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Application filed by Nippon Paint Co LtdfiledCriticalNippon Paint Co Ltd
Priority to TW80108289ApriorityCriticalpatent/TW285816B/en
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Publication of TW285816BpublicationCriticalpatent/TW285816B/en
Non-Metallic Protective Coatings For Printed Circuits
(AREA)
Abstract
Method of production of solder masked electric circuit boards, which includes: - Form a circuit on substrate; - Coat a negative photosensitive weld-resist on circuit board; - Expose negative film under the light and develop; the features are: the negative photosensitive weld-resist can electrolyze and the coating of weld-resist is transferred to base by conductivity and processed on circuit board.
TW80108289A1991-10-211991-10-21Production of solder masked electric circuit boards
TW285816B
(en)