm in wafer microstructure

Country Status (1)

Country Link
TW (1) TW291604B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8018032B2 (en) 2008-12-31 2011-09-13 Unimicron Technology Corp. Silicon substrate and chip package structure with silicon base having stepped recess for accommodating chip

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8018032B2 (en) 2008-12-31 2011-09-13 Unimicron Technology Corp. Silicon substrate and chip package structure with silicon base having stepped recess for accommodating chip

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees