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Application filed by Generall Instr Of Taiwan Ltd, Kras Asia LtdfiledCriticalGenerall Instr Of Taiwan Ltd
Priority to TW83111455ApriorityCriticalpatent/TW273036B/en
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An eject molding method of semiconductor device comprises the steps of: under the control of one pressure device installed in one nozzle, making compound eject into mold hole in one mold via one gate channel from the nozzle; separating nozzle and mold when the compound in gate channel is cured; moving mold to another workstation to make compound in mold hole cured, in the same time, nozzle continuing ejecting compound into another mold; and performing cleaning and unloading process when compound in mold hole is cured.
TW83111455A1994-12-091994-12-09Eject molding method of semiconductor device and device thereof
TW273036B
(en)
An apparatus and method for analyzing a process of fluid flow, an apparatus and method for analyzing an injection molding process, an injection molded product, and a production method of the injection molded product
Method for pressing a plastic which cures by means of a reaction into a mould cavity a pressing auxiliary in pill form to be used in this method and a holder composed of such material