TW246680B - Polyamic acid - a precursor of polyimide with high copper foil adhesivity, and preparation of polyimide/copper foil laminates - Google Patents

Polyamic acid - a precursor of polyimide with high copper foil adhesivity, and preparation of polyimide/copper foil laminates

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Publication number
TW246680B
TW246680B TW82105199A TW82105199A TW246680B TW 246680 B TW246680 B TW 246680B TW 82105199 A TW82105199 A TW 82105199A TW 82105199 A TW82105199 A TW 82105199A TW 246680 B TW246680 B TW 246680B
Authority
TW
Taiwan
Prior art keywords
polyimide
copper foil
monomer
adhesivity
precursor
Prior art date
Application number
TW82105199A
Other languages
Chinese (zh)
Inventor
Hann-Long Chen
Syh-Ming Her
Tzong-Shyong Wang
Jin-Pyng Pan
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW82105199A priority Critical patent/TW246680B/en
Application granted granted Critical
Publication of TW246680B publication Critical patent/TW246680B/en

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Abstract

A polyamic acid - precursor of polyimide with high copper foil adhesivity, which is a copolymerization product of the following monomers: (a) amino group monomer which contains imidazole functionals; (b) p-phenylene diamine monomer; (c) oxy-dianiline monomer; (d) biphenyl tetracarboxylic dianhydride monomer; (e) pyromellitic anhydride monomer; in which the molar ration between (a) and total amino group of (a+b+c) is 0.01~0.7, and the monomer (a) is selected from the following monomer group: (see claim l).
TW82105199A 1993-06-25 1993-06-25 Polyamic acid - a precursor of polyimide with high copper foil adhesivity, and preparation of polyimide/copper foil laminates TW246680B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW82105199A TW246680B (en) 1993-06-25 1993-06-25 Polyamic acid - a precursor of polyimide with high copper foil adhesivity, and preparation of polyimide/copper foil laminates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW82105199A TW246680B (en) 1993-06-25 1993-06-25 Polyamic acid - a precursor of polyimide with high copper foil adhesivity, and preparation of polyimide/copper foil laminates

Publications (1)

Publication Number Publication Date
TW246680B true TW246680B (en) 1995-05-01

Family

ID=51401134

Family Applications (1)

Application Number Title Priority Date Filing Date
TW82105199A TW246680B (en) 1993-06-25 1993-06-25 Polyamic acid - a precursor of polyimide with high copper foil adhesivity, and preparation of polyimide/copper foil laminates

Country Status (1)

Country Link
TW (1) TW246680B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI549575B (en) * 2011-09-01 2016-09-11 Jx Nippon Mining & Metals Corp Flexible printed wiring board with copper foil, copper clad laminate, flexible printed wiring board and electronic equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI549575B (en) * 2011-09-01 2016-09-11 Jx Nippon Mining & Metals Corp Flexible printed wiring board with copper foil, copper clad laminate, flexible printed wiring board and electronic equipment

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