TW239898B - - Google Patents
Info
- Publication number
- TW239898B TW239898B TW082101538A TW82101538A TW239898B TW 239898 B TW239898 B TW 239898B TW 082101538 A TW082101538 A TW 082101538A TW 82101538 A TW82101538 A TW 82101538A TW 239898 B TW239898 B TW 239898B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H10W76/48—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07843735 US5195299B1 (en) | 1992-02-28 | 1992-02-28 | Method of reducing moisture content of hermetic packages containing semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW239898B true TW239898B (index.php) | 1995-02-01 |
Family
ID=25290873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW082101538A TW239898B (index.php) | 1992-02-28 | 1993-03-02 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5195299B1 (index.php) |
| AU (1) | AU3776293A (index.php) |
| MX (1) | MX9301072A (index.php) |
| TW (1) | TW239898B (index.php) |
| WO (1) | WO1993016921A1 (index.php) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5371178A (en) * | 1990-10-24 | 1994-12-06 | Johnson Matthey Inc. | Rapidly curing adhesive and method |
| US5386000A (en) * | 1990-10-24 | 1995-01-31 | Johnson Matthey Inc. | Low temperature flexible die attach adhesive and articles using same |
| US5250600A (en) * | 1992-05-28 | 1993-10-05 | Johnson Matthey Inc. | Low temperature flexible die attach adhesive and articles using same |
| US5524422A (en) * | 1992-02-28 | 1996-06-11 | Johnson Matthey Inc. | Materials with low moisture outgassing properties and method of reducing moisture content of hermetic packages containing semiconductor devices |
| US5504374A (en) * | 1994-02-14 | 1996-04-02 | Lsi Logic Corporation | Microcircuit package assembly utilizing large size die and low temperature curing organic die attach material |
| US5708129A (en) * | 1995-04-28 | 1998-01-13 | Johnson Matthey, Inc. | Die attach adhesive with reduced resin bleed |
| US5783621A (en) * | 1996-06-10 | 1998-07-21 | Johnson Matthey, Inc. | Method of decreasing bleed fom organic-based formulations and anti-bleed compositions |
| US6462108B1 (en) | 2000-07-20 | 2002-10-08 | National Starch And Chemical Investment Holding Corporation | High Tg potting compound |
| US20060113683A1 (en) * | 2004-09-07 | 2006-06-01 | Nancy Dean | Doped alloys for electrical interconnects, methods of production and uses thereof |
| US20070138442A1 (en) * | 2005-12-19 | 2007-06-21 | Weiser Martin W | Modified and doped solder alloys for electrical interconnects, methods of production and uses thereof |
| US10333062B2 (en) * | 2015-10-16 | 2019-06-25 | Tokyo Electron Limited | Substrate liquid processing method, substrate liquid processing apparatus, and storage medium |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1743167A (en) * | 1923-12-29 | 1930-01-14 | Westinghouse Electric & Mfg Co | Method of and means for providing inert atmospheres |
| US2895270A (en) * | 1955-11-14 | 1959-07-21 | Minnesota Mining & Mfg | Packaging material |
| US3586926A (en) * | 1967-11-30 | 1971-06-22 | Nippon Electric Co | Hermetically sealed semiconductor device with absorptive agent |
| US4280885A (en) * | 1979-11-09 | 1981-07-28 | Savery James W | Method of and apparatus for active electro-chemical water and similar environmental contaminant elimination in semi-conductor and other electronic and electrical devices and the like |
| FR2489350A1 (fr) * | 1980-09-02 | 1982-03-05 | Corona Peintures | Procede et composition pour le revetement multi-couches en mouille/mouille de surfaces electro-conductrices |
| US5150195A (en) * | 1990-10-24 | 1992-09-22 | Johnson Matthey Inc. | Rapid-curing adhesive formulation for semiconductor devices |
| US5114003A (en) * | 1991-03-28 | 1992-05-19 | E. I. Du Pont De Nemours And Company | Tablet vial with desiccant in bottom |
-
1992
- 1992-02-28 US US07843735 patent/US5195299B1/en not_active Expired - Lifetime
-
1993
- 1993-02-25 WO PCT/US1993/001623 patent/WO1993016921A1/en not_active Ceased
- 1993-02-25 AU AU37762/93A patent/AU3776293A/en not_active Abandoned
- 1993-02-26 MX MX9301072A patent/MX9301072A/es unknown
- 1993-03-02 TW TW082101538A patent/TW239898B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| US5195299A (en) | 1993-03-23 |
| AU3776293A (en) | 1993-09-13 |
| MX9301072A (es) | 1993-11-01 |
| WO1993016921A1 (en) | 1993-09-02 |
| US5195299B1 (en) | 1996-02-13 |