TW290674B - Label for inmold forming with embossment - Google Patents

Label for inmold forming with embossment

Info

Publication number
TW290674B
TW290674B TW085101092A TW85101093A TW290674B TW 290674 B TW290674 B TW 290674B TW 085101092 A TW085101092 A TW 085101092A TW 85101093 A TW85101093 A TW 85101093A TW 290674 B TW290674 B TW 290674B
Authority
TW
Taiwan
Prior art keywords
embossment
label
heat
inmold
forming
Prior art date
Application number
TW085101092A
Other languages
Chinese (zh)
Inventor
Akihiko Ono
Takatoshi Nishizawa
Maki Shiina
Junichi Yasuda
Gen Ikeno
Original Assignee
Oji Yuka Goseikami Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oji Yuka Goseikami Co Ltd filed Critical Oji Yuka Goseikami Co Ltd
Priority to TW085101092A priority Critical patent/TW290674B/en
Application granted granted Critical
Publication of TW290674B publication Critical patent/TW290674B/en

Links

Abstract

A label for inmold forming wherein the back side of a thermoplastic resin substrate film (I) having been printed on the surface thereof is applied with a heat-sealing resin layer (II) having a melting point lower than that of the resin material of the film, the heat-sealing layer been applied with 5 to 25 lines of embossment every 2.54 cm and the depth of the valley portion of the embossment being 1 to 8 (muon)m and corresponding to 1/3 of the thickness of the heat-sealing resin.
TW085101092A 1996-01-29 1996-01-29 Label for inmold forming with embossment TW290674B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW085101092A TW290674B (en) 1996-01-29 1996-01-29 Label for inmold forming with embossment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW085101092A TW290674B (en) 1996-01-29 1996-01-29 Label for inmold forming with embossment

Publications (1)

Publication Number Publication Date
TW290674B true TW290674B (en) 1996-11-11

Family

ID=51398270

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085101092A TW290674B (en) 1996-01-29 1996-01-29 Label for inmold forming with embossment

Country Status (1)

Country Link
TW (1) TW290674B (en)

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