TW236718B - - Google Patents
Info
- Publication number
- TW236718B TW236718B TW83103533A TW83103533A TW236718B TW 236718 B TW236718 B TW 236718B TW 83103533 A TW83103533 A TW 83103533A TW 83103533 A TW83103533 A TW 83103533A TW 236718 B TW236718 B TW 236718B
- Authority
- TW
- Taiwan
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW83103533A TW236718B (de) | 1994-04-21 | 1994-04-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW83103533A TW236718B (de) | 1994-04-21 | 1994-04-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW236718B true TW236718B (de) | 1994-12-21 |
Family
ID=51349053
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW83103533A TW236718B (de) | 1994-04-21 | 1994-04-21 |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW236718B (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7816750B2 (en) | 2007-07-24 | 2010-10-19 | Aptina Imaging Corporation | Thin semiconductor die packages and associated systems and methods |
US10074599B2 (en) | 2007-07-24 | 2018-09-11 | Micron Technology, Inc. | Semiconductor dies with recesses, associated leadframes, and associated systems and methods |
-
1994
- 1994-04-21 TW TW83103533A patent/TW236718B/zh active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7816750B2 (en) | 2007-07-24 | 2010-10-19 | Aptina Imaging Corporation | Thin semiconductor die packages and associated systems and methods |
US10074599B2 (en) | 2007-07-24 | 2018-09-11 | Micron Technology, Inc. | Semiconductor dies with recesses, associated leadframes, and associated systems and methods |
US10431531B2 (en) | 2007-07-24 | 2019-10-01 | Micron Technology, Inc. | Semiconductor dies with recesses, associated leadframes, and associated systems and methods |