TW266305B - - Google Patents

Info

Publication number
TW266305B
TW266305B TW083104539A TW83104539A TW266305B TW 266305 B TW266305 B TW 266305B TW 083104539 A TW083104539 A TW 083104539A TW 83104539 A TW83104539 A TW 83104539A TW 266305 B TW266305 B TW 266305B
Authority
TW
Taiwan
Application number
TW083104539A
Original Assignee
Memc Electronic Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Memc Electronic Materials filed Critical Memc Electronic Materials
Application granted granted Critical
Publication of TW266305B publication Critical patent/TW266305B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW083104539A 1994-02-14 1994-05-19 TW266305B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/195,766 US5439523A (en) 1994-02-14 1994-02-14 Device for suppressing particle splash onto a semiconductor wafer

Publications (1)

Publication Number Publication Date
TW266305B true TW266305B (zh) 1995-12-21

Family

ID=22722715

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083104539A TW266305B (zh) 1994-02-14 1994-05-19

Country Status (2)

Country Link
US (1) US5439523A (zh)
TW (1) TW266305B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5542441A (en) 1994-08-03 1996-08-06 Yieldup International Apparatus for delivering ultra-low particle counts in semiconductor manufacturing
JP3596710B2 (ja) * 1996-09-10 2004-12-02 信越半導体株式会社 気相成長装置用サセプタ
US5765890A (en) * 1996-10-03 1998-06-16 Memc Electronic Materials, Inc. Device for transferring a semiconductor wafer
US6129048A (en) * 1998-06-30 2000-10-10 Memc Electronic Materials, Inc. Susceptor for barrel reactor
US6794662B1 (en) 2003-10-07 2004-09-21 Ibis Technology Corporation Thermosetting resin wafer-holding pin
US20080314319A1 (en) * 2007-06-19 2008-12-25 Memc Electronic Materials, Inc. Susceptor for improving throughput and reducing wafer damage
US8404049B2 (en) * 2007-12-27 2013-03-26 Memc Electronic Materials, Inc. Epitaxial barrel susceptor having improved thickness uniformity
US20100098519A1 (en) * 2008-10-17 2010-04-22 Memc Electronic Materials, Inc. Support for a semiconductor wafer in a high temperature environment
CN113020079A (zh) * 2021-03-30 2021-06-25 苏州阿洛斯环境发生器有限公司 一种定向双流体清洗方法
CN113020080A (zh) * 2021-03-30 2021-06-25 苏州阿洛斯环境发生器有限公司 一种定向线性双流体清洗方法及装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4561486A (en) * 1981-04-30 1985-12-31 Hoxan Corporation Method for fabricating polycrystalline silicon wafer
US4595222A (en) * 1984-09-28 1986-06-17 Fsi Corporation Carrier handle
US4798165A (en) * 1985-10-07 1989-01-17 Epsilon Apparatus for chemical vapor deposition using an axially symmetric gas flow
JPS63227011A (ja) * 1987-03-17 1988-09-21 Fujitsu Ltd 化学気相成長装置
US5261960A (en) * 1987-06-24 1993-11-16 Epsilon Technology, Inc. Reaction chambers for CVD systems
US5224504A (en) * 1988-05-25 1993-07-06 Semitool, Inc. Single wafer processor
JPH03151629A (ja) * 1989-11-08 1991-06-27 Matsushita Electric Ind Co Ltd 半導体薄膜製造装置及び半導体多層薄膜の製造方法
JPH03196615A (ja) * 1989-12-26 1991-08-28 Matsushita Electric Ind Co Ltd 半導体製造装置
JPH03264637A (ja) * 1990-03-13 1991-11-25 Furukawa Alum Co Ltd アルミニウム合金制振材料とその製造方法
FR2661117B1 (fr) * 1990-04-24 1994-09-30 Commissariat Energie Atomique Procede de protection de surfaces contre la contamination particulaire ambiante a l'aide d'elements soufflants.
US5298720A (en) * 1990-04-25 1994-03-29 International Business Machines Corporation Method and apparatus for contamination control in processing apparatus containing voltage driven electrode
US5110167A (en) * 1990-06-07 1992-05-05 Friend Robert N Disc handling device, method of use and package
US5269847A (en) * 1990-08-23 1993-12-14 Applied Materials, Inc. Variable rate distribution gas flow reaction chamber
US5237756A (en) * 1990-08-28 1993-08-24 Materials Research Corporation Method and apparatus for reducing particulate contamination
US5169196A (en) * 1991-06-17 1992-12-08 Safabakhsh Ali R Non-contact pick-up head
US5134963A (en) * 1991-10-28 1992-08-04 International Business Machines Corporation LPCVD reactor for high efficiency, high uniformity deposition

Also Published As

Publication number Publication date
US5439523A (en) 1995-08-08

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