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H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
H10W90/00—Package configurations
H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL