TW280017B - - Google Patents
Info
- Publication number
- TW280017B TW280017B TW084107113A TW84107113A TW280017B TW 280017 B TW280017 B TW 280017B TW 084107113 A TW084107113 A TW 084107113A TW 84107113 A TW84107113 A TW 84107113A TW 280017 B TW280017 B TW 280017B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/24145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06524—Electrical connections formed on device or on substrate, e.g. a deposited or grown layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06541—Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06551—Conductive connections on the side of the device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S269/00—Work holders
- Y10S269/903—Work holder for electrical circuit assemblages or wiring systems
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S269/00—Work holders
- Y10S269/909—Work holder for specific work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/914—Transfer or decalcomania
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/14—Layer or component removable to expose adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/14—Layer or component removable to expose adhesive
- Y10T428/1438—Metal containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/14—Layer or component removable to expose adhesive
- Y10T428/1481—Dissimilar adhesives
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/252,794 US5517754A (en) | 1994-06-02 | 1994-06-02 | Fabrication processes for monolithic electronic modules |
Publications (1)
Publication Number | Publication Date |
---|---|
TW280017B true TW280017B (zh) | 1996-07-01 |
Family
ID=22957579
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW084107113A TW280017B (zh) | 1994-06-02 | 1995-07-10 |
Country Status (3)
Country | Link |
---|---|
US (2) | US5517754A (zh) |
JP (1) | JP3245006B2 (zh) |
TW (1) | TW280017B (zh) |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5696030A (en) * | 1994-09-30 | 1997-12-09 | International Business Machines Corporation | Integrated circuit contacts having improved electromigration characteristics and fabrication methods therefor |
US5521434A (en) * | 1994-10-17 | 1996-05-28 | International Business Machines Corporation | Semiconductor chip and electronic module with integrated surface interconnects/components |
US5673478A (en) * | 1995-04-28 | 1997-10-07 | Texas Instruments Incorporated | Method of forming an electronic device having I/O reroute |
US5657537A (en) * | 1995-05-30 | 1997-08-19 | General Electric Company | Method for fabricating a stack of two dimensional circuit modules |
US5691248A (en) * | 1995-07-26 | 1997-11-25 | International Business Machines Corporation | Methods for precise definition of integrated circuit chip edges |
US5851845A (en) * | 1995-12-18 | 1998-12-22 | Micron Technology, Inc. | Process for packaging a semiconductor die using dicing and testing |
US5706218A (en) * | 1996-05-15 | 1998-01-06 | Intel Corporation | Random number generator |
US5935763A (en) * | 1996-06-11 | 1999-08-10 | International Business Machines Corporation | Self-aligned pattern over a reflective layer |
US5656552A (en) * | 1996-06-24 | 1997-08-12 | Hudak; John James | Method of making a thin conformal high-yielding multi-chip module |
DE19626126C2 (de) * | 1996-06-28 | 1998-04-16 | Fraunhofer Ges Forschung | Verfahren zur Ausbildung einer räumlichen Chipanordnung und räumliche Chipanordung |
US6881611B1 (en) | 1996-07-12 | 2005-04-19 | Fujitsu Limited | Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device |
EP1189271A3 (en) * | 1996-07-12 | 2003-07-16 | Fujitsu Limited | Wiring boards and mounting of semiconductor devices thereon |
