TW284791B - - Google Patents
Info
- Publication number
- TW284791B TW284791B TW083102381A TW83102381A TW284791B TW 284791 B TW284791 B TW 284791B TW 083102381 A TW083102381 A TW 083102381A TW 83102381 A TW83102381 A TW 83102381A TW 284791 B TW284791 B TW 284791B
- Authority
- TW
- Taiwan
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/02—Alloys based on gold
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/50—Alloying conductive materials with semiconductor bodies
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9888293 | 1993-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW284791B true TW284791B (online.php) | 1996-09-01 |
Family
ID=14231528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW083102381A TW284791B (online.php) | 1993-03-31 | 1994-03-18 |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR0157474B1 (online.php) |
| GB (1) | GB2276632B (online.php) |
| SG (1) | SG44578A1 (online.php) |
| TW (1) | TW284791B (online.php) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5945065A (en) * | 1996-07-31 | 1999-08-31 | Tanaka Denshi Kogyo | Method for wedge bonding using a gold alloy wire |
-
1994
- 1994-03-18 TW TW083102381A patent/TW284791B/zh active
- 1994-03-22 KR KR1019940005746A patent/KR0157474B1/ko not_active Expired - Fee Related
- 1994-03-24 GB GB9405839A patent/GB2276632B/en not_active Expired - Fee Related
- 1994-03-24 SG SG1996003005A patent/SG44578A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| GB9405839D0 (en) | 1994-05-11 |
| GB2276632A (en) | 1994-10-05 |
| SG44578A1 (en) | 1997-12-19 |
| KR940022687A (ko) | 1994-10-21 |
| GB2276632B (en) | 1996-02-28 |
| KR0157474B1 (ko) | 1998-12-01 |