TW278225B - - Google Patents
Info
- Publication number
- TW278225B TW278225B TW084109579A TW84109579A TW278225B TW 278225 B TW278225 B TW 278225B TW 084109579 A TW084109579 A TW 084109579A TW 84109579 A TW84109579 A TW 84109579A TW 278225 B TW278225 B TW 278225B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/124—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed the encapsulations having cavities other than that occupied by chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US33222294A | 1994-10-31 | 1994-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW278225B true TW278225B (https=) | 1996-06-11 |
Family
ID=23297264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW084109579A TW278225B (https=) | 1994-10-31 | 1995-09-13 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0709884A2 (https=) |
| JP (1) | JPH08213525A (https=) |
| KR (1) | KR960016668A (https=) |
| AU (1) | AU3452895A (https=) |
| CA (1) | CA2160495A1 (https=) |
| TW (1) | TW278225B (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI771217B (zh) * | 2020-10-29 | 2022-07-11 | 雙鴻科技股份有限公司 | 流體散熱裝置 |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0768711A3 (en) * | 1995-10-13 | 1998-07-08 | AT&T Corp. | Microelectronic package with device cooling |
| GB2313960A (en) * | 1996-06-08 | 1997-12-10 | Marconi Gec Ltd | Heat sink including a cooling pipe having a planar section |
| US6891385B2 (en) | 2001-12-27 | 2005-05-10 | Formfactor, Inc. | Probe card cooling assembly with direct cooling of active electronic components |
| US7064953B2 (en) | 2001-12-27 | 2006-06-20 | Formfactor, Inc. | Electronic package with direct cooling of active electronic components |
| US6771500B1 (en) | 2003-03-27 | 2004-08-03 | Stmicroelectronics, Inc. | System and method for direct convective cooling of an exposed integrated circuit die surface |
| DK200301577A (da) | 2003-10-27 | 2005-04-28 | Danfoss Silicon Power Gmbh | Flowfordelingsenhed og köleenhed |
| US6992381B2 (en) | 2003-10-31 | 2006-01-31 | Intel Corporation | Using external radiators with electroosmotic pumps for cooling integrated circuits |
| US7364684B2 (en) * | 2004-08-16 | 2008-04-29 | Delphi Technologies, Inc. | Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels |
| US7205653B2 (en) | 2004-08-17 | 2007-04-17 | Delphi Technologies, Inc. | Fluid cooled encapsulated microelectronic package |
| DE102009055717A1 (de) * | 2009-11-26 | 2011-06-01 | Continental Automotive Gmbh | Sensormodul und Herstellungsverfahren eines Sensormoduls |
| EP2605345B1 (en) * | 2011-12-13 | 2021-04-28 | Alcatel Lucent | Thermal management of photonics assemblies |
| US9961798B2 (en) | 2013-04-04 | 2018-05-01 | Infineon Technologies Austria Ag | Package and a method of manufacturing the same |
| US9449895B2 (en) * | 2013-05-03 | 2016-09-20 | Infineon Technologies Ag | Cooling system for molded modules and corresponding manufacturing methods |
| US9613885B2 (en) | 2015-03-03 | 2017-04-04 | Infineon Technologies Ag | Plastic cooler for semiconductor modules |
| JP7075837B2 (ja) * | 2018-06-29 | 2022-05-26 | 三菱重工業株式会社 | 半導体素子の冷却構造及び電子デバイスの冷却構造 |
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1995
- 1995-09-13 TW TW084109579A patent/TW278225B/zh active
- 1995-10-13 CA CA002160495A patent/CA2160495A1/en not_active Abandoned
- 1995-10-18 EP EP95307428A patent/EP0709884A2/en not_active Withdrawn
- 1995-10-27 AU AU34528/95A patent/AU3452895A/en not_active Abandoned
- 1995-10-30 JP JP7303406A patent/JPH08213525A/ja active Pending
- 1995-10-30 KR KR1019950039469A patent/KR960016668A/ko not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI771217B (zh) * | 2020-10-29 | 2022-07-11 | 雙鴻科技股份有限公司 | 流體散熱裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CA2160495A1 (en) | 1996-05-01 |
| EP0709884A2 (en) | 1996-05-01 |
| AU3452895A (en) | 1996-05-09 |
| KR960016668A (ko) | 1996-05-22 |
| JPH08213525A (ja) | 1996-08-20 |