EP2270845A3 (en) | 1996-10-29 | 2013-04-03 | Invensas Corporation | Integrated circuits and methods for their fabrication |
US6498074B2 (en) | 1996-10-29 | 2002-12-24 | Tru-Si Technologies, Inc. | Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners |
US6882030B2 (en) | 1996-10-29 | 2005-04-19 | Tru-Si Technologies, Inc. | Integrated circuit structures with a conductor formed in a through hole in a semiconductor substrate and protruding from a surface of the substrate |
JPH10335383A (ja) * | 1997-05-28 | 1998-12-18 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
US5892287A (en) * | 1997-08-18 | 1999-04-06 | Texas Instruments | Semiconductor device including stacked chips having metal patterned on circuit surface and on edge side of chip |
US6235551B1 (en) | 1997-12-31 | 2001-05-22 | Micron Technology, Inc. | Semiconductor device including edge bond pads and methods |
US6005776A (en) * | 1998-01-05 | 1999-12-21 | Intel Corporation | Vertical connector based packaging solution for integrated circuits |
FR2783354B1 (fr) * | 1998-08-25 | 2002-07-12 | Commissariat Energie Atomique | Procede collectif de conditionnement d'une pluralite de composants formes initialement dans un meme substrat |
US6291894B1 (en) * | 1998-08-31 | 2001-09-18 | Micron Technology, Inc. | Method and apparatus for a semiconductor package for vertical surface mounting |
US6391220B1 (en) | 1999-08-18 | 2002-05-21 | Fujitsu Limited, Inc. | Methods for fabricating flexible circuit structures |
US6984571B1 (en) | 1999-10-01 | 2006-01-10 | Ziptronix, Inc. | Three dimensional device integration method and integrated device |
US6500694B1 (en) * | 2000-03-22 | 2002-12-31 | Ziptronix, Inc. | Three dimensional device integration method and integrated device |
US6448106B1 (en) | 1999-11-09 | 2002-09-10 | Fujitsu Limited | Modules with pins and methods for making modules with pins |
US6322903B1 (en) | 1999-12-06 | 2001-11-27 | Tru-Si Technologies, Inc. | Package of integrated circuits and vertical integration |
US6902987B1 (en) | 2000-02-16 | 2005-06-07 | Ziptronix, Inc. | Method for low temperature bonding and bonded structure |
US6774315B1 (en) | 2000-05-24 | 2004-08-10 | International Business Machines Corporation | Floating interposer |
US6563133B1 (en) * | 2000-08-09 | 2003-05-13 | Ziptronix, Inc. | Method of epitaxial-like wafer bonding at low temperature and bonded structure |
US6777261B2 (en) | 2000-12-26 | 2004-08-17 | Micron Technology, Inc. | Method and apparatus for a semiconductor package for vertical surface mounting |
US6486415B2 (en) | 2001-01-16 | 2002-11-26 | International Business Machines Corporation | Compliant layer for encapsulated columns |
US6717254B2 (en) | 2001-02-22 | 2004-04-06 | Tru-Si Technologies, Inc. | Devices having substrates with opening passing through the substrates and conductors in the openings, and methods of manufacture |
US20020117753A1 (en) * | 2001-02-23 | 2002-08-29 | Lee Michael G. | Three dimensional packaging |
AU2002332937A1 (en) * | 2001-09-07 | 2003-03-24 | Irvine Sensors Corporation | Stacking of multilayer modules |
US6717061B2 (en) * | 2001-09-07 | 2004-04-06 | Irvine Sensors Corporation | Stacking of multilayer modules |
US6787916B2 (en) | 2001-09-13 | 2004-09-07 | Tru-Si Technologies, Inc. | Structures having a substrate with a cavity and having an integrated circuit bonded to a contact pad located in the cavity |
US6848177B2 (en) | 2002-03-28 | 2005-02-01 | Intel Corporation | Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme |
US6908845B2 (en) * | 2002-03-28 | 2005-06-21 | Intel Corporation | Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme |
US20030183943A1 (en) * | 2002-03-28 | 2003-10-02 | Swan Johanna M. | Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme |
