TW284891B - - Google Patents
Info
- Publication number
- TW284891B TW284891B TW84110072A TW84110072A TW284891B TW 284891 B TW284891 B TW 284891B TW 84110072 A TW84110072 A TW 84110072A TW 84110072 A TW84110072 A TW 84110072A TW 284891 B TW284891 B TW 284891B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US27714594A | 1994-07-19 | 1994-07-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW284891B true TW284891B (US06368395-20020409-C00050.png) | 1996-09-01 |
Family
ID=23059580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW84110072A TW284891B (US06368395-20020409-C00050.png) | 1994-07-19 | 1995-09-26 |
Country Status (2)
| Country | Link |
|---|---|
| TW (1) | TW284891B (US06368395-20020409-C00050.png) |
| WO (1) | WO1996002941A1 (US06368395-20020409-C00050.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109478517A (zh) * | 2016-07-04 | 2019-03-15 | 三菱电机株式会社 | 半导体装置及其制造方法 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6096576A (en) * | 1997-09-02 | 2000-08-01 | Silicon Light Machines | Method of producing an electrical interface to an integrated circuit device having high density I/O count |
| US6303986B1 (en) | 1998-07-29 | 2001-10-16 | Silicon Light Machines | Method of and apparatus for sealing an hermetic lid to a semiconductor die |
| US6785001B2 (en) | 2001-08-21 | 2004-08-31 | Silicon Light Machines, Inc. | Method and apparatus for measuring wavelength jitter of light signal |
| US7046420B1 (en) | 2003-02-28 | 2006-05-16 | Silicon Light Machines Corporation | MEM micro-structures and methods of making the same |
| WO2008134935A1 (fr) | 2007-04-29 | 2008-11-13 | Beijing Wantai Biological Pharmacy Enterprise Co., Ltd. | Protéines 18 l1 de type papillomavirus humain tronqué |
| US9698116B2 (en) | 2014-10-31 | 2017-07-04 | Nxp Usa, Inc. | Thick-silver layer interface for a semiconductor die and corresponding thermal layer |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4141029A (en) * | 1977-12-30 | 1979-02-20 | Texas Instruments Incorporated | Integrated circuit device |
| US4291815B1 (en) * | 1980-02-19 | 1998-09-29 | Semiconductor Packaging Materi | Ceramic lid assembly for hermetic sealing of a semiconductor chip |
| US4331258A (en) * | 1981-03-05 | 1982-05-25 | Raychem Corporation | Sealing cover for an hermetically sealed container |
| US4601958A (en) * | 1984-09-26 | 1986-07-22 | Allied Corporation | Plated parts and their production |
| US4666796A (en) * | 1984-09-26 | 1987-05-19 | Allied Corporation | Plated parts and their production |
| JPS61204953A (ja) * | 1985-03-08 | 1986-09-11 | Sumitomo Metal Mining Co Ltd | ハ−メチツクシ−ルカバ−及びその製造方法 |
| US4640438A (en) * | 1986-03-17 | 1987-02-03 | Comienco Limited | Cover for semiconductor device packages |
| JPS635550A (ja) * | 1986-06-25 | 1988-01-11 | Mitsubishi Electric Corp | 半導体装置 |
| US4737418A (en) * | 1986-12-22 | 1988-04-12 | Advanced Materials Technology Corp. | Nickel clad corrosion resistant lid for semiconductor package |
| US4835067A (en) * | 1988-01-21 | 1989-05-30 | Electro Alloys Corp. | Corrosion resistant electroplating process, and plated article |
| US4842961A (en) * | 1988-03-04 | 1989-06-27 | Advanced Materials Technology Corp. | Alternate electrolytic/electroless-layered lid for electronics package |
| US5045639A (en) * | 1990-08-21 | 1991-09-03 | Tong Hsing Electronic Industries Ltd. | Pin grid array package |
-
1995
- 1995-07-19 WO PCT/US1995/009124 patent/WO1996002941A1/en unknown
- 1995-09-26 TW TW84110072A patent/TW284891B/zh active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109478517A (zh) * | 2016-07-04 | 2019-03-15 | 三菱电机株式会社 | 半导体装置及其制造方法 |
| CN109478517B (zh) * | 2016-07-04 | 2020-02-21 | 三菱电机株式会社 | 半导体装置及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO1996002941A1 (en) | 1996-02-01 |
