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Application filed by Oji Yuka Goseikami Co LtdfiledCriticalOji Yuka Goseikami Co Ltd
Priority to TW085101092ApriorityCriticalpatent/TW290674B/en
Application grantedgrantedCritical
Publication of TW290674BpublicationCriticalpatent/TW290674B/en
A label for inmold forming wherein the back side of a thermoplastic resin substrate film (I) having been printed on the surface thereof is applied with a heat-sealing resin layer (II) having a melting point lower than that of the resin material of the film, the heat-sealing layer been applied with 5 to 25 lines of embossment every 2.54 cm and the depth of the valley portion of the embossment being 1 to 8 (muon)m and corresponding to 1/3 of the thickness of the heat-sealing resin.
TW085101092A1996-01-291996-01-29Label for inmold forming with embossment
TW290674B
(en)