TW246680B - Polyamic acid - a precursor of polyimide with high copper foil adhesivity, and preparation of polyimide/copper foil laminates - Google Patents
Polyamic acid - a precursor of polyimide with high copper foil adhesivity, and preparation of polyimide/copper foil laminatesInfo
- Publication number
- TW246680B TW246680B TW82105199A TW82105199A TW246680B TW 246680 B TW246680 B TW 246680B TW 82105199 A TW82105199 A TW 82105199A TW 82105199 A TW82105199 A TW 82105199A TW 246680 B TW246680 B TW 246680B
- Authority
- TW
- Taiwan
- Prior art keywords
- polyimide
- copper foil
- monomer
- adhesivity
- precursor
- Prior art date
Links
Abstract
A polyamic acid - precursor of polyimide with high copper foil adhesivity, which is a copolymerization product of the following monomers: (a) amino group monomer which contains imidazole functionals; (b) p-phenylene diamine monomer; (c) oxy-dianiline monomer; (d) biphenyl tetracarboxylic dianhydride monomer; (e) pyromellitic anhydride monomer; in which the molar ration between (a) and total amino group of (a+b+c) is 0.01~0.7, and the monomer (a) is selected from the following monomer group: (see claim l).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW82105199A TW246680B (en) | 1993-06-25 | 1993-06-25 | Polyamic acid - a precursor of polyimide with high copper foil adhesivity, and preparation of polyimide/copper foil laminates |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW82105199A TW246680B (en) | 1993-06-25 | 1993-06-25 | Polyamic acid - a precursor of polyimide with high copper foil adhesivity, and preparation of polyimide/copper foil laminates |
Publications (1)
Publication Number | Publication Date |
---|---|
TW246680B true TW246680B (en) | 1995-05-01 |
Family
ID=51401134
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW82105199A TW246680B (en) | 1993-06-25 | 1993-06-25 | Polyamic acid - a precursor of polyimide with high copper foil adhesivity, and preparation of polyimide/copper foil laminates |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW246680B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI549575B (en) * | 2011-09-01 | 2016-09-11 | Jx Nippon Mining & Metals Corp | Flexible printed wiring board with copper foil, copper clad laminate, flexible printed wiring board and electronic equipment |
-
1993
- 1993-06-25 TW TW82105199A patent/TW246680B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI549575B (en) * | 2011-09-01 | 2016-09-11 | Jx Nippon Mining & Metals Corp | Flexible printed wiring board with copper foil, copper clad laminate, flexible printed wiring board and electronic equipment |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4A | Expiration of patent term of an invention patent |