US7152291B2 (en) | 2002-04-15 | 2006-12-26 | Avx Corporation | Method for forming plated terminations |
US7109092B2 (en) | 2003-05-19 | 2006-09-19 | Ziptronix, Inc. | Method of room temperature covalent bonding |
US6998703B2 (en) * | 2003-12-04 | 2006-02-14 | Palo Alto Research Center Inc. | Thin package for stacking integrated circuits |
TW200924148A (en) * | 2007-11-26 | 2009-06-01 | Ind Tech Res Inst | Structure of three-dimensional stacked dies with vertical electrical self-interconnections and method for manufacturing the same |
KR20090129791A (ko) * | 2008-06-13 | 2009-12-17 | 가부시키가이샤 교토 소프트웨어 리서치 | 다치 플래시 메모리 |
US8330262B2 (en) | 2010-02-02 | 2012-12-11 | International Business Machines Corporation | Processes for enhanced 3D integration and structures generated using the same |
US8012802B2 (en) * | 2010-02-04 | 2011-09-06 | Headway Technologies, Inc. | Method of manufacturing layered chip package |
JP2015001459A (ja) * | 2013-06-17 | 2015-01-05 | セイコーエプソン株式会社 | 機能素子、電子機器、および移動体 |
US9583410B2 (en) * | 2014-03-21 | 2017-02-28 | International Business Machines Corporation | Volumetric integrated circuit and volumetric integrated circuit manufacturing method |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3370203A (en) * | 1965-07-19 | 1968-02-20 | United Aircraft Corp | Integrated circuit modules |
US4646128A (en) * | 1980-09-16 | 1987-02-24 | Irvine Sensors Corporation | High-density electronic processing package--structure and fabrication |
US4551629A (en) * | 1980-09-16 | 1985-11-05 | Irvine Sensors Corporation | Detector array module-structure and fabrication |
JPS6135547A (ja) * | 1984-07-27 | 1986-02-20 | Nec Corp | 三次元実装回路モジユ−ル |
US4706166A (en) * | 1986-04-25 | 1987-11-10 | Irvine Sensors Corporation | High-density electronic modules--process and product |
JPS63186457A (ja) * | 1987-01-29 | 1988-08-02 | Hitachi Ltd | 半導体装置及びその製造方法 |
US4983533A (en) * | 1987-10-28 | 1991-01-08 | Irvine Sensors Corporation | High-density electronic modules - process and product |
US4794092A (en) * | 1987-11-18 | 1988-12-27 | Grumman Aerospace Corporation | Single wafer moated process |
US5107586A (en) * | 1988-09-27 | 1992-04-28 | General Electric Company | Method for interconnecting a stack of integrated circuits at a very high density |
US5104820A (en) * | 1989-07-07 | 1992-04-14 | Irvine Sensors Corporation | Method of fabricating electronic circuitry unit containing stacked IC layers having lead rerouting |
US5128749A (en) * | 1991-04-08 | 1992-07-07 | Grumman Aerospace Corporation | Fused high density multi-layer integrated circuit module |
US5135556A (en) * | 1991-04-08 | 1992-08-04 | Grumman Aerospace Corporation | Method for making fused high density multi-layer integrated circuit module |
US5270261A (en) * | 1991-09-13 | 1993-12-14 | International Business Machines Corporation | Three dimensional multichip package methods of fabrication |
US5266833A (en) * | 1992-03-30 | 1993-11-30 | Capps David F | Integrated circuit bus structure |
US5347428A (en) * | 1992-12-03 | 1994-09-13 | Irvine Sensors Corporation | Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip |
-
1994
- 1994-06-02 US US08/252,794 patent/US5517754A/en not_active Expired - Fee Related
-
1995
- 1995-04-27 US US08/429,992 patent/US5614277A/en not_active Expired - Fee Related
- 1995-05-29 JP JP13017395A patent/JP3245006B2/ja not_active Expired - Fee Related
- 1995-07-10 TW TW084107113A patent/TW280017B/zh active
Also Published As
Publication number | Publication date |
---|---|
JPH0845871A (ja) | 1996-02-16 |
JP3245006B2 (ja) | 2002-01-07 |
US5614277A (en) | 1997-03-25 |
US5517754A (en) | 1996-05-21 |