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Application filed by Ind Tech Res InstfiledCriticalInd Tech Res Inst
Priority to TW82105913ApriorityCriticalpatent/TW288040B/en
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Publication of TW288040BpublicationCriticalpatent/TW288040B/en
A single axial adhesive for united the IC with multi-spacer conductive ends and the substrate with multi-conductive circuits together, the adhesive includes: Less than 10 wt% compressible conductive hollow metal grain andnon-conductive resin which can uniform the metal grain.
TW82105913A1993-07-221993-07-22The single axial adhesives for sticking IC with circuit substrate
TW288040B
(en)
Electronic component and semiconductor device, method for manufacturing the same, circuit board have the same mounted thereon, and electronic equipment having the circuit board