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Application filed by United Microelectronics CorpfiledCriticalUnited Microelectronics Corp
Priority to TW83111787ApriorityCriticalpatent/TW283253B/en
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Publication of TW283253BpublicationCriticalpatent/TW283253B/en
Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure
(AREA)
Thin Film Transistor
(AREA)
Abstract
A coating PR method for pre-formed element area pattern on the surface of semiconductor panel, includes: Dehydrate bake on semiconductor panel; Reflow bake for surface hardness process after forming the first PR layer; and Soft bake process after forming 2nd PR layer above the first PR layer, thus complete the PR coating method.
TW83111787A1994-12-171994-12-17The method for coating photo resist
TW283253B
(en)