TW273042B - - Google Patents

Info

Publication number
TW273042B
TW273042B TW82111089A TW82111089A TW273042B TW 273042 B TW273042 B TW 273042B TW 82111089 A TW82111089 A TW 82111089A TW 82111089 A TW82111089 A TW 82111089A TW 273042 B TW273042 B TW 273042B
Authority
TW
Taiwan
Application number
TW82111089A
Other languages
Chinese (zh)
Original Assignee
Mex Kk
Kitoku Gakuen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4306147A external-priority patent/JPH07105427B2/ja
Application filed by Mex Kk, Kitoku Gakuen filed Critical Mex Kk
Application granted granted Critical
Publication of TW273042B publication Critical patent/TW273042B/zh

Links

TW82111089A 1992-10-19 1993-12-28 TW273042B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4306147A JPH07105427B2 (ja) 1992-10-19 1992-10-19 半導体材料のライフタイム評価方法とその装置

Publications (1)

Publication Number Publication Date
TW273042B true TW273042B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1996-03-21

Family

ID=51397140

Family Applications (1)

Application Number Title Priority Date Filing Date
TW82111089A TW273042B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-10-19 1993-12-28

Country Status (1)

Country Link
TW (1) TW273042B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10641708B2 (en) 2015-03-18 2020-05-05 Sumco Corporation Method of evaluating semiconductor substrate and method of manufacturing semiconductor substrate
US11415525B2 (en) 2018-02-16 2022-08-16 Hamamatsu Photonics K.K. Carrier lifespan measurement method and carrier lifespan measurement device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10641708B2 (en) 2015-03-18 2020-05-05 Sumco Corporation Method of evaluating semiconductor substrate and method of manufacturing semiconductor substrate
US11415525B2 (en) 2018-02-16 2022-08-16 Hamamatsu Photonics K.K. Carrier lifespan measurement method and carrier lifespan measurement device
TWI797254B (zh) * 2018-02-16 2023-04-01 日商濱松赫德尼古斯股份有限公司 載子壽命測定方法及載子壽命測定裝置

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees