TW273036B - Eject molding method of semiconductor device and device thereof - Google Patents

Eject molding method of semiconductor device and device thereof

Info

Publication number
TW273036B
TW273036B TW83111455A TW83111455A TW273036B TW 273036 B TW273036 B TW 273036B TW 83111455 A TW83111455 A TW 83111455A TW 83111455 A TW83111455 A TW 83111455A TW 273036 B TW273036 B TW 273036B
Authority
TW
Taiwan
Prior art keywords
mold
compound
nozzle
cured
molding method
Prior art date
Application number
TW83111455A
Other languages
Chinese (zh)
Inventor
Yi-Jiing Chen
Hann-Jong Shyong
Guang-Hann Lin
Yeong-Lin Wang
Original Assignee
Generall Instr Of Taiwan Ltd
Kras Asia Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Generall Instr Of Taiwan Ltd, Kras Asia Ltd filed Critical Generall Instr Of Taiwan Ltd
Priority to TW83111455A priority Critical patent/TW273036B/en
Application granted granted Critical
Publication of TW273036B publication Critical patent/TW273036B/en

Links

Abstract

An eject molding method of semiconductor device comprises the steps of: under the control of one pressure device installed in one nozzle, making compound eject into mold hole in one mold via one gate channel from the nozzle; separating nozzle and mold when the compound in gate channel is cured; moving mold to another workstation to make compound in mold hole cured, in the same time, nozzle continuing ejecting compound into another mold; and performing cleaning and unloading process when compound in mold hole is cured.
TW83111455A 1994-12-09 1994-12-09 Eject molding method of semiconductor device and device thereof TW273036B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW83111455A TW273036B (en) 1994-12-09 1994-12-09 Eject molding method of semiconductor device and device thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW83111455A TW273036B (en) 1994-12-09 1994-12-09 Eject molding method of semiconductor device and device thereof

Publications (1)

Publication Number Publication Date
TW273036B true TW273036B (en) 1996-03-21

Family

ID=51397138

Family Applications (1)

Application Number Title Priority Date Filing Date
TW83111455A TW273036B (en) 1994-12-09 1994-12-09 Eject molding method of semiconductor device and device thereof

Country Status (1)

Country Link
TW (1) TW273036B (en)

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